{"title":"3D - IC芯片中的电力输送网络和完整性","authors":"M. Nagata","doi":"10.1002/9783527697052.CH3","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Power Delivery Network and Integrity in\\n 3D\\n ‐\\n IC\\n Chips\",\"authors\":\"M. Nagata\",\"doi\":\"10.1002/9783527697052.CH3\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":323630,\"journal\":{\"name\":\"Handbook of 3D Integration\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Handbook of 3D Integration\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1002/9783527697052.CH3\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Handbook of 3D Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/9783527697052.CH3","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}