2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)最新文献

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Study of the impact of board orientation on radiated emissions due to common-mode currents on attached cables 研究电路板方向对附加电缆共模电流辐射发射的影响
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571595
M. Sørensen, T. Hubing, K. Jensen
{"title":"Study of the impact of board orientation on radiated emissions due to common-mode currents on attached cables","authors":"M. Sørensen, T. Hubing, K. Jensen","doi":"10.1109/ISEMC.2016.7571595","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571595","url":null,"abstract":"Common-mode current on attached cables is a typical source for radiated emission. Several models have been made for conversion of the intended differential signal to unwanted common-mode current on cables. In this paper we refine a method for identifying the radiation sources arising from a long microstrip. This method is used to show that the radiated emission from a PCB with attached cable(s) caused by a long trace depends on whether the trace is facing up or down with different result for voltage and current sources.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"260 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115814774","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Eye diagram estimation of 8B/10B encoded high-speed serial link for signal integrity test using silicone rubber socket 眼图估计8B/10B编码高速串行链路的信号完整性测试使用硅橡胶插座
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571693
Junyong Park, Jonghoon J. Kim, Heegon Kim, Joungho Kim, Michael Bae, Dongho Ha
{"title":"Eye diagram estimation of 8B/10B encoded high-speed serial link for signal integrity test using silicone rubber socket","authors":"Junyong Park, Jonghoon J. Kim, Heegon Kim, Joungho Kim, Michael Bae, Dongho Ha","doi":"10.1109/ISEMC.2016.7571693","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571693","url":null,"abstract":"In this paper, an eye diagram of the 8B/10B encoded signal is estimated by using the single bit response (SBR) of a silicone rubber socket. The 8B/10B encoding scheme has been used in the HDMI. Because the eye diagram heavily depends on the bit patterns, the encoded PRBS patterns should be considered when the resultant eye diagram is obtained. Likewise, the 8B/10B encoding scheme must also considered when the eye diagram is estimated. An eye diagram estimation method finds the worst contour of the eye diagram using partial information. This can be done in significantly reduced testing time by using a SBR, as opposed to all of PRBS patterns. In high-speed IC tests, the ICs are interconnected with an automated test environment (ATE) by test sockets. Since the resultant eye diagram consists of 8B/10B encoded signal, the eye diagram should be estimated considering the encoding scheme. This paper considers the mapping scheme of Lattice RD 1012. In conclusion, the eye diagram of the 8B/10B encoded signal by Lattice RD 1012 is estimated using the SBR of the silicone rubber socket under the various compression effect. The estimated eye diagram and simulated eye diagram of the encoded PBRS patterns are nearly identical. Therefore, the proposed eye diagram estimation including the conventional 8B/10B encoding scheme is verified by comparing with that of PRBS patterns.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115844808","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Surface charging simulations of an Orion-like spacecraft in a geosynchronous space plasma 地球同步空间等离子体中类猎户座航天器的表面充电模拟
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571631
B. Neufeld
{"title":"Surface charging simulations of an Orion-like spacecraft in a geosynchronous space plasma","authors":"B. Neufeld","doi":"10.1109/ISEMC.2016.7571631","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571631","url":null,"abstract":"Surface charging in a space plasma environment is a critical safety issue for many space vehicles. This is particularly true for vehicles that spend time in geosynchronous altitudes. We present results on surface charging for an Orion-like spacecraft in a geosynchronous plasma environment, examining sensitivities to material input parameters and sunlight illumination scenarios. Our surface charging simulation is performed using the Nascap-2k spacecraft charging software suite. In our approach, we have created and implemented EMA3D software tools that enable the user to generate Nascap-2k objects for simulation from an external CAD platform, resulting in realistic geometries with reduced development time. We demonstrate our geometry development techniques and present results on differential voltages between adjacent surfaces, normal surface E-fields, voltage to plasma, and numerical stability of our simulations.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130234840","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Numerical study of SAR for multi-component orthopaedic hip replacement system during MRI 多组份骨科髋关节置换术系统磁共振成像SAR的数值研究
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571625
Jianfeng Zheng, Dawei Li, Ji Chen, W. Kainz
{"title":"Numerical study of SAR for multi-component orthopaedic hip replacement system during MRI","authors":"Jianfeng Zheng, Dawei Li, Ji Chen, W. Kainz","doi":"10.1109/ISEMC.2016.7571625","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571625","url":null,"abstract":"In this study we present numerical simulations of the Specific Absorption Rate (SAR) for multi-component orthopaedic hip replacement systems. The SAR is used to evaluate the radio frequency (RF)-induced heating of the devices during magnetic resonance imaging (MRI). Because multi-component orthopaedic hip replacement systems have many combinations of components with various designs and sizes, it is computationally intensive, and almost impossible, to evaluate the SAR and the corresponding temperature rise for each possible combination and configuration. In this study, an effective searching strategy and a computational simulation model are developed to evaluate the factors associated with induced SAR in the tissue near an orthopaedic hip replacement system, and to find the “worst case” peak SAR for all possible combinations. The finite-difference time-domain (FDTD) was used to calculate the peak SAR for a typical hip replacement system inside the American Society for Testing and Materials (ASTM) phantom for both 1.5 Tesla (T) and 3T MRI systems. The results indicate that the stem and screw lengths are the most important factors influencing the peak SAR for both field strengths, 1.5T/64 MHz and 3T/128 MHz, respectively. The peak 1 gram averaged SAR reaches 216 W/kg and 103 W/kg for 64 MHz and 128 MHz, respectively. We also found that shortest stems, and the longest screws, typically induce higher peak SAR.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134033795","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
A 90 dB PSRR, 4 dBm EMI resistant, NMOS-only voltage reference using zero-VT active loads 90db PSRR, 4dbm抗EMI,仅nmos参考电压,使用零vt主动负载
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571680
D. Cordova, P. Toledo, H. Klimach, S. Bampi, E. Fabris
{"title":"A 90 dB PSRR, 4 dBm EMI resistant, NMOS-only voltage reference using zero-VT active loads","authors":"D. Cordova, P. Toledo, H. Klimach, S. Bampi, E. Fabris","doi":"10.1109/ISEMC.2016.7571680","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571680","url":null,"abstract":"Electromagnetic Interference (EMI) disturbances coupled in the power supply of voltage and current references can severely degrade their performance, due to its finite Power Supply Rejection Ratio (PSRR). The design of a 90 dB PSRR, 4 dBm EMI resistant NMOS-Only Voltage Reference is herein presented. The Voltage Reference is designed based on the Zero Temperature Coefficient (ZTC) transistor point. The high-PSRR is obtained using zero-VT transistors as active loads in the open and feedback loop of the circuit. The final circuit was designed in a 130 nm CMOS process and occupies around 0.014 mm2 of silicon area while consuming just 1.15 μW. Post-layout simulations present a 206 mV of Voltage Reference with a Temperature Coefficient of 321 ppm/°C, for the temperature range from -55 to 125 °C. An EMI source of 4 dBm (1 Vpp) injected in the power supply, according to the Direct Power Injection (DPI) standard, yield in a maximum dc shift and Peak-to-peak ripple of -0.17 % and 822 μVpp, respectively.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117327201","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Analysis of radiated emissions from PCB using broadband Green's function method 用宽带格林函数法分析PCB的辐射发射
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571607
Shaowu Huang, L. Tsang, T. Liao
{"title":"Analysis of radiated emissions from PCB using broadband Green's function method","authors":"Shaowu Huang, L. Tsang, T. Liao","doi":"10.1109/ISEMC.2016.7571607","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571607","url":null,"abstract":"In this paper, we present the application of broadband Green's function with low wavenumber extraction (BBGFL) to fast modeling of the radiated emissions from power structures of printed circuit boards (PCBs) for electromagnetic interference/compatibility (EMI/EMC) analysis. We use the BBGFL to compute the Green's function over broadband frequencies along the boundary walls of arbitrarily shaped power/ground planes. The broadband Green's function is based on modal expansions with low wavenumber extraction. Because the modal expressions are independent of frequencies, they are computed once and used for all frequencies. Then the radiated fields are readily derived from the fields on boundary walls using the equivalent principle. The accuracy and computational efficiency of the present method are compared with the method of moment (MoM) and commercial tool HFSS. The results of radiated emission of BBGFL are in good agreement with MoM and HFSS. But the method of BBGFL is several hundred times faster than direct MoM and HFSS for broadband simulations.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115363978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A wideband common-mode suppression filter using enhanced coupled defected ground structure 一种采用增强耦合缺陷接地结构的宽带共模抑制滤波器
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571750
D. Lin, Yi-Hsien Lee
{"title":"A wideband common-mode suppression filter using enhanced coupled defected ground structure","authors":"D. Lin, Yi-Hsien Lee","doi":"10.1109/ISEMC.2016.7571750","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571750","url":null,"abstract":"In this paper, we propose a wideband common-mode suppression filter for high-speed differential signals. The proposed design is realized by using only two enhanced coupled C-shaped defected ground structures (DGSs) with a long bridge to achieve the wideband common-mode noise suppression. The equivalent circuit model of two coupled LC resonators is also established with good agreement to the full-wave simulation and measurement results. A sample board is designed and fabricated on a printed circuit board (PCB) with FR4 substrate. It is proved that the differential-mode insertion loss is within -3 dB from DC to 12 GHz. Common-mode noise can be reduced over 10 dB from 3.7 GHz to 10.8 GHz in the frequency domain, and approximately 42% of amplitude in the time domain. Moreover, the fractional bandwidth of the stopband can reach 98%, and the filter size is only 0.3 λg × 0.3 λg, where λg is the wavelength of the stopband central frequency. To our knowledge, this is the first common-mode filter using an enhanced coupled mechanism for the high-speed signals to extend the stopband, and it is also a simple geometric structure with the largest fractional bandwidth and the most compact size on a PCB.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116041572","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Theoretical analysis of BCI test system using circuit concept approach 用电路概念方法对BCI测试系统进行理论分析
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571716
K. Murano, N. Takata, Misaki Hoshino, Y. Kami, F. Xiao, M. Tayarani
{"title":"Theoretical analysis of BCI test system using circuit concept approach","authors":"K. Murano, N. Takata, Misaki Hoshino, Y. Kami, F. Xiao, M. Tayarani","doi":"10.1109/ISEMC.2016.7571716","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571716","url":null,"abstract":"In a bulk current injection test (BCI test), an electric current is injected into a wire harness connected to an electronic equipment. Since this test setup can be considered as a transmission line exposed to an external electromagnetic field, the relation of the line voltage and current is expressed by a modified telegrapher's equation. This paper reveals an analytical method of the BCI-test system using the circuit concept approach, and its effectiveness is experimentally verif ed. Furthermore, the difference between the susceptibility of transmission line exposed to the plane-EM field and that under the BCI test is shown as an example.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116451719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Bandwidth improvement technique for an edge mount SMA launch structure in multilayer boards 多层板边缘贴装SMA发射结构的带宽改进技术
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571664
C. Hwang, Muqi Ouyang, J. Fan
{"title":"Bandwidth improvement technique for an edge mount SMA launch structure in multilayer boards","authors":"C. Hwang, Muqi Ouyang, J. Fan","doi":"10.1109/ISEMC.2016.7571664","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571664","url":null,"abstract":"A technique to improve the bandwidth of an edge mount SMA launch structure in multilayer boards is proposed. The edge mount SMA launch structure is widely used in fixtures and calibration boards for high-speed serial links, but can suffer from return-path discontinuities in multilayer boards, resulting in bandwidth limitation. The discontinuities in the edge mount SMA launch structure deteriorate the signal transmission quality at high frequencies. An edge mount SMA launch structure is investigated based on a waveguide analysis and relevant analytical equation. In addition, a simple method to mitigate the discontinuity due to the wave propagation into the waveguide structures formed by the multiple return planes in a multilayer board is proposed by using an edge plating technique and validated through numerical simulations.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"47 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120871550","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Induced disturbances by high voltage transmission lines on nearby stationary vehicles 高压输电线路对附近静止车辆的干扰
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571662
S. Ladan, A. Aghabarati, R. Moini, S. Fortin, F. Dawalibi
{"title":"Induced disturbances by high voltage transmission lines on nearby stationary vehicles","authors":"S. Ladan, A. Aghabarati, R. Moini, S. Fortin, F. Dawalibi","doi":"10.1109/ISEMC.2016.7571662","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571662","url":null,"abstract":"This article discusses the safety issues related to electrostatic discharge phenomena caused by electric field induction from high voltage transmission lines. The main objective is to evaluate the inducing effects of an overhead line including towers and grounding networks on a nearby vehicle. Two different cases are considered. The first case studies the network under steady-state conditions while the second case treats a tower subjected to a single phase to ground fault. In both cases the induced current discharged from the vehicle to the ground is evaluated in order to define a severity index that is used to determine the location of the unsafe zones around the tower structure.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124465571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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