2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)最新文献_第2页

Die-to-package coupling extraction for fan-out wafer-level-packaging 用于扇形圆片级封装的模到封装耦合提取

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI: 10.1109/EDAPS.2017.8277047

Yarui Peng, D. Petranovic, S. Lim

{"title":"Die-to-package coupling extraction for fan-out wafer-level-packaging","authors":"Yarui Peng, D. Petranovic, S. Lim","doi":"10.1109/EDAPS.2017.8277047","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8277047","url":null,"abstract":"In fan-out wafer-level-packaging, the package interconnection layers are fabricated similar to the back-end-of-line interconnect stack where multiple dies are tightly integrated with dense package routing for higher performance and lower power. However, electrical and magnetic field interactions may introduce significant uncertainties in system power and performance. For the first time, we provide two CAD flows for extracting coupling capacitance between the die and package. In particular, we first analyse the E-field interactions using field solvers and demonstrate their impacts on die-to-package coupling. We then propose a holistic extraction flow which integrates all layers from the chip and package and extracts all coupling elements for the maximum accuracy. We also propose an in-context extraction flow for chip designers, which only includes necessary regions of the redistribution layer and still captures the E-field impact from the package. Our in-context extraction requires less computing resources, allows heterogeneous integration, and is still highly accurate compared with the holistic extraction. Final, we demonstrate our flow using detailed package and multi-chip layout.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116576475","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Reconstruction of sparse radiation sources above a finite ground plane 有限地平面上稀疏辐射源的重建

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI: 10.1109/EDAPS.2017.8276970

Chaofeng Li, Huapeng Zhao, Z. Chen, Jun Hu

{"title":"Reconstruction of sparse radiation sources above a finite ground plane","authors":"Chaofeng Li, Huapeng Zhao, Z. Chen, Jun Hu","doi":"10.1109/EDAPS.2017.8276970","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8276970","url":null,"abstract":"The reconstruction of sparse radiation sources above a finite ground plane is important for the equivalent modeling of radiators such as slot antennas, printed circuit boards and slotted shields. Existing methods usually assume the infinitely large ground plane which is not realistically realizable and the results are not practically accurate since they ignore the edge diffraction effect of a realistic ground plane. In this paper, a finite ground plane is considered and its edge diffraction effect is modeled by the uniform theory of diffraction (UTD). A matrix equation relating sources with near fields is derived with the UTD and the half space Green's function approach. By solving the matrix equation, the radiation sources can be reconstructed from the near fields. In order to improve the efficiency and accuracy, the sparse source reconstruction is developed to solve the matrix equation. Different from existing methods, the proposed method considers the edge diffraction effect and applies the sparseness of the sources when solving the inverse problem. Therefore, it is more efficient and accurate than existing methods. Numerical results are presented to validate the effectiveness of the proposed method.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129033050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Electrothermal co-simulation of a two-chip power delivery network in frequency domain 双芯片供电网络的频域电热联合仿真

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI: 10.1109/EDAPS.2017.8277000

Na Li, J. Mao, Wensheng Zhao, M. Tang, W. Yin

引用次数: 0

Circuit interpretation and perturbative analysis of differential-to-common mode conversion due to bend discontinuities 弯曲不连续引起的微分到共模转换的电路解释和微扰分析

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI: 10.1109/EDAPS.2017.8276966

Xinglong Wu, F. Grassi, S. Pignari, P. Manfredi, D. Vande Ginste

引用次数: 1

A remote monitoring system of temperature and humidity based on OneNet cloud service platform 基于OneNet云服务平台的温湿度远程监测系统

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI: 10.1109/EDAPS.2017.8277059

Jingyi Du, Jinbao Guo, Dandan Xu, Qiong Huang

{"title":"A remote monitoring system of temperature and humidity based on OneNet cloud service platform","authors":"Jingyi Du, Jinbao Guo, Dandan Xu, Qiong Huang","doi":"10.1109/EDAPS.2017.8277059","DOIUrl":"https://doi.org/10.1109/EDAPS.2017.8277059","url":null,"abstract":"As the development of economic and technology, Internet of Things (IOT) has become an important part of strategic emerging industries, this paper takes into account, small equipment, large coverage area, network data security, low power consumption and so on, A remote monitoring system of temperature and humidity based on OneNet cloud service platform is proposed. The STM32F103RCT6 of ARM Cortex-M3 kernel is adopted as the main controller, SIM800C communication module based on authorized frequency band GSM/GPRS cellular communication technology is used, Combining digital temperature and humidity sensor SHT20, real-time and accurate data acquisition is achieved. At the same time, data is uploaded to the Internet of things OneNet cloud service platform through the EDP protocol. Equipped with WEB services and terminals APP can look at temperature, humidity and power voltage data at anytime, anywhere on the computer, mobile phones and other mobile devices. In order to make users obtain the threshold data information in time, the development adds the trigger function in the cloud server, it makes the product more convenient and intelligent.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121616248","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Analytical solutions of temperature distributions based on fourier series for wafer level heterogeneous integrations 基于傅立叶级数的晶圆级非均质集成温度分布解析解

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI: 10.1109/EDAPS.2017.8276936

Wen-Wu Ruan, Cheng-rui Zhang, Liang Zhou, J. Mao

引用次数: 1

Trapping and gate leakage currents effects in large signal modeling of microwave GaN HEMTs 微波GaN hemt大信号建模中的捕获和栅极漏电流效应

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI: 10.1109/EDAPS.2017.8276948

Shuman Mao, Yuehang Xu, Xi Chen, R. Xu, Yongbo Chen, Nengwu Gao

引用次数: 1

Modeling hybrid EM-circuit system with wave equation-based discontinuous Galerkin time domain method 基于波动方程的间断伽辽金时域方法建模混合电磁电路系统

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI: 10.1109/EDAPS.2017.8277015

Cheng-Yi Tian, Peng Wang, Yan Shi

引用次数: 2

CMOS 90 nm multi-bias transistor model Up to 66 GHz CMOS 90纳米多偏置晶体管模型高达66 GHz

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI: 10.1109/EDAPS.2017.8276926

Yunqiu Wu, Shili Cong, Chenxi Zhao, Huihua Liu, K. Kang

引用次数: 4

Electrical modeling and analysis of polymer-cavity through-silicon vias 硅通孔聚合物腔的电学建模与分析

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI: 10.1109/EDAPS.2017.8277011

Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Qijun Lu, Xiangkun Yin, Yang Liu

引用次数: 0