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Handbook of 3D Integration最新文献

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Design and CAD Solutions for Cooling and Power Delivery for Monolithic 3D‐ICs 为单片3D集成电路提供冷却和供电的设计和CAD解决方案
Handbook of 3D Integration Pub Date : 2019-04-01 DOI: 10.1002/9783527697052.CH6
S. Samal, S. Lim
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引用次数: 0
Electronic Design Automation for 3D 3D电子设计自动化
Handbook of 3D Integration Pub Date : 2019-04-01 DOI: 10.1002/9783527697052.CH7
P. Franzon
{"title":"Electronic Design Automation for\u0000 3D","authors":"P. Franzon","doi":"10.1002/9783527697052.CH7","DOIUrl":"https://doi.org/10.1002/9783527697052.CH7","url":null,"abstract":"","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133601486","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Physical Design Flow for 3D /CoWoS® Stacked IC s 3D / cocos®堆叠IC的物理设计流程
Handbook of 3D Integration Pub Date : 2019-04-01 DOI: 10.1002/9783527697052.CH5
Yu-Shiang Lin, S. Goel, J. Yuan, Tom Chen, Frank J. C. Lee
{"title":"Physical Design Flow for\u0000 3D\u0000 /CoWoS® Stacked\u0000 IC\u0000 s","authors":"Yu-Shiang Lin, S. Goel, J. Yuan, Tom Chen, Frank J. C. Lee","doi":"10.1002/9783527697052.CH5","DOIUrl":"https://doi.org/10.1002/9783527697052.CH5","url":null,"abstract":"","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127586630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Power Delivery Network and Integrity in 3D ‐ IC Chips 3D - IC芯片中的电力输送网络和完整性
Handbook of 3D Integration Pub Date : 2019-04-01 DOI: 10.1002/9783527697052.CH3
M. Nagata
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引用次数: 0
Thermal Modeling and Model Validation for 3D Stacked ICs 三维堆叠集成电路的热建模与模型验证
Handbook of 3D Integration Pub Date : 2019-04-01 DOI: 10.1002/9783527697052.CH18
H. Oprins, F. Maggioni, V. Cherman, G. V. D. Plas, E. Beyne
{"title":"Thermal Modeling and Model Validation for\u0000 3D\u0000 Stacked\u0000 ICs","authors":"H. Oprins, F. Maggioni, V. Cherman, G. V. D. Plas, E. Beyne","doi":"10.1002/9783527697052.CH18","DOIUrl":"https://doi.org/10.1002/9783527697052.CH18","url":null,"abstract":"","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130678560","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
3D Design Styles 3D设计风格
Handbook of 3D Integration Pub Date : 2019-04-01 DOI: 10.1002/9783527697052.CH1
P. Franzon
{"title":"3D\u0000 Design Styles","authors":"P. Franzon","doi":"10.1002/9783527697052.CH1","DOIUrl":"https://doi.org/10.1002/9783527697052.CH1","url":null,"abstract":"","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130478618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Interconnect Testing for 2.5D ‐ and 3D‐SICs 2.5D‐和3D‐物理互连测试
Handbook of 3D Integration Pub Date : 2019-04-01 DOI: 10.1002/9783527697052.CH10
Shi-Yu Huang
{"title":"Interconnect Testing for\u0000 2.5D\u0000 ‐ and\u0000 3D‐SICs","authors":"Shi-Yu Huang","doi":"10.1002/9783527697052.CH10","DOIUrl":"https://doi.org/10.1002/9783527697052.CH10","url":null,"abstract":"","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131810075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System 异构三维集成系统设计中的多物理场挑战与解决方案
Handbook of 3D Integration Pub Date : 2019-04-01 DOI: 10.1002/9783527697052.CH4
Alexander Steinhardt, D. Papaioannou, A. Heinig, P. Schneider
{"title":"Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System","authors":"Alexander Steinhardt, D. Papaioannou, A. Heinig, P. Schneider","doi":"10.1002/9783527697052.CH4","DOIUrl":"https://doi.org/10.1002/9783527697052.CH4","url":null,"abstract":"","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127908032","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Cost Modeling for 2.5D and 3D Stacked ICs 2.5D和3D堆叠ic的成本建模
Handbook of 3D Integration Pub Date : 2019-02-08 DOI: 10.1002/9783527697052.CH9
M. Taouil, S. Hamdioui, E. Marinissen
{"title":"Cost Modeling for 2.5D and 3D Stacked ICs","authors":"M. Taouil, S. Hamdioui, E. Marinissen","doi":"10.1002/9783527697052.CH9","DOIUrl":"https://doi.org/10.1002/9783527697052.CH9","url":null,"abstract":"This chapter discusses cost modeling for 2.5D/3D‐stacked integrated circuits (2.5D/3D‐SICs) and presents a tool that considers all costs involved in the whole production chain, including design, manufacturing, test, packaging, and logistics. The tool provides the estimated overall cost for 2.5D/3D‐SICs and its cost breakdown for a given input parameter set consisting of test flows, die yield, stack yield, etc. The chapter defines test flows and highlights the importance of testing. In order to determine the most cost‐effective test flow, test requirements should be specified. However, taking only the test cost into consideration is not sufficient to provide a fair evaluation and/or comparison; a test flow does not only impact test cost but also design and manufacturing cost. The chapter defines and classifies the different costs involved in designing and manufacturing 2.5D/3D‐SICs. It also presents the 3D‐COSTAR cost model. It shows the crucial importance of 3D‐COSTAR by analyzing trade‐offs for several test optimization problems.","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"262 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113984963","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Pre‐Bond Testing Through Direct Probing of Large‐Array Fine‐Pitch Micro‐Bumps* 通过直接探测大阵列细间距微凸点的键合前测试*
Handbook of 3D Integration Pub Date : 2019-02-08 DOI: 10.1002/9783527697052.CH11
E. Marinissen, B. D. Wachter, Jorg Kiesewetter, Ken Smith
{"title":"Pre‐Bond Testing Through Direct Probing of Large‐Array Fine‐Pitch Micro‐Bumps*","authors":"E. Marinissen, B. D. Wachter, Jorg Kiesewetter, Ken Smith","doi":"10.1002/9783527697052.CH11","DOIUrl":"https://doi.org/10.1002/9783527697052.CH11","url":null,"abstract":"In order to obtain acceptable compound stack yields for 2.5D‐ and 3D‐stacked integrated circuits (SICs), there is a need to test the constituting dies before stacking. The non‐bottom dies of these stacks have their functional access exclusively through large arrays of fine‐pitch micro‐bumps, which are too dense for conventional probe technology. A common approach to obtain pre‐bond test access is to equip these dies with dedicated pre‐bond probe pads, which comes with drawbacks such as increased silicon area and test application time and reduced interconnect performance. In order to avoid the many drawbacks of dedicated pre‐bond probe pads, we advocate the usage of advanced probe technology that allows to directly probe on these micro‐bumps. This chapter reports on the technical feasibility of this approach. The economical feasibility is addressed in Chapter 9.","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131425212","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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