Low temperature cofired ceramic (LTCC) for wireless applications

1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390) Pub Date : 1900-01-01 DOI:10.1109/MTTTWA.1999.755162

S. Consolazio, K. Nguyen, D. Bišćan, K. Vu, A. Ferek, A. Ramos

引用次数: 9

Abstract

This paper discusses the design and radiofrequency (RF)/microwave performance of low temperature cofired ceramic (LTCC) substrate technology for use in wireless applications. The advantages of multi-layer LTCC technology with integral embedded passives are clearly shown with wireless subsystem package designs in various formats including ball grid array (BGA) and low temperature cofired ceramic on metal (LTCC-M).

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用于无线应用的低温共烧陶瓷(LTCC)

本文讨论了用于无线应用的低温共烧陶瓷(LTCC)衬底技术的设计和射频/微波性能。采用球栅阵列(BGA)和低温共烧金属陶瓷(LTCC- m)等多种形式的无线子系统封装设计，清晰地展示了集成嵌入式无源的多层LTCC技术的优势。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)

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