H. Oprins, F. Maggioni, V. Cherman, G. V. D. Plas, E. Beyne
{"title":"Thermal Modeling and Model Validation for\n 3D\n Stacked\n ICs","authors":"H. Oprins, F. Maggioni, V. Cherman, G. V. D. Plas, E. Beyne","doi":"10.1002/9783527697052.CH18","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Handbook of 3D Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/9783527697052.CH18","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}