ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis最新文献

Understanding Water Ingress in Scanning Acoustic Microscopy and a Method to Observe Defects that are Open to the Surface 在扫描声学显微镜中了解水的进入和一种观察表面缺陷的方法

ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis Pub Date : 2019-12-01 DOI: 10.31399/ASM.CP.ISTFA2019P0154

Adam Benak, R. Devaney

引用次数: 1

Ultra-Thinning of Silicon for Backside Fault Isolation 用于后部故障隔离的超薄硅

ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis Pub Date : 2019-12-01 DOI: 10.31399/asm.cp.istfa2019p0465

M. Campin, P. Nowakowski, P. Fischione

引用次数: 0

A Review on Automatic Bill of Material Generation and Visual Inspection on PCBs 多氯联苯物料清单自动生成及目视检测研究进展

ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis Pub Date : 2019-12-01 DOI: 10.31399/asm.cp.istfa2019p0256

Mukhil Azhagan M. S, Dhwani Mehta, Hangwei Lu, Sudarshan Agrawal, M. Tehranipoor, D. Woodard, N. Asadizanjani, Praveen Chawla

引用次数: 18

Machine Learning Assisted Signal Analysis in Acoustic Microscopy for Non-Destructive Defect Identification 声学显微镜中无损缺陷识别的机器学习辅助信号分析

ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis Pub Date : 2019-12-01 DOI: 10.31399/asm.cp.istfa2019p0035

M. Kögel, S. Brand, F. Altmann

{"title":"Machine Learning Assisted Signal Analysis in Acoustic Microscopy for Non-Destructive Defect Identification","authors":"M. Kögel, S. Brand, F. Altmann","doi":"10.31399/asm.cp.istfa2019p0035","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2019p0035","url":null,"abstract":"\u0000 Signal processing and data interpretation in scanning acoustic microscopy is often challenging and based on the subjective decisions of the operator, making the defect classification results prone to human error. The aim of this work was to combine unsupervised and supervised machine learning techniques for feature extraction and image segmentation that allows automated classification and predictive failure analysis on scanning acoustic microscopy (SAM) data. In the first part, conspicuous signal components of the time-domain echo signals and their weighting matrices are extracted using independent component analysis. The applicability was shown by the assisted separation of signal patterns to intact and defective bumps from a dataset of a CPU-device manufactured in flip-chip technology. The high success-rate was verified by physical cross-sectioning and high-resolution imaging. In the second part, the before mentioned signal separation was employed to generate a labeled dataset for training and finetuning of a classification model based on a one-dimensional convolutional neural network. The learning model was sensitive to critical features of the given task without human intervention for classification between intact bumps, defective bumps and background. This approach was evaluated on two individual test samples that contained multiple defects in the solder bumps and has been verified by physical inspection. The verification of the classification model reached an accuracy of more than 97% and was successfully applied to an unknown sample which demonstrates the high potential of machine learning concepts for further developments in assisted failure analysis.","PeriodicalId":259671,"journal":{"name":"ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126444520","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

GHz-SAM for Warped Samples using HiSA 利用HiSA检测翘曲样品的GHz-SAM

ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis Pub Date : 2019-12-01 DOI: 10.31399/asm.cp.istfa2019p0025

C. D. D. Le, P. Hoffrogge, M. Böckler

引用次数: 0

Solder Bump Joint Failure Investigation: From Sample Preparation to Advanced Structural Characterizations and Strain Measurements 焊料凹凸接头失效研究:从样品制备到高级结构表征和应变测量

ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis Pub Date : 2019-12-01 DOI: 10.31399/asm.cp.istfa2019p0043

P. Nowakowski, M. Ray, P. Fischione

引用次数: 0

Applying a Significant Protection Layer on Double Ex Situ Lift-out TEM Specimens to Protect Against Ion Beam Impact 在双非原位提升TEM试样上应用显著保护层以防止离子束冲击

ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis Pub Date : 2019-12-01 DOI: 10.31399/asm.cp.istfa2019p0215

Chun-Hung Lin, Hsin-Cheng Hsu, Tsung-Yi Lin, Ruihua Lin, I-An Chen, Pe-Lin Hsu, Chaoqing Chen, Iris Hsieh, C. Yeh, N. Lian, Ta-Hone Yang, Kuang-Chao Chen

引用次数: 0

Transmission Electron Microscopy Sample Preparation By Design Based Recipe Writing in a DBFIB Part 2 基于配方书写设计的DBFIB透射电镜样品制备(二)

ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis Pub Date : 2019-12-01 DOI: 10.31399/asm.cp.istfa2019p0470

J. Demarest, B. Austin, J. Arjavac, M. Breton, M. Bergendahl, M. Biedrzycki, C. Boye, B. Cilingiroglu, J. Gaudiello, J. Hager, S. Matham, K. Nguyen, M. Persala, M. Rizzolo, S. Shaar, S. Teehan

{"title":"Transmission Electron Microscopy Sample Preparation By Design Based Recipe Writing in a DBFIB Part 2","authors":"J. Demarest, B. Austin, J. Arjavac, M. Breton, M. Bergendahl, M. Biedrzycki, C. Boye, B. Cilingiroglu, J. Gaudiello, J. Hager, S. Matham, K. Nguyen, M. Persala, M. Rizzolo, S. Shaar, S. Teehan","doi":"10.31399/asm.cp.istfa2019p0470","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2019p0470","url":null,"abstract":"\u0000 Demarest et al. concluded in their previous report that a ten times improvement in placement accuracy was required to enable automated transmission electron microscopy (TEM) sample preparation, and wafer alignment by GDS coordinates demonstrated a factor of two improvement in comparison to optical or scanning electron microscope based processes. This paper provides an additional update on this project. The study is about a GDS based process developed to simplify the complicated workflow for examining discrete electrical failures. The results of this study indicated that the recipe prototype developed on a test structure had a unique feature that consisted of an approximately 45nm by 200nm Cu line segment. Executing the prototype recipe on a wafer at the same process point fabricated 6 months after the original wafer yielded four identical successful samples of about 30nm sample thickness. This technique can thus be extended to large 2D arrays of small structures.","PeriodicalId":259671,"journal":{"name":"ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122826012","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Advanced 3D Localization in Lock-in Thermography Based on the Analysis of the TRTR (Time-Resolved Thermal Response) Received Upon Arbitrary Waveform Stimulation 基于任意波形刺激下TRTR(时间分辨热响应)分析的锁定热成像高级三维定位

ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis Pub Date : 2019-12-01 DOI: 10.31399/asm.cp.istfa2019p0001

S. Brand, M. Kögel, C. Große, F. Altmann, B. Lai, Qingqing Wang, James Vickers, D. Tien, Bernice Zee, Qiu Wen

{"title":"Advanced 3D Localization in Lock-in Thermography Based on the Analysis of the TRTR (Time-Resolved Thermal Response) Received Upon Arbitrary Waveform Stimulation","authors":"S. Brand, M. Kögel, C. Große, F. Altmann, B. Lai, Qingqing Wang, James Vickers, D. Tien, Bernice Zee, Qiu Wen","doi":"10.31399/asm.cp.istfa2019p0001","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2019p0001","url":null,"abstract":"\u0000 Lock-in thermography (LIT) has been successfully applied in different excitation and analysis modes including classical LIT, analysis of the time-resolved temperature response (TRTR) upon square wave excitation and TRTR analysis in combination with arbitrary waveform stimulation. The results obtained by both classical square wave- and arbitrary waveform stimulation showed excellent agreement. Phase and amplitudes values extracted by classical LIT analysis and by Fourier analysis of the time resolved temperature response also coincided, as expected from the underlying system theory. In addition to a conceptual test vehicle represented by a point-shaped thermal source, two semiconductor packages with actual defects were studied and the obtained results are presented herein. The benefit of multi-parametric imaging for identification of a defect’s lateral position in the presence of multiple hot spots was also demonstrated. For axial localization, the phase shift values have been extracted as a function of frequency [4]. For comparative validation, LIT analyses were conducted in both square wave and arbitrary waveform excitation using custom designed and sample-specific stimulation signals. In both cases result verification was performed employing X-ray, scanning electron microscopy (SEM) and energy dispersive x-ray (EDX) as complementary techniques.","PeriodicalId":259671,"journal":{"name":"ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127814641","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Analysis of Voltage Contrast in Secondary Electron Images Using a High-Energy Electron Spectrometer 用高能电子能谱仪分析二次电子图像的电压对比

ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis Pub Date : 2019-12-01 DOI: 10.31399/asm.cp.istfa2019p0286

Natsuko Asano, S. Asahina, N. Erdman

引用次数: 1