ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis

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ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis - 最新文献

Understanding Water Ingress in Scanning Acoustic Microscopy and a Method to Observe Defects that are Open to the Surface

Pub Date : 2019-12-01 DOI: 10.31399/ASM.CP.ISTFA2019P0154 Adam Benak, R. Devaney

Ultra-Thinning of Silicon for Backside Fault Isolation

Pub Date : 2019-12-01 DOI: 10.31399/asm.cp.istfa2019p0465 M. Campin, P. Nowakowski, P. Fischione

A Review on Automatic Bill of Material Generation and Visual Inspection on PCBs

Pub Date : 2019-12-01 DOI: 10.31399/asm.cp.istfa2019p0256 Mukhil Azhagan M. S, Dhwani Mehta, Hangwei Lu, Sudarshan Agrawal, M. Tehranipoor, D. Woodard, N. Asadizanjani, Praveen Chawla

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