2019 32nd IEEE International System-on-Chip Conference (SOCC)最新文献

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A Neural-Network-Based Non-linear Interference Cancellation Scheme for Wireless IoT Backhaul with Dual-Connectivity 一种基于神经网络的双连接无线物联网回程非线性干扰消除方案
2019 32nd IEEE International System-on-Chip Conference (SOCC) Pub Date : 2019-09-01 DOI: 10.1109/SOCC46988.2019.1570559857
Huiliang Zhang, Zhonglong Wang, Fei Qin, Meng Ma, Jianhua Zhang
{"title":"A Neural-Network-Based Non-linear Interference Cancellation Scheme for Wireless IoT Backhaul with Dual-Connectivity","authors":"Huiliang Zhang, Zhonglong Wang, Fei Qin, Meng Ma, Jianhua Zhang","doi":"10.1109/SOCC46988.2019.1570559857","DOIUrl":"https://doi.org/10.1109/SOCC46988.2019.1570559857","url":null,"abstract":"In this paper, we consider an Internet of Things (IoT) wireless network using Long Term Evolution (LTE) cellular system as backhaul. To provide high throughput, by using dual-connectivity technique, the IoT gateway simultaneously connects to two evolved Node Bs (eNBs) on two carriers, one for downlink and the other for uplink. As a result, the receive link will be severely interfered by the harmonic interference (HI) and inter-modulation (IM) components caused by the imperfections of power amplifier (PA) and in-phase/quadrature (I/Q) modulator. To solve this problem, in this paper, an neural-network (NN)based non-linear interference cancellation scheme is proposed for dual-connectivity IoT gateway. In the proposed scheme, the nonlinear interference is first reconstructed by using the transmit signal and the trained NN in baseband, and then subtracted from the received signal in digital domain at receiver. The NN precisely models the link behavior from the baseband transmitter to the baseband receiver, including all the linear and non-linear effect. Additionally, the NN can be used to reconstruct and cancel not only the HI, but also the IM components of the mirror-frequency interference (MFI) caused by I/Q imbalance, and direct current (DC) bias caused by local oscillator (LO) leakage. To evaluate the performance of the proposed scheme, a hardware prototype is designed and implemented. Experimental results show that the proposed scheme has a superior performance in dual-connectivity system compared with the traditional non-linear interference cancellation scheme using polynomial (PM) model.","PeriodicalId":253998,"journal":{"name":"2019 32nd IEEE International System-on-Chip Conference (SOCC)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124064142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
SOCC 2019 Additional Reviewers SOCC 2019额外审稿人
2019 32nd IEEE International System-on-Chip Conference (SOCC) Pub Date : 2019-09-01 DOI: 10.1109/socc46988.2019.9088008
{"title":"SOCC 2019 Additional Reviewers","authors":"","doi":"10.1109/socc46988.2019.9088008","DOIUrl":"https://doi.org/10.1109/socc46988.2019.9088008","url":null,"abstract":"","PeriodicalId":253998,"journal":{"name":"2019 32nd IEEE International System-on-Chip Conference (SOCC)","volume":"171 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125804638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
W2B: Digital Signal Processing W2B:数字信号处理
2019 32nd IEEE International System-on-Chip Conference (SOCC) Pub Date : 2019-09-01 DOI: 10.1109/socc46988.2019.9088108
{"title":"W2B: Digital Signal Processing","authors":"","doi":"10.1109/socc46988.2019.9088108","DOIUrl":"https://doi.org/10.1109/socc46988.2019.9088108","url":null,"abstract":"","PeriodicalId":253998,"journal":{"name":"2019 32nd IEEE International System-on-Chip Conference (SOCC)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129360793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Loop Optimizations of MGS-QRD Algorithm for FPGA High-Level Synthesis FPGA高级综合中MGS-QRD算法的环路优化
2019 32nd IEEE International System-on-Chip Conference (SOCC) Pub Date : 2019-09-01 DOI: 10.1109/SOCC46988.2019.1570548480
Chong Yeam Tan, C. Y. Ooi, N. Ismail
{"title":"Loop Optimizations of MGS-QRD Algorithm for FPGA High-Level Synthesis","authors":"Chong Yeam Tan, C. Y. Ooi, N. Ismail","doi":"10.1109/SOCC46988.2019.1570548480","DOIUrl":"https://doi.org/10.1109/SOCC46988.2019.1570548480","url":null,"abstract":"The best-known Modified Gram-Schmidt QR decomposition (MGS-QRD) algorithm contains many dependency problems in the aspects of data, memory, loop and control that hinder the high-level synthesis from optimizing the algorithm. So, we present a well-formed algorithm structure to reduce latency and hardware resources. We also present the second MGS-QRD algorithm to further reduce the DSP usage and support bigger QR decomposition size. The proposed algorithms achieve better overall performance than the best-known MGSQRD algorithm. Mapped to an Intel Arria 10 FPGA device, we achieve 0.53us for an 8x8 real QRD of the first proposed algorithm, and 0.59us for an 8x8 real QRD of the second proposed algorithm in the implemented system latency. Various HLS optimization steps and dependence analysis are also provided to improve the performance, it shows an approximately 44 times increase in QRD throughput.","PeriodicalId":253998,"journal":{"name":"2019 32nd IEEE International System-on-Chip Conference (SOCC)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127234498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
AxC-CS: Approximate Computing for Hardware Efficient Compressed Sensing Encoder Design AxC-CS:硬件高效压缩感知编码器设计的近似计算
2019 32nd IEEE International System-on-Chip Conference (SOCC) Pub Date : 2019-09-01 DOI: 10.1109/SOCC46988.2019.1570558477
Wenfeng Zhao, Biao Sun, Jian Chen, Yajun Ha
{"title":"AxC-CS: Approximate Computing for Hardware Efficient Compressed Sensing Encoder Design","authors":"Wenfeng Zhao, Biao Sun, Jian Chen, Yajun Ha","doi":"10.1109/SOCC46988.2019.1570558477","DOIUrl":"https://doi.org/10.1109/SOCC46988.2019.1570558477","url":null,"abstract":"In this paper, we present an approximate computing framework for hardware-efficeint compressed sensing encoder design exploiting application-level error-resiliency, termed as AxC-CS (underline {A}pprounderline {x}imate underline {C}omputing for underline {C}ompressed underline {S}ensing). We consider a 2-stage scalar quantization scheme during CS encoding process for physiological signals in sensor nodes and demonstrate numerically that bringing forward the quantization process to the input signals could lead to negligible difference in signal reconstruction as compared to the standard measurement quantization scheme, and a second stage quantization over the approximate measurement can be performed to restore the ratedistortion performance. The optimal quantization depth can be deterministic according to the adopted sensing matrices. For random binary sensing matrix adopted in this paper, [${mathbf{log}}_{mathbf{2}} (mathbf{n}/2)/2$] bits quantization depth can be safely truncated without incuring noticable errors when $ell_{1} -$minimization is used for signal recovery. Compared with standard CS with accurate operation, this leads to efficient CS encoder design with simultaneous area and power reduction, where 25% and 28% lower area and power consumption can be achieved on MIT-BIH Arrhythmia database, respectively.","PeriodicalId":253998,"journal":{"name":"2019 32nd IEEE International System-on-Chip Conference (SOCC)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130072591","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Group Delay Compensation By Combining 3-tap FFE With CTLE for 80Gbps-PAM4 Optical Transmitter 80Gbps-PAM4光发射机三分接FFE与CTLE相结合的群延迟补偿
2019 32nd IEEE International System-on-Chip Conference (SOCC) Pub Date : 2019-09-01 DOI: 10.1109/SOCC46988.2019.1570537232
Jiquan Li, Yingmei Chen, Zhen Zhang, Hui Wang, Chao Guo, Binbin Yang
{"title":"Group Delay Compensation By Combining 3-tap FFE With CTLE for 80Gbps-PAM4 Optical Transmitter","authors":"Jiquan Li, Yingmei Chen, Zhen Zhang, Hui Wang, Chao Guo, Binbin Yang","doi":"10.1109/SOCC46988.2019.1570537232","DOIUrl":"https://doi.org/10.1109/SOCC46988.2019.1570537232","url":null,"abstract":"Group delay peak-peak value and bandwidth bottleneck from VCSEL are challenges to achieve high speed optical interconnect at 50Gbps bits rates and above. This paper presents a PAM4 VCSEL-based Optical Transmitter that employs 3-tap feedforward equalizer (FFE) and continuous time linear equalizer (CTLE) to overcome these problems. By utilizing one pre-emphasis tap and CTLE, bandwidth of this system is extended to 26GHz. Moreover, peak-peak value of group delay for this system is reduced to 6.7pspp by using one pre-fall tap when frequency is below 26GHz. To adapt to various input signal amplitude, a variable gain amplifier (VGA) is placed in the frontend of transmitter. By using 0.18??m SiGe BiCMOS technology, the operating bits rates are up to 80Gbps with 2.8dBm optical modulation amplitude.","PeriodicalId":253998,"journal":{"name":"2019 32nd IEEE International System-on-Chip Conference (SOCC)","volume":"125 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131715740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Timing Aware Wrapper Cells Reduction for Pre-bond Testing in 3D-ICs 时间感知封装单元减少预键合测试在3d - ic
2019 32nd IEEE International System-on-Chip Conference (SOCC) Pub Date : 2019-09-01 DOI: 10.1109/SOCC46988.2019.1570544200
Pei-An Ho, Yen-Hao Chen, A. Wu, TingTing Hwang
{"title":"Timing Aware Wrapper Cells Reduction for Pre-bond Testing in 3D-ICs","authors":"Pei-An Ho, Yen-Hao Chen, A. Wu, TingTing Hwang","doi":"10.1109/SOCC46988.2019.1570544200","DOIUrl":"https://doi.org/10.1109/SOCC46988.2019.1570544200","url":null,"abstract":"Three dimensional integrated circuits (3D-ICs) have being developed to improve existing 2D designs by providing smaller chip areas, higher performance and lower power consumption. With the short and dense through-silicon-vias (TSVs), multiple dies can be integrated to overcome the barrier of interconnection. However, before 3D-ICs become a viable technology, the understanding of 3D testing issues is still insufficient and there are still many unresolved testing challenges. To ensure the stack yield of future adopting of 3D-ICs, pre-bond testing is needed to provide the known good die (KGD). Since the TSVs are not fully accessible prior to bonding, testing the combinational logic between the scan flip-flops and TSV becomes a complex issue. In order to overcome the limitation of TSV, additional wrapper cells were inserted at the two ends of TSVs to provide controllability and observability [1], [2]. Even though it is a major breakthrough solution for pre-bond testing, the wrapper cells used by the TSVs lead to significant area overhead. Further, to reduce area overhead, the existing primary scan flip-flops were reused to achieve high testability [3], [4]. However, practical timing considerations were overlooked and the number of inserted wrapper cells was still high. In this paper, we present an enhanced method to not only generate more reused scan flip-flops but also not incur any timing violation by using an accurate timing model. Furthermore, testability constraints are also considered and can be traded-off between area overhead and testability. The experimental results on ITC99 benchmark circuits [5] have shown that our method can reduce 0.92%-6.01% wrapper cells with competitive testability compared to the previous work.","PeriodicalId":253998,"journal":{"name":"2019 32nd IEEE International System-on-Chip Conference (SOCC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126860391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis and Modeling of Passive LC Filters Using Node Elimination Technique 基于节点消去技术的无源LC滤波器分析与建模
2019 32nd IEEE International System-on-Chip Conference (SOCC) Pub Date : 2019-09-01 DOI: 10.1109/SOCC46988.2019.1570547047
S. Hamedi-Hagh
{"title":"Analysis and Modeling of Passive LC Filters Using Node Elimination Technique","authors":"S. Hamedi-Hagh","doi":"10.1109/SOCC46988.2019.1570547047","DOIUrl":"https://doi.org/10.1109/SOCC46988.2019.1570547047","url":null,"abstract":"Eliminating circuit nodes reduces the order of the circuit determinants and relaxes the computing memory requirement in order to extract circuit characteristics. However, node eliminations increase the number of components in the transformed circuit and can introduce errors in circuit transfer functions if critical components are omitted from the model. This paper shows how a filter node can be eliminated without introducing more components while preserving all filter characteristics including coupling factors among inductors, scattering parameters, voltage gain and node impedance transfer functions, impulse, step and transient responses.","PeriodicalId":253998,"journal":{"name":"2019 32nd IEEE International System-on-Chip Conference (SOCC)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127800763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Folded and Deterministic Stochastic MAC for High Accuracy and Hardware Efficient Convolution Function 高精度和硬件高效卷积函数的折叠和确定性随机MAC
2019 32nd IEEE International System-on-Chip Conference (SOCC) Pub Date : 2019-09-01 DOI: 10.1109/SOCC46988.2019.1570543844
M. Wong, A. Do
{"title":"Folded and Deterministic Stochastic MAC for High Accuracy and Hardware Efficient Convolution Function","authors":"M. Wong, A. Do","doi":"10.1109/SOCC46988.2019.1570543844","DOIUrl":"https://doi.org/10.1109/SOCC46988.2019.1570543844","url":null,"abstract":"A family of Stochastic Computing (SC) circuit using folded and deterministic sequence is presented in this work. The SC circuit produces shorter and higher progressive precision sequences, and without the use of PRNG (often implemented as LFSR in hardware). Using the new stochastic representation, a design of SC multiply-and-accumulate (MAC) function is proposed and implemented as hardware convolution accelerator on a Virtex-4 FPGA. Experimental results obtained from detailed test analysis has proven that the new SC-MAC unit has higher computational accuracy and achieved a better ratio of throughput performance over area cost (hardware efficiency) in comparison with the conventional SC approach.","PeriodicalId":253998,"journal":{"name":"2019 32nd IEEE International System-on-Chip Conference (SOCC)","volume":"207 9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127834361","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Low Power Analog Front-end for Ultrasound Receiver 一种用于超声接收机的低功耗模拟前端
2019 32nd IEEE International System-on-Chip Conference (SOCC) Pub Date : 2019-09-01 DOI: 10.1109/SOCC46988.2019.1570572046
Chuanshi Yang, Kai Tang, Lei Qiu, Zhongyuan Fang, Yuanjin Zheng
{"title":"A Low Power Analog Front-end for Ultrasound Receiver","authors":"Chuanshi Yang, Kai Tang, Lei Qiu, Zhongyuan Fang, Yuanjin Zheng","doi":"10.1109/SOCC46988.2019.1570572046","DOIUrl":"https://doi.org/10.1109/SOCC46988.2019.1570572046","url":null,"abstract":"F1exible and wearable devices are of great demand with the developing of the sensors and IoT (internet of the things). The power consumption and volume of the devices need to be reduced in corresponding applications. To meet these requirements, the authors developed and fabricated a low power and high sensitivity analog front-end (AFE) for the ultrasonic imaging. The AFE, including a low noise amplifier (LNA), a 3rd order Butterworth low pass filter (LPF) and a variable gain amplifier (VGA), is fabricated in GF65 nm process. The measurement results indicate 52 dB gain in 10 MHz bandwidth with 16 mW power consumption. An also, the measurement result of the LNA also shows 1nV/$sqrt{}$Hz input referred noise.","PeriodicalId":253998,"journal":{"name":"2019 32nd IEEE International System-on-Chip Conference (SOCC)","volume":"136 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133465148","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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