{"title":"构建可靠嵌入式系统的热挑战","authors":"Zebo Peng","doi":"10.1109/VLSI-DAT.2014.6834936","DOIUrl":null,"url":null,"abstract":"More and more embedded systems are used in safety-critical areas such as automotive electronics and medical applications. These safety-critical applications impose stringent requirements on reliability, performance, low-power and testability of the underlying VLSI circuits. With silicon technology scaling, however, VLSI circuits operate very often at high temperature, which has negative impact on reliability, performance, power-efficiency and testability. This paper discusses several thermal impacts on VLSI circuits and their related challenges. It presents also a few emerging techniques that take temperature into account in the design and test processes.","PeriodicalId":267124,"journal":{"name":"Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Thermal challenges to building reliable embedded systems\",\"authors\":\"Zebo Peng\",\"doi\":\"10.1109/VLSI-DAT.2014.6834936\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"More and more embedded systems are used in safety-critical areas such as automotive electronics and medical applications. These safety-critical applications impose stringent requirements on reliability, performance, low-power and testability of the underlying VLSI circuits. With silicon technology scaling, however, VLSI circuits operate very often at high temperature, which has negative impact on reliability, performance, power-efficiency and testability. This paper discusses several thermal impacts on VLSI circuits and their related challenges. It presents also a few emerging techniques that take temperature into account in the design and test processes.\",\"PeriodicalId\":267124,\"journal\":{\"name\":\"Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-04-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSI-DAT.2014.6834936\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-DAT.2014.6834936","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal challenges to building reliable embedded systems
More and more embedded systems are used in safety-critical areas such as automotive electronics and medical applications. These safety-critical applications impose stringent requirements on reliability, performance, low-power and testability of the underlying VLSI circuits. With silicon technology scaling, however, VLSI circuits operate very often at high temperature, which has negative impact on reliability, performance, power-efficiency and testability. This paper discusses several thermal impacts on VLSI circuits and their related challenges. It presents also a few emerging techniques that take temperature into account in the design and test processes.