EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems最新文献_第10页

3D circuit model for 3D IC reliability study 三维集成电路可靠性研究的三维电路模型

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938513

C. Tan, Feifei He

{"title":"3D circuit model for 3D IC reliability study","authors":"C. Tan, Feifei He","doi":"10.1109/ESIME.2009.4938513","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938513","url":null,"abstract":"3D integrated circuit technology is an emerging technology for the near future, and has received tremendous attention in the semiconductor community. With the 3D integrated circuit, the temperature and thermo-mechanical stress in the various parts of the IC are highly dependent on the surrounding materials and their materials properties, including their thermal conductivities, thermal expansivities, Young modulus, poisson ratio etc. Also, the architectural of the 3D IC will also affect the current density, temperature and thermo-mechanical stress distributions in the IC. In view of the above-mentioned, the electrical-thermal-mechanical modeling of integrated circuit can no longer be done with a simple 2D model. The distributions of the current density, temperature and stress are important in determining the reliability of an IC. In this work, we demonstrate a method of converting 2D circuit layout into a 3D model. Simulations under real circuit operating condition are carried out using both Cadence (a circuit simulator) and ANSYS (finite element tool). Limiting our study to the electromigration failure, we compute the current density, temperature and stress distributions of the interconnect layers by considering the heat transfer and Joule heating, and the “weak spot” for electromigration is identified. Layout design can be modified based on the simulation results so as to enhance the 3D circuit interconnect reliability.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"175 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123257941","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 18

Dynamic study and structure enhancement of small outline dual-in-line memory module 小轮廓双列存储模块的动态研究与结构增强

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938465

C. J. Huang, C. Chou, K. Chiang

{"title":"Dynamic study and structure enhancement of small outline dual-in-line memory module","authors":"C. J. Huang, C. Chou, K. Chiang","doi":"10.1109/ESIME.2009.4938465","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938465","url":null,"abstract":"The purpose of this research is to enhance the structure of the 204-pin small outline dual in-line memory module (SODIMM) against the drop impact. According to the JEDEC regulations, the enhancement of PCB clips should be attempted to increase the resistance against drop impact. From high speed camera observation, the SODIMM module is pushed away from the PCB clips during drop impact. Therefore, the board pushing experiment was performed to measure the resistant force against PCB clips. Thereafter, two stages of finite element analysis (FEA) were executed to improve the resistance force of PCB clips. In the first stage, the finite element model of the SODIMM module was built to calculate the total resistance force against the constraint of PCB clips using FEA software ANSYS®. The simulation results were validated well with the board pushing experiment. The total resistance force is about 5.39 N in the original design. The second stage of the analysis is to proceed with the structural enhancement of PCB clips. Several parametric studies including discussions on the angle between clip and PCB, the length of the PCB clip, and the material properties of clip, were performed to improve the strength of clips. After the structural optimization, the total resistant force against the constraint of clip increased from 5.39 N to 8 N.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"159 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114731624","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A multiscale model of mMicro cantilever arrays 微悬臂阵列的多尺度模型

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938417

M. Lenczner, Emmanuel Pillet, S. Cogan, H. Hui

引用次数: 0

Probabilistic effects in thermal cycling failures of high-I/O BGA assemblies 高i /O BGA组件热循环失效的概率效应

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938418

S. London, D. Fricano, A. Dasgupta, T. Reinikaininen, G. Freitas, C. Pagliosa

{"title":"Probabilistic effects in thermal cycling failures of high-I/O BGA assemblies","authors":"S. London, D. Fricano, A. Dasgupta, T. Reinikaininen, G. Freitas, C. Pagliosa","doi":"10.1109/ESIME.2009.4938418","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938418","url":null,"abstract":"This paper presents a study of the probabilistic effects that act in addition to deterministic (mechanistic) effects to reduce the thermal cycling durability of ball grid array (BGA) interconnects as the component I/O count increases. The mechanistic drivers include increasing thermal expansion mismatch with increasing package size and increasing stress levels with decreasing solder joint size. The most critical joint from this deterministic perspective is usually the one at the outer corner of either the die foot-print or the package foot-print. The probabilistic factors include variabilities in microstructure, interfacial intermetallic layers, joint geometry and void distributions; all of which can place several joints around the critical one at risk, and further reduce the durability of the entire package. Thus, durability can drop as the number of joints in series increase, even if the stress levels do not change. Thus, for large BGAs the mechanistic prediction can overestimate component life. In this paper PBGA-1156 assemblies are subjected to temperature cycling tests and the failure statistics are identified. Using a partitioned daisy-chain design, the durability is found to decrease, as more and more joints are nested together in the critical regions at the package corners. Since all the failed joints do not experience the same thermal expansion mismatch, finite element analysis and fatigue analysis is conducted to normalize all the failure data to a uniform damage level, by quantifying the deterministic (mechanistic) effects. The additional drop in durability with increasing number of joints, after the mechanistic normalization, is attributed to the probabilistic effect of interest. The results suggest that for this example, the probabilistic effects can reduce the deterministic prediction by an order of magnitude, as the number of I/O in the critical region reaches 100.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127086242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Simulated annealing as a global optimization algorithm used in numerical prototyping of electronic packaging 模拟退火作为一种全局优化算法应用于电子封装的数值原型设计

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938424

L. Dowhan, A. Wymyslowski, K. Urbanski

引用次数: 6

Electrically driven matter transport effects in PoP interconnections 电驱动物质在PoP互连中的传输效应

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938457

W. Feng, K. Weide-Zaage, F. Verdier, B. Plano, A. Guédon-Gracia, H. Frémont

引用次数: 13

Effect of cyclic fatigue damage accumulation on the elastic-plastic properties of SAC305 solders 循环疲劳损伤累积对SAC305钎料弹塑性性能的影响

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938503

G. Cuddalorepatta, A. Dasgupta

引用次数: 14

Multi-disciplinary approach to design of a power electronics module for harsh environments 针对恶劣环境设计电力电子模块的多学科方法

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938500

M. Lindgren, I. Belov, A. Johansson, Torkel Danielsson, N. Gunnarsson, P. Leisner

{"title":"Multi-disciplinary approach to design of a power electronics module for harsh environments","authors":"M. Lindgren, I. Belov, A. Johansson, Torkel Danielsson, N. Gunnarsson, P. Leisner","doi":"10.1109/ESIME.2009.4938500","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938500","url":null,"abstract":"A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between the molding compound and the module PCB have been performed along with investigation of heat transfer paths in the module. The experiments in harsh environments have revealed thermo-mechanical stability and acceptable moisture ingress for the module test samples with relatively large BGA components on the glass-fiber epoxy PCBs of different thickness and different solder mask types. Thermal images of the module have been obtained and the CFD model was created and validated with temperature measurements in power-on tests. Extreme heat dissipation modes have been studied by modeling.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":" 6","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113946152","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

On the epoxy moulding compound aging effect on package reliability 探讨环氧树脂成型复合材料老化对封装可靠性的影响

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938439

S. Noijen, R. Engelen, J. Martens, A. Opran, O. van der Sluis

{"title":"On the epoxy moulding compound aging effect on package reliability","authors":"S. Noijen, R. Engelen, J. Martens, A. Opran, O. van der Sluis","doi":"10.1109/ESIME.2009.4938439","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938439","url":null,"abstract":"Most semi-conductor devices are encapsulated by epoxy moulding compound (EMC) material. Even after curing at the prescribed temperature and time in accordance with the supplier's curing specifications often the product is not yet 100% fully cured. As a consequence, the curing process of a product continues much longer, leading to curing effects of the EMC during the lifetime of the package. In this paper, the effect of EMC curing during lifetime on package reliability is investigated. The mechanical properties of one EMC material are measured as a function of aging time and used in FE calculations. Aging effects on critical semi-conductor failure modes such as die cracking, compound cracking, wedge break, and delamination are addressed. Die and compound crack risks are predicted by common stress analysis. The risk of wedge break occurrence is investigated by detailed 3D modeling of the actual wires in the package using a global-local approach. Conclusions on delamination risks are made based on a parameter sensitivity analysis using a 3D cohesive zones approach to predict transient delamination. The package reliability study shows that the effect of EMC aging affects relevant failure modes in different ways.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129009117","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Ten years of thermal analysis at EuroSimE - What's next? EuroSimE的十年热分析-下一步是什么?

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938509

P. Rodgers, V. Eveloy

引用次数: 0