Electrically driven matter transport effects in PoP interconnections

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI:10.1109/ESIME.2009.4938457

W. Feng, K. Weide-Zaage, F. Verdier, B. Plano, A. Guédon-Gracia, H. Frémont

引用次数: 13

Abstract

The migration issue of Package-on-Package (PoP) is investigated in this article. The migration phenomenon can be amplified as the density of solder bumps increases, while the paths are very finer as well in PoP.

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电驱动物质在PoP互连中的传输效应

本文研究了包对包(PoP)的迁移问题。随着焊点密度的增加，迁移现象会被放大，而在PoP中，路径也会变得非常细。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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