新型无铅钎料合金的设计，性能得到改善

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI:10.1109/ISEE.1995.514970

M. Mccormack, S. Jin, G. Kammlott

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引用次数: 15

摘要

本文的研究目标是确定熔点接近或低于近共晶40Pb-60Sn焊料(熔点为183/spl℃)的无铅合金，并使其具有最佳的力学性能。通过控制合金的显微组织，我们获得了显著改善的力学性能。本文讨论了三种具有优异力学性能的合金:1)熔点为/spl sim/216/spl℃的Sn-3.5%Ag-1%Zn-0.5%Cu合金，2)熔点为/spl sim/187/spl℃的Sn-8%Zn-5%In-(0.1-0.5%)Ag合金，3)熔点为/spl sim/140/spl℃的54.5%Bi-45%Sn-0.5%Ag合金。

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The design of new, Pb-free solder alloys with improved properties

The goal of the research presented in this paper is to identify Pb-free alloys with melting temperatures close to or lower than that of the near-eutectic 40Pb-60Sn solder (melting point of 183/spl deg/C), and that with the best mechanical properties. We have obtained substantially improved mechanical properties through manipulation of alloy microstructures. The following three alloys with superior mechanical properties are discussed: i) Sn-3.5%Ag-1%Zn-0.5%Cu with a melting point of /spl sim/216/spl deg/C, ii) Sn-8%Zn-5%In-(0.1-0.5%)Ag with a melting point of /spl sim/187/spl deg/C, and iii) 54.5%Bi-45%Sn-0.5%Ag with a melting point of /spl sim/140/spl deg/C.

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Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)

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