2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第3页

Impact of circuit load on the ageing mode of VDMOS chips using 3D FEM electro-thermal modelling 采用三维有限元电热模型研究电路负载对VDMOS芯片老化模式的影响

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529957

E. Marcault, J. Massol, P. Tounsi, J. Dorkel

引用次数: 0

Influence of nonlinear intermolecular forces on the harmonic behavior of NEM resonators 非线性分子间力对NEM谐振器谐波行为的影响

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529974

M. Zanaty, R. Jansen, V. Rochus, M. Abbas, A. Witvrouw, H. Tilmans, X. Rottenberg

引用次数: 2

Mechanical behavior of flexible silicon devices curved in spherical configurations 弯曲成球形的柔性硅器件的力学行为

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529978

K. Tékaya, M. Fendler, Karim Inal, Elisabeth Massoni, H. Ribot

{"title":"Mechanical behavior of flexible silicon devices curved in spherical configurations","authors":"K. Tékaya, M. Fendler, Karim Inal, Elisabeth Massoni, H. Ribot","doi":"10.1109/EUROSIME.2013.6529978","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529978","url":null,"abstract":"Foldable, stretchable and flexible electronics is of constant increasing interest since the early 2000's. Its applications spread from OLED-based displays, bio-inspired detectors and “epidermal electronics”. Cylindrical curvature is largely studied through many 3 points and 4 points bending variations in electronic devices. However spherical curvature is poorly addressed, especially for monolithic approach. In this paper, a simulation and experiments of the elastic deformation of a thin silicon chip on a spherical holder are presented. The holder can have a concave or a convex shape. The chip is a square of 10 by 10 mm2. Its thickness is 50, 25 or 15 μm. The simulation is performed in 3 steps. First, the use of a shell model is validated by a convergence study and by a comparison with a 3D model and the literature. Then, the influence of the anisotropic elastic behavior (single crystal) is considered. In a given bulge test condition, isotropic and anisotropic silicon simulation gave similar deformations. At the end, the spherical forming is accomplished with a shell model and an anisotropic law. Experimental data is obtained by curving thin silicon plates of various thicknesses on different radii holders in a press. The comparison between experimental and computed results is realized. We found similar macroscopic deformations for both concave and convex shapes. The influence of chip thickness and applied pressure is studied on characteristic folds and flat part amplitudes. A heterogeneous stress distribution with hundreds of MPa variations can explain the difference observed between curved chips and perfect spherical holders. The stress level in electrical and optical active layers of thin curved silicon-based devices may affect their properties. A numerical example on a bolometer gives a stress-induced resistivity variation over 10%.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117110370","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

An integrated thermal management solution for flat-type solar photovoltaic modules 平板型太阳能光伏组件的集成热管理解决方案

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529993

P. Rodgers, V. Eveloy

{"title":"An integrated thermal management solution for flat-type solar photovoltaic modules","authors":"P. Rodgers, V. Eveloy","doi":"10.1109/EUROSIME.2013.6529993","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529993","url":null,"abstract":"Solar photovoltaics (PV) are employed for a range of distributed power generation applications in the oil and gas industry. However, despite unprecedented solar irradiation levels in the Arabian Gulf, such installations incur significant power output losses in hot and dusty (i.e., desert) ambient conditions. In this study, a prototype PV module electrical performance enhancement solution is designed, constructed and experimentally characterized that combines active thermal management and sun-tracking to reduce PV cell operating temperature while enhancing solar irradiation absorption. Both steady-state and dynamic cooling conditions are investigated to compare the effectiveness of continuous and intermittent water-cooling. Water cooling a stationary PV module using unchilled water (35-40°C) is found to be at least as effective as sun-tracking a passively-cooled module in terms of power output. Chilled water-cooling (7-20°C) produces improvements in peak electrical power output of up to 40% depending on seasonal and daily conditions, relative to passively-cooled stationary operation. In addition, dynamic (i.e., intermittent) water-cooling is sufficient to maintain high PV module electrical output.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116112072","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14

Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing 电迁移测试中接触几何变化对IC封装寿命分布的影响

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529895

L. Meinshausen, K. Weide-Zaage, H. Frémont

{"title":"Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing","authors":"L. Meinshausen, K. Weide-Zaage, H. Frémont","doi":"10.1109/EUROSIME.2013.6529895","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529895","url":null,"abstract":"Two main trends in IC packaging are the progress in integration on package level (e.g. System in Package) and the use of ICs under harsh environmental conditions e.g. in sensors for intelligent actuators. The second task often requires very low failure rates below 1ppm. To clarify the reasons for the existing lifetime distribution during reliability tests, the influence of geometry variations on the lifetime of solder joints is investigated. The dimensions of 339 solder contacts for Package-on-Package systems were measured. The resulting mean values and the standard deviations were used to design a FEM model of Package-on-Package solder joints. The FEM model was used for the simulation of electromigration reliability tests. The mass flux and the mass flux divergences due to electromigration were investigated. As a range of variation, three standard deviations were chosen, so that 99.73% of all possible solder contacts will be covered by this investigation. Finally, the simulation results of the parameter study were compared with the results of the physical electromigration lifetime tests.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"156 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123402170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

On the crack and delamination risk optimization of a Si-interposer for LED packaging LED封装用硅中间层的裂纹与分层风险优化研究

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1016/j.microrel.2014.02.018

J. Auersperg, R. Dudek, R. Jordan, O. Bochow-Neß, S. Rzepka, B. Michel

引用次数: 7

Dealing with IC package material and design uncertainties using FUZZY finite elements 用模糊有限元法处理集成电路封装材料和设计的不确定性

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529924

B. Vandevelde, I. Konstantinou, D. Moens, D. Vandepitte

引用次数: 2

Remote phosphor deposition on LED arrays with pre-encapsulated silicone lens 用预封装硅透镜在LED阵列上远程沉积荧光粉

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529893

J. Lo, H. Liu, S. Lee, X. Guo, H. Zhao

{"title":"Remote phosphor deposition on LED arrays with pre-encapsulated silicone lens","authors":"J. Lo, H. Liu, S. Lee, X. Guo, H. Zhao","doi":"10.1109/EUROSIME.2013.6529893","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529893","url":null,"abstract":"Phosphor converted LED is one of the commonly used components in solid state luminaires. Among the packaging processes involved, phosphor deposition is a critical step, which controls the overall optical performance of LEDs. There are several phosphor deposition methods, among which disperse dispensing and conformal coating methods are widely used. In these two methods, phosphor materials are applied directly on top of the LED chip. The phosphor materials are heated up by the LED chip during the operation. The behavior of phosphor materials highly depends on their temperature. The emission efficiency decreases as temperature increases. High phosphor temperature may also introduce reliability problems. The situation can be improved by adopting a remote phosphor method. Some high power LEDs packages utilize silicone lens to increase the light extraction efficiency. It is difficult to apply a remote phosphor layer on the convex surface using a regular dispensing process. In this paper, an innovative remote phosphor deposition method is proposed for the packages with silicone lens. Phosphor slurry is dispensed directly on the silicone lens specially designed with a step. It flows and spreads on the dome, and stops when it reaches the edge of the step. The unique step feature stops the phosphor slurry from overflowing. The thickness of the remote phosphor layer can be easily adjusted by changing the dispensing volume. This dispensing method increases the throughput and reduces the processing cost.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116436420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Advanced mixed-mode bending test Experimental-numerical characterization of the critical energy release rate Gc including Mixed-Mode-Angle Ψ in interfaces under independent external loads 独立外载荷作用下界面临界能量释放率Gc(含混模角Ψ)的实验-数值表征

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529932

M. Schulz, M. Springborn, J. Keller, B. Michel, B. Wunderle

引用次数: 3

FEM simulations of back contact solar modules during temperature cycling 温度循环过程中背接触太阳能组件的有限元模拟

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529964

F. Kraemer, S. Wiese

{"title":"FEM simulations of back contact solar modules during temperature cycling","authors":"F. Kraemer, S. Wiese","doi":"10.1109/EUROSIME.2013.6529964","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529964","url":null,"abstract":"This paper is focused on the reliability performance of novel back contact solar modules. Tn this study the mechanical integrity of the interconnect structures of back contact modules is analyzed by FEM-simulations. The solar module lifetime is limited by mechanical stresses which arise from temperature cycles. These temperature cycles are caused by day to night shifts. The reliability of photovoltaic modules under these load conditions is tested by the IEC standard 61215. The according temperature profile is created for the FEM simulations and tested with the novel back contact solar modules. A classic module assembly applying H-patterned cells is taken as reference case. The result evaluation shows high localized stresses in the interconnection structures of both module assemblies. However, these localized stresses do not cause ultimate cracks of the interconnection structures and thus may help to reduce the stress in adjacent sections of the assembly. The goal of the study is to compare the mechanical behavior of these two types of photovoltaic modules. The results of this investigation figure out, where are critical structural elements in the photovoltaic modules.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"498 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126116532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1