S. Consolazio, K. Nguyen, D. Bišćan, K. Vu, A. Ferek, A. Ramos
{"title":"Low temperature cofired ceramic (LTCC) for wireless applications","authors":"S. Consolazio, K. Nguyen, D. Bišćan, K. Vu, A. Ferek, A. Ramos","doi":"10.1109/MTTTWA.1999.755162","DOIUrl":"https://doi.org/10.1109/MTTTWA.1999.755162","url":null,"abstract":"This paper discusses the design and radiofrequency (RF)/microwave performance of low temperature cofired ceramic (LTCC) substrate technology for use in wireless applications. The advantages of multi-layer LTCC technology with integral embedded passives are clearly shown with wireless subsystem package designs in various formats including ball grid array (BGA) and low temperature cofired ceramic on metal (LTCC-M).","PeriodicalId":261988,"journal":{"name":"1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)","volume":"27 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126227193","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The measurement of intermodulation products on passive components and transmission lines","authors":"B. Rosenberger","doi":"10.1109/MTTTWA.1999.755129","DOIUrl":"https://doi.org/10.1109/MTTTWA.1999.755129","url":null,"abstract":"Multiple frequency carrier systems require components and transmission cables and connectors with low passive intermodulation products between the frequency channels. With the implementation of cellular private radio networks, the market and the usage of components with extreme low passive intermodulation products characteristics, has been a dramatic growth in the volume and tightened specifications. The measurement of the PIM and the verification of those measurements has created a major task for the manufactures of components, cables and connectors. This paper gives a momentary status report on the measurement activities in the industry and the work of the IEC 46 TC standardisation group.","PeriodicalId":261988,"journal":{"name":"1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133712401","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}