2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

Modeling of mixed-mode delamination by cohesive zone method 用内聚带法模拟混合模式分层

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-06-13 DOI: 10.1109/EUROSIME.2013.6529986

Bingbing Zhang, Daoguo Yang, L. Ernst, H. Pape

{"title":"Modeling of mixed-mode delamination by cohesive zone method","authors":"Bingbing Zhang, Daoguo Yang, L. Ernst, H. Pape","doi":"10.1109/EUROSIME.2013.6529986","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529986","url":null,"abstract":"Cohesive zone modeling of interface delamination requires proper values of the critical energy release rate of the interfaces being under investigation. In general, these values have been obtained thru dedicated delamination experiments. In cohesive zone modeling a complication to deal with is the fact that the critical energy release rate is not just a single value. Instead, it is a function of the socalled mode-mixity, a parameter depending from the ration between shear stress and tensile stress near the crack front. Most of the standard FEM packages include one or more types of cohesive zone elements, but generally, a mode-mix dependency cannot be specified. This might hinder a proper usage of cohesive zones in FEM modeling of microelectronic components. Therefore, the suitability of various FEM packages to deal with mixed mode delamination through cohesive zone modeling should be explored. The present paper describes such an exploration using the ANSYS package. Various mixed mode delamination experiments have been modeled using an available mixed mode cohesive zone model. The results are compared to the experimental results.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130939120","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Reliability modeling analysis of a power module 某电源模块可靠性建模分析

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529930

Yan Liu, Yangjian Xu, Y. Liu

{"title":"Reliability modeling analysis of a power module","authors":"Yan Liu, Yangjian Xu, Y. Liu","doi":"10.1109/EUROSIME.2013.6529930","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529930","url":null,"abstract":"Life prediction of solder die attachment in an automotive power module was studied. Both the energy-based method and the creep-strain-based method were examined and discussed through numerical analysis. Meanwhile, different material constitutive relations for die attach were investigated. For the energy-based life prediction method, Darveaux's fatigue prediction model was implemented to calculate the thermal cycles for crack initiation and propagation, based on the inelastic strain energy density accumulated per cycle during thermal cycling. At the same time, the effective strain method based on creep mechanism was used for comparison with the results from energy-based method. In the implementation of the effective strain method, a FORTRAN subroutine of material constitutive model were developed to couple with the finite element simulation software ANSYS®. In addition, the solder joint fatigue life of low-temperature sintered Nano-silver material was simulated by using both methods. Finally, various solder die attachments with different thicknesses were studied and their fatigue lives were further predicted by effective strain method.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123116059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Finite element analysis of fatigue cracks formation in power metallisation of a semiconductor device subjected to active cycling 主动循环作用下半导体器件功率金属化疲劳裂纹形成的有限元分析

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529951

G. Kravchenko, B. Karunamurthy, M. Nelhiebel, H. Pettermann

引用次数: 9

Novel reliability assessment concept based on an accelerated de-rated strength approach 基于加速退化强度法的可靠性评估新概念

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529983

E. Veninga, R. Kregting, A. E. Van der Waal, A. Gielen

{"title":"Novel reliability assessment concept based on an accelerated de-rated strength approach","authors":"E. Veninga, R. Kregting, A. E. Van der Waal, A. Gielen","doi":"10.1109/EUROSIME.2013.6529983","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529983","url":null,"abstract":"The introduction of new materials or technologies can have an enormous impact on the Time to Market (TTM) of new products. Preferably, the performance of new materials or technologies is known before these are designed into a product. This paper presents a reliability assessment approach which has been developed with the aim to reduce the so called Time to Technology (TTT). The method which is based on an accelerated de-rated strength approach has been expanded to a concept which could also include health monitoring and prognostics during lifetime. In this part of the work a combination of modelling and statistical techniques was used to explore the feasibility and potential of the concept. Ball Grid Array (BGA) designs were used as a vehicle with solder fatigue as the selected failure mechanism. Finite Element Modelling (FEM) together with Design of Experiments (DoE) revealed that the (package) substrate thickness, stand-off, (package) substrate size and the final solder ball diameter are the statistical significant factors with respect to fatigue life of SnAgCu BGA balls. Simplified linear models obtained from regression analyses were used to design de-rated strength variants and estimate test times. Simulations using a strain based lifetime model of Engelmaier together with a Monte Carlo method were used to generate lifetime distributions based on induced variations. A statistical analysis showed a significant difference in lifetime performance between the simulated de-rated strength designs.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125948204","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

VACNT fabrication on aluminum using “fast-heating” thermal CVD 利用“快速加热”热CVD技术在铝上制备真空真空元件

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529955

Zhaoli Gao, M. Yuen

引用次数: 0

Strength analysis of advanced node BEOL under CPI induced stresses 超前节点BEOL在CPI诱导应力下的强度分析

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529985

B. Debecker, K. Vanstreels, M. Gonzalez, B. Vandevelde, Z. Tokei

引用次数: 3

Comparative analysis of the thermal resistance profiles of power light-emitting diodes cree and rebel types 功率发光二极管cree型和rebel型热阻曲线的比较分析

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529922

A. L. Zakgeim, A. Chernyakov, A. Vaskou, V. Kononenko, V. Niss

引用次数: 3

Toolbox for visco-elastic material modeling of smart lightweight structures 智能轻量化结构粘弹性材料建模工具箱

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529953

S. Rzepka, R. Pantou, F. Bormann, B. Bramer, I. Brabandt, B. Michel

引用次数: 1

Molecular dynamics simulations for mechanical characterization of CNT/gold interface and its bonding strength 碳纳米管/金界面力学表征及其键合强度的分子动力学模拟

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529903

S. Hartmann, O. Holck, B. Wunderle

{"title":"Molecular dynamics simulations for mechanical characterization of CNT/gold interface and its bonding strength","authors":"S. Hartmann, O. Holck, B. Wunderle","doi":"10.1109/EUROSIME.2013.6529903","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529903","url":null,"abstract":"CNT/metal interfaces under mechanical loads are investigated using molecular dynamics by simulating pull-out tests of single walled carbon nanotubes (CNTs) emdedded in single crystal gold lattices. As a result of our simulations we present obtained force-displacement data. We investigated the influence of two different Lennard Jones (LJ) coefficients pairs, two CNT types and three lattice directions of the gold matrix with respect to the embedding direction. Additionally we incorporated structural defects into our model and report on their influence. The change of the CNT type leads to a change in the maximum pull-out force. Here we attribute this to the change in CNT diameter, where a bigger diameter entails an increased maximum pull-out force. Changing the LJ coefficient pair has a strong impact on the maximum pull-out forces, where a higher bonding energy results in a higher maximum pull-out force. Defects also show a positive effect on the maximum pull-out force. The presented results have impact on bonding strength of CNT/metal interfaces.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"140 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129024878","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Resistance electric filed dependence simulation of piezoresistive silicon pressure sensor and improvement by shield layer 压阻式硅压力传感器电阻场依赖性仿真及屏蔽层改进

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI: 10.1109/EUROSIME.2013.6529926

Gang Cao, Chaojun Liu, Xiaogang Liu, Xuefang Wang, Sheng Liu

引用次数: 2