2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of最新文献_第3页

Philips AVE entertainment policy on sustainability and environmental stewardship 飞利浦AVE娱乐政策的可持续发展和环境管理

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI: 10.1109/AGEC.2004.1290856

G. Woo

引用次数: 0

Properties and reliability of SnZn-Based lead-free solder alloys snzn基无铅钎料合金的性能和可靠性

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI: 10.1109/AGEC.2004.1290861

J. Villain, W. Jillck, E. Schmitt, T. Qasim

{"title":"Properties and reliability of SnZn-Based lead-free solder alloys","authors":"J. Villain, W. Jillck, E. Schmitt, T. Qasim","doi":"10.1109/AGEC.2004.1290861","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290861","url":null,"abstract":"In green electronics, e.g. hybrids and MEMS (micro electromechanical systems) tin-lead-solder materials are substituted by lead-free solder materials. Several alloys could be used, for example SnCu, SnCuAg, or SnBi alloys, depending on the product and the working temperature. range between 205-216 /spl deg/C. Using tin-zinc solder materials the needed heat is smaller, electronic components will not be overheated and a high compatibility of all manufacturing processes could be assumed. On the other hand early reports in the literature indicate a sensitivity to intercrystalline corrosion. This work deals with the handling and the reliability of the eutectic Sn91Zn9 and the Sn89Zn8Bi3 alloy. The pad metallization of the substrate was Cu/Ni/Au or Cu and the metallization of the used electronic components was Sn, NiPd and Sn96.5Ag3.5. Shear tests before and after thermal cycling, creep tests at high homologous temperatures, metallographic investigations and migration tests were done after soldering to determine the reliability of these solder joints. A Sn60Pb40 solder alloy was used as a reference. The used solder profiles of a vapour-phase and a convective reflow soldering lead to good wettability of the liquid solder The solder joints show a higher shear force than the tin-lead alloy and the decrease of the shear force due to thermal cycles was lower than the tin-lead solder joints. The tin-zinc-alloy shows a higher creep resistance and a lower migration behaviour than the tin-lead alloy.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115587102","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Laser induced writing of conductive copper lines for electronic devices 电子器件用导电铜线的激光诱导写入

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI: 10.1109/AGEC.2004.1290896

W. Wang, M. Seufert, A. Lenhart, W. Jillek

引用次数: 1

Scalable distributed architecture of the terabit router 太比特路由器的可扩展分布式架构

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI: 10.1109/AGEC.2004.1290899

Fan Li-jun, Quan Cheng-bin, Luan Gui-xing

引用次数: 0

Life cycle thinking for green electronics: basics in ecodesign and the UNEP/SETAC life cycle initiative 绿色电子产品的生命周期思考:生态设计和UNEP/SETAC生命周期倡议的基础知识

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI: 10.1109/AGEC.2004.1290903

Jutta Mueller, H. Griese, K. Schischke, kina Stobbe, Helias Gregory A. Norris’, A. U. D. Haes

{"title":"Life cycle thinking for green electronics: basics in ecodesign and the UNEP/SETAC life cycle initiative","authors":"Jutta Mueller, H. Griese, K. Schischke, kina Stobbe, Helias Gregory A. Norris’, A. U. D. Haes","doi":"10.1109/AGEC.2004.1290903","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290903","url":null,"abstract":"Transferring life cycle thinking into business practice requires applicable assessment tools and management approaches. Different methods from screening eco design tools to full Life Cycle Assessment have been developed for fostering environmentally compatible electronics design. Life Cycle Assessment still deals with many obstacles, limiting its integration into electronics design workflows. The paper describes the state of the art for eco design in electronics and potential improvements for life cycle thinking to be achieved by a global initiative: launched in April 2002 the Life Cycle Initiative of UNEP (United Nations Environmental Programme) and SETAC (Society of Environmental Toxicology and Chemistry) builds on the ISO 14040 standards and intends to establish approaches with best practice for a Life Cycle Economy. The paper presents the current status of this initiative, and possibilities to join the initiative. BeCAP (Berlin Center for Advanced Packaging) is engaged in the initiative and provides within this paper the perspective of electronics manufacturing with regard to the UNEP/SETAC Life Cycle Initiative. The specific needs of the electronics sector regarding life cycle thinking and LCA will be discussed. As a case study for screening assessments an evaluation of a multifunctional chip card is presented, referring to end-of-life scenarios.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122269826","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist 用干膜光刻胶在聚四氟乙烯印刷电路板上形成细间距焊料凸点

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI: 10.1109/AGEC.2004.1290883

Jung-Sub Lee, Kun-Mo Chu, Hyo-Hoon Park, D. Jeon

引用次数: 0

Standby power challenge 待机电源挑战

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI: 10.1109/AGEC.2004.1290867

L. McGarry

引用次数: 51

Quality challenges of reused components 重用组件的质量挑战

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI: 10.1109/AGEC.2004.1290906

I. Stobbe, H. Potter, H. Griese, G. Fotheringham, H. Reichl

{"title":"Quality challenges of reused components","authors":"I. Stobbe, H. Potter, H. Griese, G. Fotheringham, H. Reichl","doi":"10.1109/AGEC.2004.1290906","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290906","url":null,"abstract":"For the End-of-Life treatment of electronic products the option of reusing electronic parts and boards are of high interest. Among the reasons for doing this are not only legal regulations, but also economical and environmentally motivated reasons. The economic point of view covers advantages as well as limits which are in most cases related to the quality of the worked-off parts. This paper presents as an example, the disassembly of printed wiring boards at the automated BeCAP pilot line. The analysis of the characteristic and limiting properties for re-assembling, for example, the form tolerances, the wettability and presence of remaining solder, will be described. A reason for decreasing wettability can be the opening of the intermetallic phases during the desoldering process, which requires the re-tinning of the components. One of the other worrying weak points is the popcorning of the packages. This paper is interesting for companies from industry and consultancy which are correlated with assembly and reuse of electronic parts and the test of the parts quality regarding to the ability for re-assembly. It shows some of the crucial points of disassembling processes of printed wiring boards, which should be taken into account, if high quality disassembly processes are planned.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"137 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116270881","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Novel epoxy/BaTiO/sub 3/ composite embedded capacitor films embedded in organic substrates 新型环氧/BaTiO/sub - 3/复合嵌埋电容器薄膜

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI: 10.1109/AGEC.2004.1290869

K. Paik, Sung-Dong Cho, Jni-Gul Hyun

{"title":"Novel epoxy/BaTiO/sub 3/ composite embedded capacitor films embedded in organic substrates","authors":"K. Paik, Sung-Dong Cho, Jni-Gul Hyun","doi":"10.1109/AGEC.2004.1290869","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290869","url":null,"abstract":"Embedded passive technology is an essential technology for further miniaturization and higher performance of electronic package systems. Polymer/ceramic composites have been of great interest as embedded capacitor materials, because they did combine not only the processability of polymers with high dielectric constant of ceramics but also good compatibility with printed circuit boards (PCBs). Novel embedded capacitor films (ECFs) were newly designed for low tolerance embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of specially formulated epoxy resin and latent curing agent. And in terms of coating process, a comma roll coating method is used for uniform film thickness in large area. In this paper, it is demonstrated that low tolerance (less than 5%) capacitor can be fabricated using ECFs, and properties of epoxy/BaTiO/sub 3/ composite ECFs are reported. Fabrication process and various properties of ECFs such as dielectric constant, leakage current, adhesion strength, thereto-mechanical characteristics, reliability, and high frequency behavior up to 3 GHz will be presented.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129816271","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Manufacturability and reliability of lead-free package 无铅封装的可制造性和可靠性

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI: 10.1109/AGEC.2004.1290881

A. Sriyarunya

{"title":"Manufacturability and reliability of lead-free package","authors":"A. Sriyarunya","doi":"10.1109/AGEC.2004.1290881","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290881","url":null,"abstract":"The European Community has been finalized to phase out on July 1,2006 for Lead(Pb) in electronic products. This cause the semiconductor industry is required to study new materials for replace the lead in its products. This paper presents the manufacturability and reliability study of the commercial lead-free alternatives to replace the currently used solder plating. This paper presents the findings of a series of experiment to evaluate various commercial lead-free plating alternatives, including tin and tin-bismuth products. The 2 different IC package types (Gull wing and J-Bend) were used in both off line and in a production environment to evaluate plating quality on solderability aspects including plating thickness, composition, ionic impurity, morphology grade, solderability (tested after a variety of thermal & humidity conditioning parameters), wettability and lead pull tests of surface mounted packages (using different reflow profiles - both NEMI and JEDEC recommended), and tin whisker growth. Since no lead-free plating standards of quality were available at the time of the study, normal solder plating standards were used as a reference. Tin and tin-bismuth plating were further investigated in production processes to attempt to eliminate the initial quality issues, and to develop, fine-tune and optimize the plating process, through a manufacturability study and reliability study. Tin plating looked the most promising material. Tin whisker growth is a major reliability problem when Pb-free deposits are implemented. This paper also presents some of the tin whisker mechanistic studies undertaken on one of the Pb-free chemistries tested.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127677899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2