Advanced mixed-mode bending test Experimental-numerical characterization of the critical energy release rate Gc including Mixed-Mode-Angle Ψ in interfaces under independent external loads
M. Schulz, M. Springborn, J. Keller, B. Michel, B. Wunderle
{"title":"Advanced mixed-mode bending test Experimental-numerical characterization of the critical energy release rate Gc including Mixed-Mode-Angle Ψ in interfaces under independent external loads","authors":"M. Schulz, M. Springborn, J. Keller, B. Michel, B. Wunderle","doi":"10.1109/EUROSIME.2013.6529932","DOIUrl":null,"url":null,"abstract":"In this paper, the Advanced Mixed-Mode Bending Test (AMB) is presented. The AMB is an experimental method to determine the effects on the critical crack propagation in bi-material interfaces that exist in electronic packages. Target in the development of this test rig was a quick and cost-effective data collection in addition to easier handling of samples. By two independent load components, shearing and opening of the boundary layer, a large range of the mode-angle can be determined. The test rig is designed for bimaterial beams, which are industrially manufactured, e.g. produced through laser cutting. Another preparation of the test-specimen is not necessary. It can also be used cutouts from actual products. Thus it is possible to examine influences of the production line.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2013.6529932","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
In this paper, the Advanced Mixed-Mode Bending Test (AMB) is presented. The AMB is an experimental method to determine the effects on the critical crack propagation in bi-material interfaces that exist in electronic packages. Target in the development of this test rig was a quick and cost-effective data collection in addition to easier handling of samples. By two independent load components, shearing and opening of the boundary layer, a large range of the mode-angle can be determined. The test rig is designed for bimaterial beams, which are industrially manufactured, e.g. produced through laser cutting. Another preparation of the test-specimen is not necessary. It can also be used cutouts from actual products. Thus it is possible to examine influences of the production line.