基于傅立叶级数的晶圆级非均质集成温度分布解析解

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI:10.1109/EDAPS.2017.8276936

Wen-Wu Ruan, Cheng-rui Zhang, Liang Zhou, J. Mao

{"title":"基于傅立叶级数的晶圆级非均质集成温度分布解析解","authors":"Wen-Wu Ruan, Cheng-rui Zhang, Liang Zhou, J. Mao","doi":"10.1109/EDAPS.2017.8276936","DOIUrl":null,"url":null,"abstract":"This paper established a general heat model of a multi-layer packaging. By using analytical solutions based on Fourier series, we were able to capture the temperature distributions of a realistic packages. We then fabricated photosensitive BCB based power MMICs packages and tested the temperature distributions. The fabrication process are given in detail. we were able to accurately calculate the temperature distributions of the power MMICs packages. Calculated, simulated and measured results show close correlations. This research will be useful in thermal management for further 3 dimensional packaging.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Analytical solutions of temperature distributions based on fourier series for wafer level heterogeneous integrations\",\"authors\":\"Wen-Wu Ruan, Cheng-rui Zhang, Liang Zhou, J. Mao\",\"doi\":\"10.1109/EDAPS.2017.8276936\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper established a general heat model of a multi-layer packaging. By using analytical solutions based on Fourier series, we were able to capture the temperature distributions of a realistic packages. We then fabricated photosensitive BCB based power MMICs packages and tested the temperature distributions. The fabrication process are given in detail. we were able to accurately calculate the temperature distributions of the power MMICs packages. Calculated, simulated and measured results show close correlations. This research will be useful in thermal management for further 3 dimensional packaging.\",\"PeriodicalId\":329279,\"journal\":{\"name\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"volume\":\"85 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2017.8276936\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2017.8276936","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

本文建立了多层封装的一般热模型。利用基于傅里叶级数的解析解，我们能够捕捉到实际封装的温度分布。然后，我们制作了基于光敏BCB的功率mmic封装，并测试了温度分布。详细介绍了其制作工艺。我们能够准确地计算出功率mmic封装的温度分布。计算、模拟和实测结果均显示出密切的相关性。这项研究将有助于进一步三维封装的热管理。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Analytical solutions of temperature distributions based on fourier series for wafer level heterogeneous integrations

This paper established a general heat model of a multi-layer packaging. By using analytical solutions based on Fourier series, we were able to capture the temperature distributions of a realistic packages. We then fabricated photosensitive BCB based power MMICs packages and tested the temperature distributions. The fabrication process are given in detail. we were able to accurately calculate the temperature distributions of the power MMICs packages. Calculated, simulated and measured results show close correlations. This research will be useful in thermal management for further 3 dimensional packaging.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

自引率

0.00%

发文量