Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test最新文献_第2页

An integrated boost converter with maximum power point tracking for solar photovoltaic energy harvesting 具有最大功率跟踪的集成升压变换器用于太阳能光伏能量收集

Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test Pub Date : 2014-04-28 DOI: 10.1109/VLSI-DAT.2014.6834888

Sung-Yao Wang, Hung-Hsien Wu, Chia-Ling Wei

引用次数: 5

Power integrity optimization on USB power distribution network for EMI reduction 降低电磁干扰的USB配电网络电源完整性优化

Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test Pub Date : 2014-04-28 DOI: 10.1109/VLSI-DAT.2014.6834919

Kuo-Chiang Hung, Tim Chen

引用次数: 1

Event-driven read-out circuits for energy-efficient sensor-SoC's 用于高能效传感器soc的事件驱动读出电路

Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test Pub Date : 2014-04-28 DOI: 10.1109/VLSI-DAT.2014.6834912

Chen-Yi Lee, Kelvin Yi-Tse Lai, S. Hsu

引用次数: 1

Assessing automotive functional safety microprocessor with ISO 26262 hardware requirements 根据ISO 26262硬件要求评估汽车功能安全微处理器

Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test Pub Date : 2014-04-28 DOI: 10.1109/VLSI-DAT.2014.6834876

Yung-Chang Chang, Li-Ren Huang, Hsing-Chuang Liu, Chih-Jen Yang, C. Chiu

{"title":"Assessing automotive functional safety microprocessor with ISO 26262 hardware requirements","authors":"Yung-Chang Chang, Li-Ren Huang, Hsing-Chuang Liu, Chih-Jen Yang, C. Chiu","doi":"10.1109/VLSI-DAT.2014.6834876","DOIUrl":"https://doi.org/10.1109/VLSI-DAT.2014.6834876","url":null,"abstract":"This paper provides a step-by-step guideline for the assessment of an automotive safety microprocessor with ISO 26262 hardware requirements. ISO 26262 part 5 - Product development at the hardware level - specifies the safety activities during the phase of the automotive hardware development. In this phase, hardware safety design is derived (from the results of ISO 26262 part 3 and 4), implemented, integrated, and tested. To prove the compliance with ISO 26262 hardware development process, quantitative evaluations on the hardware are indispensable. These quantitative evaluations are known as hardware architecture metrics and probabilistic hardware metrics. The assessment results qualify a design with an automotive safety integrity level (ASIL) which ranges from ASIL-A (lowest) to ASIL-D (highest). In this paper, we implemented an exemplary safety microprocessor to demonstrate the ISO 26262 hardware assessment process. The derivation procedures of the ASIL level from the hardware architecture metrics and probabilistic hardware metrics are fully discussed. Based on the evaluation results, we also provide design suggestions for the ISO 26262 safety hardware design.","PeriodicalId":267124,"journal":{"name":"Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test","volume":"111 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130449318","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 32

LMS-based adaptive temperature prediction scheme for proactive thermal-aware three-dimensional Network-on-Chip systems 基于lms的主动热感知三维片上网络系统自适应温度预测方案

Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test Pub Date : 2014-04-28 DOI: 10.1109/VLSI-DAT.2014.6834910

Kun-Chih Chen, Huai-Ting Li, A. Wu

{"title":"LMS-based adaptive temperature prediction scheme for proactive thermal-aware three-dimensional Network-on-Chip systems","authors":"Kun-Chih Chen, Huai-Ting Li, A. Wu","doi":"10.1109/VLSI-DAT.2014.6834910","DOIUrl":"https://doi.org/10.1109/VLSI-DAT.2014.6834910","url":null,"abstract":"The three-dimensional Network-on-Chip (3D NoC) has been proposed to solve the complex on-chip communication issues. Because of the die-stacking architecture, the thermal problem becomes more severe than in 2D NoC. To simultaneously consider the thermal safety and system performance, proactive thermal management (PDTM) has been proved as an efficient way to control the system temperature against overheat. Based on the information of predictive temperature, the PDTM can early control the system temperature. To predict the future temperature, adopting the Thermal Resistance and Capacitance (Thermal RC) model is a popular way to derive the thermal prediction scheme. However, the Thermal RC value is sensitive to temperature changes, which affect the accuracy of the future temperature estimation. Therefore, the current proactive thermal-aware NoC system still suffers from large performance impact because of imprecise future temperature estimation. In this paper, we propose an LMS-based adaptive thermal prediction (LMS-ATP) model, which can adaptively adjust the involved Thermal RC values for future temperature estimation. The experimental results show that the proposed LMS-ATP model can improve the precision of future temperature estimation by 72.96%. In addition, the system throughput can be enhanced by around 0.77% to 47.96%.","PeriodicalId":267124,"journal":{"name":"Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test","volume":"131 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133329252","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Advanced CMOS reliability challenges 先进CMOS可靠性挑战

Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test Pub Date : 2014-04-28 DOI: 10.1109/VLSI-DAT.2014.6834931

C. Prasad

引用次数: 9

Analog front-end amplifier for ECG applications with feed-forward EOS cancellation 模拟前端放大器的ECG应用与前馈EOS抵消

Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test Pub Date : 2014-04-28 DOI: 10.1109/VLSI-DAT.2014.6834895

Chih-Chan Tu, Tsung-Hsien Lin

引用次数: 7

An automatic synthesis tool for nanometer low dropout regulator using simulation based model and geometric programming 基于仿真模型和几何规划的纳米级低差稳压器自动合成工具

Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test Pub Date : 2014-04-28 DOI: 10.1109/VLSI-DAT.2014.6834871

S. Hsu, Wei-Zen Chen, Jui-Pin Zheng, Sean Shih-Ying Liu, Po-Cheng Pan, Hung-Ming Chen

引用次数: 0

Thermal challenges to building reliable embedded systems 构建可靠嵌入式系统的热挑战

Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test Pub Date : 2014-04-28 DOI: 10.1109/VLSI-DAT.2014.6834936

Zebo Peng

引用次数: 1

Skillfully diminishing antenna effect in layer assignment stage 在分层阶段巧妙地减小天线效应

Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test Pub Date : 2014-04-28 DOI: 10.1109/VLSI-DAT.2014.6834859

Chih-Chien Lin, Wen-Hao Liu, Yih-Lang Li

引用次数: 1