2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

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2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - 最新文献

Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth memory (HBM)

Pub Date : 2017-12-16 DOI: 10.1109/EDAPS.2017.8277051 Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Gapyeol Park, Subin Kim, Kyungjune Son, Sumin Choi, Joungho Kim

Study on a Poisson's equation solver based on deep learning technique

Pub Date : 2017-12-15 DOI: 10.1109/EDAPS.2017.8277017 Tao Shan, Wei Tang, Xunwang Dang, Maokun Li, Fan Yang, Shenheng Xu, Ji Wu

A package-level driver amplifier with 134% relative bandwidth

Pub Date : 2017-12-01 DOI: 10.1109/EDAPS.2017.8276978 Dong Chen, Zhao Xing, Zhilin Chen, Chenxi Zhao, Huihua Liu, K. Kang

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