Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop最新文献_第3页

Cost reduction in a manufacturing fabricator: from the bottom up 降低制造制造商的成本:自下而上

Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop Pub Date : 1995-11-13 DOI: 10.1109/ASMC.1995.484337

S. Cogley

{"title":"Cost reduction in a manufacturing fabricator: from the bottom up","authors":"S. Cogley","doi":"10.1109/ASMC.1995.484337","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484337","url":null,"abstract":"In today's highly competitive business environment, manufacturers must decrease costs and maximize tool usage to maintain a competitive edge. IBM's semiconductor manufacturing facility in Essex Junction, Vermont, is no exception to the rule. In the early 1990s, this facility took a hard look at all of the factors that contributed to the cost of its products. Major sources of spending in a device fabricator like IBM's are those expenses incurred in maintaining machines and equipment-in particular, spare parts for repair and the routine maintenance of equipment. The increased awareness of costs associated with maintaining manufacturing equipment has also brought a renewed focus to spare parts. Although these costs can be enormous, then are also significant opportunities for savings. Unfortunately, discovering these savings can be a difficult and time-consuming task, if people looking for the savings do not have a through understanding of how individual tools function. On the other hand, if the real costs of equipment maintenance are not known, it is difficult to determine where and how to realize savings. This paper describes how manufacturing personnel learned to use IBM's financial reporting systems to find these savings and reduce the use of spare parts.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123292662","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Developing the methodology to improve productivity within an integrated 200-mm fabricator 开发方法，以提高在一个集成的200毫米制造商的生产力

Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop Pub Date : 1995-11-13 DOI: 10.1109/ASMC.1995.484403

K. Wells, D. Parker, K. Pashby

{"title":"Developing the methodology to improve productivity within an integrated 200-mm fabricator","authors":"K. Wells, D. Parker, K. Pashby","doi":"10.1109/ASMC.1995.484403","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484403","url":null,"abstract":"Customer satisfaction in the semiconductor business depends on the ability of manufacturers to provide on-time delivery of quality products. To meet this objective without increasing resources, fabricator productivity must be maximized. At the IBM Microelectronics Division 200-mm semiconductor fabricator in Essex Junction, Vermont, the alternate work schedule (AWS) N1 Team enhanced its productivity by giving responsibility for this key measurement to a team of three nonmanagers. This paper describes how the team increased productivity to a point equal to or better than the measurement stipulated in the fabricator's strategic operating plan. Referred to as the OF-OUT Team, the group focused on moving 14 individual departments comprising the N1 Team to a working arrangement that focused on the team as a whole rather than on the sum of its parts. This concept placed a premium on people working together as a team so that the productivity of each individual could be maximized. By adhering to this concept, the N1 Team realized a 4.7% increase in average daily operational productivity over its first six months without an increase in resources. This improvement occurred by setting one goal for the entire team, challenging the individual operators to find the procedural changes necessary to meet this goal and by bringing people together from different departments to solve problems that ordinarily would be outside their areas of control. The teamwork approach to operational productivity is used today by various departments to examine how they do business and to look for opportunities where this change in strategy can benefit both other departments and the N1 Team as a whole.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122553136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

SDWT requires tools to be successful SDWT需要工具才能成功

Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop Pub Date : 1995-11-13 DOI: 10.1109/ASMC.1995.484398

E. Rose, R. Odom, R. Murphy, L. Behnke

引用次数: 1

Thermal shock and thermal NF/sub 3/ in-situ furnace cleaning 热冲击和热NF/sub - 3/原位炉清洗

Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop Pub Date : 1995-11-13 DOI: 10.1109/ASMC.1995.484378

B. Metteer

引用次数: 0

Implementation of CMP-based design rules and patterning practices 基于cmp的设计规则和模式实践的实现

Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop Pub Date : 1995-11-13 DOI: 10.1109/ASMC.1995.484326

L. Camilletti

引用次数: 10

The effect of airborne contaminants in the cleanroom for ULSI manufacturing process 洁净室中空气污染物对ULSI制造过程的影响

Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop Pub Date : 1995-11-13 DOI: 10.1109/ASMC.1995.484397

M. Tamaoki, K. Nishiki, A. Shimazaki, Y. Sasaki, S. Yanagi

{"title":"The effect of airborne contaminants in the cleanroom for ULSI manufacturing process","authors":"M. Tamaoki, K. Nishiki, A. Shimazaki, Y. Sasaki, S. Yanagi","doi":"10.1109/ASMC.1995.484397","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484397","url":null,"abstract":"In this paper we report on the effect of airborne organic contaminants in actual cleanrooms. We have developed methods for the analysis of contaminants adsorbed on wafer surfaces, including thermal desorption-gas chromatography/mass spectrometry (TD-GC/MS) and thermal desorption-atmospheric pressure ionization mass spectrometry (TD-APIMS). From the results of analysis using TD-GC/MS, TD-APIMS, and ion chromatography (IC), we demonstrate that several specific organic compounds in cleanroom air tend to adsorb on silicon wafers. These include dioctyl-phthalate (DOP), other esters, and amines. We have also found that these organic contaminants adsorbed on the wafer surface cause a reduction in the breakdown field strength of an insulating SiO/sub 2/ layer. The origin of DOP and the other esters is the plasticizer added to many polymeric materials. DOP exists in the cleanroom inlet atmosphere, and there are additional outgassings from many polymeric materials in the cleanroom itself. The major source of amine contaminants is chemicals added to the steam which is used for humidity control in the cleanroom. We show that organic contaminants from the wafer carriers and boxes also cause a reduction in the breakdown field strength of a SiO/sub 2/ layer. We also succeed in decreasing organic contaminants by use of adopting charcoal air filtering.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"1959 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129456638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 30

Networked analysis systems 网络化分析系统

Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop Pub Date : 1995-11-13 DOI: 10.1109/ASMC.1995.484341

A. Diebold

引用次数: 0

A practical approach to equipment reliability enhancement 提高设备可靠性的实用方法

Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop Pub Date : 1995-11-13 DOI: 10.1109/ASMC.1995.484381

L. Azzano, D. Gay, A. Pasumamula

{"title":"A practical approach to equipment reliability enhancement","authors":"L. Azzano, D. Gay, A. Pasumamula","doi":"10.1109/ASMC.1995.484381","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484381","url":null,"abstract":"When equipment manufacturers conduct reliability enhancement testing, customer process development, and engineering testing, the resource investment needed to support all three efforts can be significant. FSI International operates a unique equipment reliability enhancement program that allows simultaneous process development, reliability and engineering testing. The program groups all three test objectives with the following advantages: 1) Greater operating efficiency gained by multi-tasking a single lab tool; 2) Considerable capital and operating expense savings; and 3) Accelerated learning cycles and quality improvement. The FSI program is based on SEMI E10-92, the Motorola IRONMAN equipment test philosophy, and customer equipment evaluation guidelines. The main principle of the FSI reliability program is continuous 24-hour operation of the tool. Process data is collected at regular intervals and system reliability is tracked continuously. The original program goals were system MTBF/spl ges/1000 hrs. and total system uptime exceeding 99%, while maintaining the tool for engineering and customer application work. The advantages of continuous testing are twofold. First, the equipment design becomes more robust and better able to meet future customer process requirements. Second, a database is created that characterizes the machine on a long-term basis and allows better process predictions to be made. The paper details the testing methodology adopted for this reliability program. It reviews the troubleshooting and corrective action procedure, the status of the program, and summarize the results.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125511858","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A process-independent run-to-run controller and its application to chemical-mechanical planarization 一种过程无关的运行-运行控制器及其在化学-机械平面化中的应用

Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop Pub Date : 1995-11-13 DOI: 10.1109/ASMC.1995.484370

J. Moyne, R. Telfeyan, A. Hunvitz, J. Taylor

{"title":"A process-independent run-to-run controller and its application to chemical-mechanical planarization","authors":"J. Moyne, R. Telfeyan, A. Hunvitz, J. Taylor","doi":"10.1109/ASMC.1995.484370","DOIUrl":"https://doi.org/10.1109/ASMC.1995.484370","url":null,"abstract":"The controller design utilizes a Generic Cell Controller (GCC) enabler; thus it is process-independent, and the controller implementation software exhibits a high degree of portability, flexibility, robustness, and reusability. The design also includes a multi-branch R2R control scheme that can incorporate any number of controller algorithms in a complementary fashion. Further, it provides support for data collection, R2R recipe optimization and control, and recipe advice download. The controller implementation is largely hardware and software independent; its operation has been demonstrated on SUN SPARC, Intel 486 and Pentium, and HP PA-RISC platforms. It has a capability to incorporate in dynamic fashion (i.e., during run-time) any number of software modules existing on any of the aforementioned platforms within a distributed environment, resulting in a truly dynamic and distributed solution. The implementation was initially applied to the control of a reactive ion etcher (RIE). More recently it has also been successfully applied to the R2R control of a CMP tool, thus demonstrating process independence. The latter application utilizes a \"gradual mode\" MIMO linear approximation control algorithm developed at MIT, enhanced to support parameter weighting and advice parameter granularity. Recent results indicate that good control of removal rate with fair control of uniformity has been achieved. Current efforts are focused on development of additional algorithm \"branches\" to complement the gradual mode control, and on the reduction of process variance through real-time equipment monitoring.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"1212 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121458547","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 24

Factory start-up and production ramp: yield improvement through signature analysis and visual/electrical correlation 工厂启动和生产斜坡:通过特征分析和视觉/电气关联提高良率

Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop Pub Date : 1995-11-13 DOI: 10.1109/ASMC.1995.484383

F. Lee, Ping Wang, R. Goodner

引用次数: 10