1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)最新文献_第4页

Distortion analysis of a power heterojunction FET under low quiescent drain current for 3.5 V wide-band CDMA cellular phones 3.5 V宽带CDMA手机低静态漏极电流下功率异质结场效应管畸变分析

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI: 10.1109/MTTTWA.1999.755125

G. Hau, T. B. Nishimura, N. Iwata

引用次数: 1

Design considerations for commercial millimeter wave manufacture 商用毫米波制造的设计考虑

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI: 10.1109/MTTTWA.1999.755132

K. Danehy

引用次数: 1

Surface mount coaxial connectors for high frequency applications 用于高频应用的表面安装同轴连接器

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI: 10.1109/MTTTWA.1999.755131

B. Rosenberger

引用次数: 0

A high-speed, low-power 16-bit 0.25 /spl mu/m GaAs binary look-ahead carry (BLC) adder based on NOR gates for wireless video communication 基于NOR门的高速、低功耗16位0.25 /spl mu/m GaAs二进制前导进位(BLC)加法器，用于无线视频通信

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI: 10.1109/MTTTWA.1999.755145

T. Enomoto, A. Hirobe, T. Satoh, M. Fujii, N. Yoshida, S. Wada, M. Tokushima

引用次数: 1

LTCC-M: an enabling technology for high performance multilayer RF systems LTCC-M:高性能多层射频系统的使能技术

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI: 10.1109/MTTTWA.1999.755160

B. Geller, B. Thaler, A. Fathy, M. Liberatore, H.D. Chen, G. Ayers, V. Pendrick, Y. Narayan

{"title":"LTCC-M: an enabling technology for high performance multilayer RF systems","authors":"B. Geller, B. Thaler, A. Fathy, M. Liberatore, H.D. Chen, G. Ayers, V. Pendrick, Y. Narayan","doi":"10.1109/MTTTWA.1999.755160","DOIUrl":"https://doi.org/10.1109/MTTTWA.1999.755160","url":null,"abstract":"Over the last several years, the customer-driven wireless market has pushed the developers of RF hardware towards more functionality in less volume, operation at ever higher RF frequencies, and greater circuit and functional integration. Additionally, the pressure to reduce costs has forced designers to look at less expensive manufacturing, assembly, and testing techniques. Multilayer and multichip system integration techniques have been realized in many different formats, each with its own strengths and weaknesses. Best performance is generally obtained using hybrid technology on high temperature ceramics, while lowest cost is often achieved with several of the organic (or \"soft\") board technologies. Low temperature cofired ceramic (LTCC) technology has the potential to deliver both high performance and low cost. In its basic version, however, it suffers from two major drawbacks. First, the ceramic shrinks after firing in all three dimensions. This limits the size of the boards that can be processed, imposes limitations on embedded passive components, and introduces complexity in the processing of boards with cavities. In addition, modules requiring heat removal must have a heat spreader attached after firing. In order to address many of the problems associated with conventional LTCC technology, Sarnoff has developed an improved approach, called low temperature cofired ceramic on metal (LTCC-M), in which a specially formulated multilayer ceramic structure is attached to a metal carrier or \"core\". The ceramic firing and core attachment process occur in one and the same step. The resulting structure exhibits virtually no shrinkage in the plane of the substrate.","PeriodicalId":261988,"journal":{"name":"1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129508077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 31

LTCC technology: where we are and where we're going. II LTCC技术:我们在哪里，我们要去哪里。2

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI: 10.1109/MTTTWA.1999.755161

Charles Q Scrantom, James C Lawson, Marketing Sales Manager

{"title":"LTCC technology: where we are and where we're going. II","authors":"Charles Q Scrantom, James C Lawson, Marketing Sales Manager","doi":"10.1109/MTTTWA.1999.755161","DOIUrl":"https://doi.org/10.1109/MTTTWA.1999.755161","url":null,"abstract":"New electronic systems for automotive/industrial/medical/aerospace applications will continue to challenge both packaging engineers and technology due to the increased performance requirements, higher densities, higher temperatures and limited space available. This challenge mandates the use of unique packaging techniques such as multi-chip modules (MCM) that must not only provide the increase circuit density but also the reliability, electrical and medical performance, thermal management, and hermeticity. The interest in MCM technology has focused on different packaging technologies such as laminate, ceramic, and thin film technologies. One such ceramic technology, low temperature co-fired ceramic (LTCC) tape technology, offers significant benefits over other established packaging technologies for high RF, high density and fast digital applications that could require hermetically and good thermal management. This paper addresses the current status of LTCC technology as well as new and promising developments that could make this the leading substrate and MCM packaging technology. All market indicators are predicting tremendous growth in the MCM market.","PeriodicalId":261988,"journal":{"name":"1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116985943","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 154

GPS receiver sensitivity enhancement in wireless applications 无线应用中GPS接收机灵敏度的增强

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI: 10.1109/MTTTWA.1999.755159

S. Soliman, S. Glazko, P. Agashe

引用次数: 9

Next generation optimization methodologies for wireless and microwave circuit design 无线和微波电路设计的新一代优化方法

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI: 10.1109/MTTTWA.1999.755118

Q. Zhang

引用次数: 3

Raytheon Systems Company microwave automated factory 雷神系统公司微波自动化工厂

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI: 10.1109/MTTTWA.1999.755134

M. Stegemoller

引用次数: 0

Modelling line of sight availability for high frequency urban radio networks 高频城市无线网络的视线可用性建模

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI: 10.1109/MTTTWA.1999.755137

J. Biddiscombe

引用次数: 5