Reliability modeling analysis of a power module

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1109/EUROSIME.2013.6529930

Yan Liu, Yangjian Xu, Y. Liu

{"title":"Reliability modeling analysis of a power module","authors":"Yan Liu, Yangjian Xu, Y. Liu","doi":"10.1109/EUROSIME.2013.6529930","DOIUrl":null,"url":null,"abstract":"Life prediction of solder die attachment in an automotive power module was studied. Both the energy-based method and the creep-strain-based method were examined and discussed through numerical analysis. Meanwhile, different material constitutive relations for die attach were investigated. For the energy-based life prediction method, Darveaux's fatigue prediction model was implemented to calculate the thermal cycles for crack initiation and propagation, based on the inelastic strain energy density accumulated per cycle during thermal cycling. At the same time, the effective strain method based on creep mechanism was used for comparison with the results from energy-based method. In the implementation of the effective strain method, a FORTRAN subroutine of material constitutive model were developed to couple with the finite element simulation software ANSYS®. In addition, the solder joint fatigue life of low-temperature sintered Nano-silver material was simulated by using both methods. Finally, various solder die attachments with different thicknesses were studied and their fatigue lives were further predicted by effective strain method.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2013.6529930","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 8

Abstract

Life prediction of solder die attachment in an automotive power module was studied. Both the energy-based method and the creep-strain-based method were examined and discussed through numerical analysis. Meanwhile, different material constitutive relations for die attach were investigated. For the energy-based life prediction method, Darveaux's fatigue prediction model was implemented to calculate the thermal cycles for crack initiation and propagation, based on the inelastic strain energy density accumulated per cycle during thermal cycling. At the same time, the effective strain method based on creep mechanism was used for comparison with the results from energy-based method. In the implementation of the effective strain method, a FORTRAN subroutine of material constitutive model were developed to couple with the finite element simulation software ANSYS®. In addition, the solder joint fatigue life of low-temperature sintered Nano-silver material was simulated by using both methods. Finally, various solder die attachments with different thicknesses were studied and their fatigue lives were further predicted by effective strain method.

查看原文本刊更多论文

某电源模块可靠性建模分析

对某汽车电源模块焊模附件的寿命预测进行了研究。通过数值分析，对基于能量的方法和基于蠕变应变的方法进行了检验和讨论。同时，研究了模具附件不同材料的本构关系。基于能量的寿命预测方法，采用Darveaux疲劳预测模型，基于热循环过程中每循环累积的非弹性应变能密度，计算裂纹萌生和扩展的热循环;同时，采用基于蠕变机理的有效应变法与基于能量法的结果进行了比较。在有效应变法的实现中，开发了FORTRAN材料本构模型子程序，并与有限元仿真软件ANSYS®进行了耦合。此外，采用两种方法模拟了低温烧结纳米银材料的焊点疲劳寿命。最后，采用有效应变法对不同厚度的焊锡模具附着物进行了研究，并对其疲劳寿命进行了预测。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

自引率

0.00%

发文量