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On the crack and delamination risk optimization of a Si-interposer for LED packaging

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1016/j.microrel.2014.02.018
J. Auersperg, R. Dudek, R. Jordan, O. Bochow-Neß, S. Rzepka, B. Michel
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引用次数: 7
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LED封装用硅中间层的裂纹与分层风险优化研究
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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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