Defect-based analog fault coverage analysis using mixed-mode fault simulation

J. Parky, Srinadh Madhavapeddiz, Alessandro Paglieri, Chris Barrz, Jacob A. Abrahamy
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引用次数: 26

Abstract

A fault coverage analysis has become an important tool to evaluate the testability of developing circuits and to come up with an effective test plan. However, the fault coverage analysis of analog circuits has not gained much attention due to the long fault simulation time and the absence of widely accepted fault models. This paper presents an efficient framework for the analog fault coverage analysis to provide repeatable and predictable analog test metrics. The presented method uses a defect-based analysis method in which faults are modeled at a transistor-level to examine faulty behavior in a structural way. In order to conduct the defect-based fault simulation in a manageable time, we develop a mixed-mode fault simulation how which uses both behavioral-level HDL (Hardware Description Language) model and transistor-level SPICE model simultaneously. Also, the information of transistor geometry is used in the analysis to reflect the different defect probabilities of transistors of various sizes. Our method was applied to a full-chip level fault analysis of a commercial mixed-signal IP, and the analysis result shows a good correlation with an actual post-silicon test data.
基于缺陷的混合模式故障模拟故障覆盖分析
故障覆盖分析已成为评估开发电路可测试性和制定有效测试计划的重要工具。然而,由于模拟电路的故障仿真时间长,且缺乏广泛接受的故障模型,故对模拟电路的故障覆盖分析一直没有得到重视。本文提出了一种有效的模拟故障覆盖分析框架,以提供可重复和可预测的模拟测试指标。该方法采用基于缺陷的分析方法,在晶体管级对故障进行建模,以结构方式检查故障行为。为了在可管理的时间内进行基于缺陷的故障仿真,我们开发了一种同时使用行为级HDL (Hardware Description Language,硬件描述语言)模型和晶体管级SPICE模型的混合模式故障仿真方法。同时,利用晶体管的几何信息来反映不同尺寸晶体管的不同缺陷概率。将该方法应用于某商用混合信号IP的全芯片级故障分析,分析结果与实际的后硅测试数据具有较好的相关性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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