2009 IEEE 15th International Mixed-Signals, Sensors, and Systems Test Workshop最新文献_第2页

A method for electrical calibration of MEMS accelerometers through multivariate regression 一种基于多元回归的MEMS加速度计电校准方法

2009 IEEE 15th International Mixed-Signals, Sensors, and Systems Test Workshop Pub Date : 2009-06-10 DOI: 10.1109/IMS3TW.2009.5158685

N. Dumas, F. Azais, F. Mailly, P. Nouet

引用次数: 9

Two improved methods for testing ADC parametric faults by digital input signals 用数字输入信号检测ADC参数故障的两种改进方法

2009 IEEE 15th International Mixed-Signals, Sensors, and Systems Test Workshop Pub Date : 2009-06-10 DOI: 10.1109/IMS3TW.2009.5158684

Xiaoqin Sheng, H. Kerkhoff

引用次数: 5

Verification of analog and mixed signal designs using online monitoring 利用在线监测验证模拟和混合信号设计

2009 IEEE 15th International Mixed-Signals, Sensors, and Systems Test Workshop Pub Date : 2009-06-10 DOI: 10.1109/IMS3TW.2009.5158695

Zhiwei Wang, Naeem Abbasi, Rajeev Narayanan, M. Zaki, G. Al Sammane, S. Tahar

引用次数: 12

Defect-based analog fault coverage analysis using mixed-mode fault simulation 基于缺陷的混合模式故障模拟故障覆盖分析

2009 IEEE 15th International Mixed-Signals, Sensors, and Systems Test Workshop Pub Date : 2009-06-10 DOI: 10.1109/IMS3TW.2009.5158688

J. Parky, Srinadh Madhavapeddiz, Alessandro Paglieri, Chris Barrz, Jacob A. Abrahamy

{"title":"Defect-based analog fault coverage analysis using mixed-mode fault simulation","authors":"J. Parky, Srinadh Madhavapeddiz, Alessandro Paglieri, Chris Barrz, Jacob A. Abrahamy","doi":"10.1109/IMS3TW.2009.5158688","DOIUrl":"https://doi.org/10.1109/IMS3TW.2009.5158688","url":null,"abstract":"A fault coverage analysis has become an important tool to evaluate the testability of developing circuits and to come up with an effective test plan. However, the fault coverage analysis of analog circuits has not gained much attention due to the long fault simulation time and the absence of widely accepted fault models. This paper presents an efficient framework for the analog fault coverage analysis to provide repeatable and predictable analog test metrics. The presented method uses a defect-based analysis method in which faults are modeled at a transistor-level to examine faulty behavior in a structural way. In order to conduct the defect-based fault simulation in a manageable time, we develop a mixed-mode fault simulation how which uses both behavioral-level HDL (Hardware Description Language) model and transistor-level SPICE model simultaneously. Also, the information of transistor geometry is used in the analysis to reflect the different defect probabilities of transistors of various sizes. Our method was applied to a full-chip level fault analysis of a commercial mixed-signal IP, and the analysis result shows a good correlation with an actual post-silicon test data.","PeriodicalId":246363,"journal":{"name":"2009 IEEE 15th International Mixed-Signals, Sensors, and Systems Test Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128444817","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 26

Design for modular testing of a multilayer flexible wireless multisensor platform 多层柔性无线多传感器平台的模块化测试设计

2009 IEEE 15th International Mixed-Signals, Sensors, and Systems Test Workshop Pub Date : 2009-06-10 DOI: 10.1109/IMS3TW.2009.5158698

Y. Chuo, B. Kaminska

{"title":"Design for modular testing of a multilayer flexible wireless multisensor platform","authors":"Y. Chuo, B. Kaminska","doi":"10.1109/IMS3TW.2009.5158698","DOIUrl":"https://doi.org/10.1109/IMS3TW.2009.5158698","url":null,"abstract":"Smart wireless sensor systems that incorporate multiple sensors often cannot be implemented on a single chip. Advanced packaging and assembly type integrations allow for a more complex conjugation and configuration of multiple system modules implemented under different technologies together in a small tiny package. In tiny sensor systems such as these, a common challenge seen across various unique assemblies is the limited test access during assembly, allowing system verification only after completion of assembly and packaging. Conventional test point access is too large to be suitable and cost effective for testing in tiny systems, while microprobing is only appropriate for a small number of test points and prototypes. We introduce a concept of direct test points access through printed microconnectors for a system that consists of multiple stacked layers of electronics disposed on a flexible polymer carrier. The printed microconnectors provide test access to various modules of the system during assembly such that progressive verification can be performed prior to completion of the entire system. This allows early identification of failed modules leading to production cost savings. The architecture of the flexible wireless multisensor platform and design of the microconnectors are discussed. The methodology and configuration for modular testing is explained from the system and subsystem perspective.","PeriodicalId":246363,"journal":{"name":"2009 IEEE 15th International Mixed-Signals, Sensors, and Systems Test Workshop","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120883452","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Reconfigurable dielectrophoretic device for neurotransmitters sensing and manipulation 用于神经递质传感和操作的可重构介电泳装置

2009 IEEE 15th International Mixed-Signals, Sensors, and Systems Test Workshop Pub Date : 2009-06-10 DOI: 10.1109/IMS3TW.2009.5158699

M. A. Miled, M. Sawan

引用次数: 3

Inkjet printing of microsensors 微型传感器的喷墨打印

2009 IEEE 15th International Mixed-Signals, Sensors, and Systems Test Workshop Pub Date : 2009-06-10 DOI: 10.1109/IMS3TW.2009.5158692

Hussein Al-Chami, E. Cretu

引用次数: 26