用干膜光刻胶在聚四氟乙烯印刷电路板上形成细间距焊料凸点

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI:10.1109/AGEC.2004.1290883

Jung-Sub Lee, Kun-Mo Chu, Hyo-Hoon Park, D. Jeon

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引用次数: 0

摘要

我们展示了干膜光刻胶(DFR)在聚四氟乙烯(PTFE/Teflon/spl reg/)印刷电路板(PCB)上的光刻工艺中的适用性。在聚四氟乙烯试验板上形成宽度为100/spl亩/米、厚度为18/spl亩/米的铜线，并在100-200/spl亩/米范围内改变两条铜线之间的间隙。采用热轧复合机对厚度为15/spl mu/m的DFRs进行复合，通过改变复合温度(100 ~ 150/spl℃)和复合速度进行复合。找到了在聚四氟乙烯(PTFE)印制电路板上贴合DFR的最佳工艺，并完成了铟焊料凸点的形成。最佳层合温度为150℃/spl℃，层合速度为0.63cm/s。铟焊点的最小尺寸为直径50/spl mu/m，节距100/spl mu/m。

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Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist

We demonstrated the applicability of dry film photoresists (DFR) in photolithography process for fine pitch bumping on the polytetrafluoroethylene (PTFE/Teflon/spl reg/) printed circuit board (PCB). The copper lines were formed with 100/spl mu/m width and 18/spl mu/m thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200/spl mu/m. The DFRs of 15/spl mu/m thickness were laminated by hot roll laminator, by varying laminating temperature from 100/spl deg/C to 150/spl deg/C and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of 150/spl deg/C and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50/spl mu/m with pitch of 100/spl mu/m.

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2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of

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