Novel epoxy/BaTiO/sub 3/ composite embedded capacitor films embedded in organic substrates

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI:10.1109/AGEC.2004.1290869

K. Paik, Sung-Dong Cho, Jni-Gul Hyun

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引用次数: 7

Abstract

Embedded passive technology is an essential technology for further miniaturization and higher performance of electronic package systems. Polymer/ceramic composites have been of great interest as embedded capacitor materials, because they did combine not only the processability of polymers with high dielectric constant of ceramics but also good compatibility with printed circuit boards (PCBs). Novel embedded capacitor films (ECFs) were newly designed for low tolerance embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of specially formulated epoxy resin and latent curing agent. And in terms of coating process, a comma roll coating method is used for uniform film thickness in large area. In this paper, it is demonstrated that low tolerance (less than 5%) capacitor can be fabricated using ECFs, and properties of epoxy/BaTiO/sub 3/ composite ECFs are reported. Fabrication process and various properties of ECFs such as dielectric constant, leakage current, adhesion strength, thereto-mechanical characteristics, reliability, and high frequency behavior up to 3 GHz will be presented.

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新型环氧/BaTiO/sub - 3/复合嵌埋电容器薄膜

嵌入式无源技术是电子封装系统进一步小型化和提高性能的关键技术。聚合物/陶瓷复合材料不仅具有聚合物的可加工性和陶瓷的高介电常数，而且与印刷电路板(pcb)具有良好的兼容性，因此作为嵌入式电容器材料备受关注。为制备低容差有机衬底嵌入式电容器，设计了新型嵌入式电容器薄膜。在材料配方方面，ECFs由特殊配方的环氧树脂和潜在固化剂组成。在涂布工艺上，采用逗号辊涂布法，大面积涂膜厚度均匀。本文论证了用ECFs制备低容差(小于5%)电容器的可行性，并报道了环氧树脂/BaTiO/sub - 3/复合ECFs的性能。将介绍ECFs的制造工艺和各种性能，如介电常数、泄漏电流、粘附强度、其机械特性、可靠性和高达3ghz的高频行为。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of

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