Solder Bump Joint Failure Investigation: From Sample Preparation to Advanced Structural Characterizations and Strain Measurements

Abstract

This paper describes the detailed sample preparation of a solder joint at the level between a semiconductor package and board. Different sample preparation techniques are described and compared. Preparing and targeting a large sample area containing multiple solder bumps is discussed. The sample preparation methods will then be confirmed by advanced structural characterization and strain measurement. The presence of strain is associated with the development of cracks and delamination at the solder joint interface.