功率发光二极管cree型和rebel型热阻曲线的比较分析

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1109/EUROSIME.2013.6529922

A. L. Zakgeim, A. Chernyakov, A. Vaskou, V. Kononenko, V. Niss

{"title":"功率发光二极管cree型和rebel型热阻曲线的比较分析","authors":"A. L. Zakgeim, A. Chernyakov, A. Vaskou, V. Kononenko, V. Niss","doi":"10.1109/EUROSIME.2013.6529922","DOIUrl":null,"url":null,"abstract":"Analysis of the thermal resistance of power light-emitting diodes (LEDs) of Cree and Rebel types is developed. Components of the thermal resistance of the diodes are determined and several distinguishes between different methods are obtained. Behavior of bottleneck effect related to definite interfaces is established. The value of LED active junction area is evaluated too.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Comparative analysis of the thermal resistance profiles of power light-emitting diodes cree and rebel types\",\"authors\":\"A. L. Zakgeim, A. Chernyakov, A. Vaskou, V. Kononenko, V. Niss\",\"doi\":\"10.1109/EUROSIME.2013.6529922\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Analysis of the thermal resistance of power light-emitting diodes (LEDs) of Cree and Rebel types is developed. Components of the thermal resistance of the diodes are determined and several distinguishes between different methods are obtained. Behavior of bottleneck effect related to definite interfaces is established. The value of LED active junction area is evaluated too.\",\"PeriodicalId\":270532,\"journal\":{\"name\":\"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-04-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2013.6529922\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2013.6529922","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

对Cree型和Rebel型大功率发光二极管的热阻进行了分析。确定了二极管热阻的组成，并得出了不同方法之间的几种区别。建立了与特定界面相关的瓶颈效应行为。并对LED有源结面积的取值进行了评估。

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Comparative analysis of the thermal resistance profiles of power light-emitting diodes cree and rebel types

Analysis of the thermal resistance of power light-emitting diodes (LEDs) of Cree and Rebel types is developed. Components of the thermal resistance of the diodes are determined and several distinguishes between different methods are obtained. Behavior of bottleneck effect related to definite interfaces is established. The value of LED active junction area is evaluated too.

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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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