{"title":"Power Delivery Network and Integrity in\n 3D\n ‐\n IC\n Chips","authors":"M. Nagata","doi":"10.1002/9783527697052.CH3","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":323630,"journal":{"name":"Handbook of 3D Integration","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Handbook of 3D Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/9783527697052.CH3","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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