W. Feng, K. Weide-Zaage, F. Verdier, B. Plano, A. Guédon-Gracia, H. Frémont
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Electrically driven matter transport effects in PoP interconnections
The migration issue of Package-on-Package (PoP) is investigated in this article. The migration phenomenon can be amplified as the density of solder bumps increases, while the paths are very finer as well in PoP.
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