Properties and reliability of SnZn-Based lead-free solder alloys

2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Pub Date : 2004-09-27 DOI:10.1109/AGEC.2004.1290861

J. Villain, W. Jillck, E. Schmitt, T. Qasim

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引用次数: 10

Abstract

In green electronics, e.g. hybrids and MEMS (micro electromechanical systems) tin-lead-solder materials are substituted by lead-free solder materials. Several alloys could be used, for example SnCu, SnCuAg, or SnBi alloys, depending on the product and the working temperature. range between 205-216 /spl deg/C. Using tin-zinc solder materials the needed heat is smaller, electronic components will not be overheated and a high compatibility of all manufacturing processes could be assumed. On the other hand early reports in the literature indicate a sensitivity to intercrystalline corrosion. This work deals with the handling and the reliability of the eutectic Sn91Zn9 and the Sn89Zn8Bi3 alloy. The pad metallization of the substrate was Cu/Ni/Au or Cu and the metallization of the used electronic components was Sn, NiPd and Sn96.5Ag3.5. Shear tests before and after thermal cycling, creep tests at high homologous temperatures, metallographic investigations and migration tests were done after soldering to determine the reliability of these solder joints. A Sn60Pb40 solder alloy was used as a reference. The used solder profiles of a vapour-phase and a convective reflow soldering lead to good wettability of the liquid solder The solder joints show a higher shear force than the tin-lead alloy and the decrease of the shear force due to thermal cycles was lower than the tin-lead solder joints. The tin-zinc-alloy shows a higher creep resistance and a lower migration behaviour than the tin-lead alloy.

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snzn基无铅钎料合金的性能和可靠性

在绿色电子产品中，例如混合动力车和微机电系统，锡铅焊料材料被无铅焊料材料所取代。根据产品和工作温度的不同，可以使用几种合金，例如SnCu、SnCuAg或SnBi合金。范围在205-216 /spl℃之间。使用锡锌焊料材料所需的热量更小，电子元件不会过热，并且可以假设所有制造工艺的高兼容性。另一方面，文献中的早期报告表明对晶间腐蚀的敏感性。本文研究了共晶Sn91Zn9和Sn89Zn8Bi3合金的处理及可靠性问题。衬底金属化为Cu/Ni/Au或Cu，电子元件金属化为Sn、NiPd和Sn96.5Ag3.5。通过热循环前后的剪切试验、高温蠕变试验、金相研究和焊接后的迁移试验来确定这些焊点的可靠性。以Sn60Pb40焊料合金为参考。采用气相焊和对流回流焊两种焊料形式，焊料具有良好的润湿性，焊点的剪切力比锡铅合金高，热循环对剪切力的影响比锡铅合金小。与锡铅合金相比，锡锌合金具有更高的抗蠕变性能和更低的迁移行为。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of

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