Ten years of thermal analysis at EuroSimE - What's next?

Abstract

This paper presents an overview of thermal analyses of micro-electronics and micro-systems presented in the thermal analysis Track at EuroSimE since the inception of the conference in 2000. This overview is based on a bibliography of approximately 140 papers compiled in this paper. The achievements of the conference in producing an archival record in the field of micro-electronics and micro-systems thermal analysis are summarized, in terms of numerical analysis versus experimental characterization, coupling of thermal analyses with other physics, thermal management strategies, microelectronics packaging technologies, and sustainability of thermal designs. How this work has served as a building block for thermo-mechanical and multi-physics analyses presented at the conference is outlined. Finally, critical areas of thermal analysis that need to be addressed by EuroSimE in the foreseeable future are identified.