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2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE最新文献

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Why Frequency Domain Tests Like IEC 61000-4-19 Are Not Valid; a Call for Time Domain Testing 为什么像IEC 61000-4-19这样的频域测试无效对时域测试的呼吁
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE Pub Date : 2019-10-17 DOI: 10.1109/EMCEurope.2019.8872070
B. Have, Tom Hartman, N. Moonen, F. Leferink
{"title":"Why Frequency Domain Tests Like IEC 61000-4-19 Are Not Valid; a Call for Time Domain Testing","authors":"B. Have, Tom Hartman, N. Moonen, F. Leferink","doi":"10.1109/EMCEurope.2019.8872070","DOIUrl":"https://doi.org/10.1109/EMCEurope.2019.8872070","url":null,"abstract":"Testing of electrical and electronic equipment is generally performed using frequency domain tests like the IEC 61000-4-19. This standard covers the immunity to conducted, differential mode disturbances and signaling in the frequency range from 2 kHz to 150 kHz. Previous research describes several electromagnetic interference (EMI) cases in this frequency range, which cover pulsed, fast changing, current waveforms. For example cases are described where static energy meters can give misreadings when loaded with pulsed currents. Fast changing time domain signals are not covered by the standards. In this paper it is shown that the current frequency domain tests are not sufficient to determine the equipment’s immunity, because of for instance non-linear effects, including saturation, digital sampling error effects and other non linear time invariant (LTI) effects.","PeriodicalId":225005,"journal":{"name":"2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133676302","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Two Sided Earthing Versus one Sided Earthing for Ethernet Cables 以太网电缆双面接地与单边接地
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE Pub Date : 2019-10-17 DOI: 10.1109/EMCEurope.2019.8872004
Wen Wang, Tom Hartman, C. Keyer, Jan-Kees van der Ven
{"title":"Two Sided Earthing Versus one Sided Earthing for Ethernet Cables","authors":"Wen Wang, Tom Hartman, C. Keyer, Jan-Kees van der Ven","doi":"10.1109/EMCEurope.2019.8872004","DOIUrl":"https://doi.org/10.1109/EMCEurope.2019.8872004","url":null,"abstract":"The discussion about the earthing method of Shielded Twisted Pair (STP) cables never stops. There is a difference in opinion between Local Area Network (LAN) equipment manufacturers and Electromagnetic Compatibility (EMC) specialists. LAN equipment manufacturers state that the cable screen should only be earthed on one side of the cable, because it can prevent a ground current loop. EMC specialists advise multi-point earthing, since it is the best way to increase immunity to different kinds of disturbances. To find out which earthing method gives better results, a few measurements are performed. Three kinds of test methods are used: a direct current injection (50 Hz) test, an electric fast transient bursts (EFT-B) test with a capacitive clamp and a continuous wave (CW) test using an Electromagnetic (EM) clamp.","PeriodicalId":225005,"journal":{"name":"2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130235374","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Experiment to educate ESD phenomena to engineers 对工程师进行ESD现象教育实验
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE Pub Date : 2019-10-17 DOI: 10.1109/EMCEurope.2019.8871745
F. Buesink, R. Vogt-Ardatjew, F. Leferink
{"title":"Experiment to educate ESD phenomena to engineers","authors":"F. Buesink, R. Vogt-Ardatjew, F. Leferink","doi":"10.1109/EMCEurope.2019.8871745","DOIUrl":"https://doi.org/10.1109/EMCEurope.2019.8871745","url":null,"abstract":"The demonstration of electrostatic discharges with the experiment described in the IEEE EMC Education manual [1] is excellent for education of personnel in production and handling of electronic equipment. To educate design and test engineers a device was built with additional elements. It now demonstrates the effect of a fast rise-time transient, shows how the phenomenon can be transported by wires or cabling and an introduces the diversion of the discharge by designing the path of least impedance. A metal base-plate was added for portability and to serve as a defined target for discharges.","PeriodicalId":225005,"journal":{"name":"2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"84 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123109725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
On-site Waveform Characterization at Static Meters Loaded with Electrical Vehicle Chargers 装载电动汽车充电器的静态仪表的现场波形特性
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE Pub Date : 2019-10-17 DOI: 10.1109/EMCEurope.2019.8871469
Tom Hartman, M. Pous, M. Azpúrua, Ferran Silva, F. Leferink
{"title":"On-site Waveform Characterization at Static Meters Loaded with Electrical Vehicle Chargers","authors":"Tom Hartman, M. Pous, M. Azpúrua, Ferran Silva, F. Leferink","doi":"10.1109/EMCEurope.2019.8871469","DOIUrl":"https://doi.org/10.1109/EMCEurope.2019.8871469","url":null,"abstract":"For assessing the underlying problem behind the static meter misreadings, a measurement technique must be developed for characterizing the currents that static meters are usually exposed to. In previous studies it was shown that misreadings of the static meters occur when impulsive currents are drawn from the net, even with standalone commercial off the shelf equipment. Time domain electromagnetic interference (EMI) measurements create a novel opportunity for analyzing these noisy waveforms and identifying their fundamental parameters. The next step is extending this measurement approach to on-site scenarios in which these kind of waveforms coexist in superposition with other components that are properly measured by the static meter when they occur alone. This especially holds for up and coming technologies like electric vehicle (EV) charging stations. The characterization is intended in the future for describing realistic waveforms that can be used as new standardized type-testing signals, which will be employed to produce novel standards. Time Domain Electromagnetic Interference Measurement and Post-processing System (TEMPS) software is used in conjunction with a low cost baseband digitizer to measure the waveforms of EV chargers on four different lines, that is the three phases (L1, L2, and L3) and the neutral line (N) simultaneously. To distinguish the impulsive nature of the waveforms a statistical approach is performed in the form of an amplitude probability distribution (APD) diagram. Furthermore the multichannel capability of the low cost digitizer is utilized to achieve a frequency range extension by using two probes simultaneously with different frequency ranges.","PeriodicalId":225005,"journal":{"name":"2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129011389","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Geometry and Loading Effects on Performances of Mode-Stirred Reverberation Chambers: An Experimental Study 几何和载荷对模态搅拌混响室性能影响的实验研究
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE Pub Date : 2019-09-03 DOI: 10.1109/EMCEurope.2019.8872134
Ludivine Le Bars, J.-F. Rosnarho, P. Besnier, J. Sol, F. Sarrazin, E. Richalot
{"title":"Geometry and Loading Effects on Performances of Mode-Stirred Reverberation Chambers: An Experimental Study","authors":"Ludivine Le Bars, J.-F. Rosnarho, P. Besnier, J. Sol, F. Sarrazin, E. Richalot","doi":"10.1109/EMCEurope.2019.8872134","DOIUrl":"https://doi.org/10.1109/EMCEurope.2019.8872134","url":null,"abstract":"In this paper, we aim at highlighting the specific roles of the geometry and loading in a mode-stirred reverberation chamber. A geometrical modification is achieved through the introduction of several metallic caps on the cavity walls, in order to fulfill chaoticity requirements. Loading modifications are achieved by putting absorbers on ground. Tests have been performed in three reverberation chambers of different dimensions, and thus, of different lowest usable frequencies. Respective and combined roles of both types of modification are analyzed and clarified.","PeriodicalId":225005,"journal":{"name":"2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"249 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121359478","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
LTE Physical Layer Vulnerability Test to Different Types of Jamming Signals LTE物理层对不同干扰信号的脆弱性测试
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE Pub Date : 2019-09-02 DOI: 10.1109/EMCEurope.2019.8872052
Grecia Romero, V. Deniau, Olivier Stienne
{"title":"LTE Physical Layer Vulnerability Test to Different Types of Jamming Signals","authors":"Grecia Romero, V. Deniau, Olivier Stienne","doi":"10.1109/EMCEurope.2019.8872052","DOIUrl":"https://doi.org/10.1109/EMCEurope.2019.8872052","url":null,"abstract":"This paper presents an analysis of the susceptibility of the LTE physical layer in the presence of jamming signals. Commercial jammers are often characterized by the frequency bands that they cover. The jamming signal generally sweeps quickly and periodically the frequency band, with a fixed sweep period (SP). According to the jammer model, the frequency band, the power and the sweep period can be different. In this communication, we study the potential impact of a jamming signal according to its power and its sweep period in order to analyze the disturbing mechanisms. The quality of the LTE uplink is analyzed through the measurements of three parameters: Error Vector Magnitude (EVM), Occupied BandWidth (OBW) and Adjacent Channel Leakage-power Ratio (ACLR).","PeriodicalId":225005,"journal":{"name":"2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115406023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Thermo-fluorescent images of electric and magnetic near-fields of a High Impedance Surface 高阻抗表面电磁场近场的热荧光图像
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE Pub Date : 2019-09-02 DOI: 10.1109/EMCEurope.2019.8871884
H. Ragazzo, D. Prost, F. Issac, S. Faure, J. Carrey, J. Bobo
{"title":"Thermo-fluorescent images of electric and magnetic near-fields of a High Impedance Surface","authors":"H. Ragazzo, D. Prost, F. Issac, S. Faure, J. Carrey, J. Bobo","doi":"10.1109/EMCEurope.2019.8871884","DOIUrl":"https://doi.org/10.1109/EMCEurope.2019.8871884","url":null,"abstract":"Characterization of the electromagnetic field emitted by various sources (antenna, radar...) is an important issue, either for civil or defense applications. The measurement of the electromagnetic field may be performed by a local probe, but the infrared thermography imaging is an alternative way. We have recently successfully implemented this technique in the domain of visible light. As in the infrared method, a thin film (sensitive to either electric field or magnetic field) is heated by the emitted field. But here the film is coated with a polymer doped with fluorescent molecules. As the fluorescent emission depends on the temperature of the film, we get a thermofluorescent sensor. The results presented here illustrate that new method: both magnetic and electric field imaging of a High Impedance Surface have thus been obtained.","PeriodicalId":225005,"journal":{"name":"2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129845871","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Influence of Dielectric Permittivity on Radiated Immunity in Real and Emulated Far-Fields 介质介电常数对真实和模拟远场辐射抗扰度的影响
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE Pub Date : 2019-09-02 DOI: 10.1109/EMCEurope.2019.8871964
M. Koohestani, R. Perdriau, M. Ramdani
{"title":"Influence of Dielectric Permittivity on Radiated Immunity in Real and Emulated Far-Fields","authors":"M. Koohestani, R. Perdriau, M. Ramdani","doi":"10.1109/EMCEurope.2019.8871964","DOIUrl":"https://doi.org/10.1109/EMCEurope.2019.8871964","url":null,"abstract":"This paper presents the impact of dielectric permittivity on radiated immunity of integrated circuits (ICs) in far-field, extending in detail a technique recently proposed by the authors. To this end, the IEC 10 cm 10 cm square PCB with an equivalent patch as a rough approximation of an IC was considered in two different far-field conditions: (1) on a TEM cell aperture, and (2) in a far-field zone of a radiating antenna. In (2), the PCB was considered in horizontal and vertical orientations. The patch was then loaded by small solid piece of demetalized low-loss substrate of two different relative permittivities to examine the load presence influence on the radiated immunity. The wave impedance was used as the criterion. Results show that, in both cases, the load presence lowers the wave impedance, disregarding the PCB orientation with respect to the antenna in scenario (2). Moreover, no improvements due to the variation of the load permittivity value were observed in the E / H ratio distribution in a TEM cell similar to those obtained with the PCB oriented perpendicularly to the antenna in a real far-field zone. In the case where the PCB is parallel to the antenna, further improvement in the wave impedance was observed for a loaded PCB with a higher permittivity value.","PeriodicalId":225005,"journal":{"name":"2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"119 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124161360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Effective Approach to Mitigate IC Radiated Susceptibility in EM Far-Field Region 一种有效降低电磁远场IC辐射磁化率的方法
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE Pub Date : 2019-09-02 DOI: 10.1109/EMCEurope.2019.8872059
M. Koohestani, R. Perdriau, M. Ramdani
{"title":"An Effective Approach to Mitigate IC Radiated Susceptibility in EM Far-Field Region","authors":"M. Koohestani, R. Perdriau, M. Ramdani","doi":"10.1109/EMCEurope.2019.8872059","DOIUrl":"https://doi.org/10.1109/EMCEurope.2019.8872059","url":null,"abstract":"An effective approach to mitigate the radiated susceptibility of integrated circuits (ICs) to electromagnetic (EM) disturbances in far-field zone is described. It relies on dielectric loading which confines the reactive fields inside the dielectric load to improve the immunity of ICs independently of frequency without impairing IC performance. A transverse electromagnetic (TEM) cell was used to simulate and measure loaded and unloaded versions of an IC. An indirect measurement demonstrated that the susceptibility of a commercial microcontroller (ATMEL SAM3S4B) was significantly reduced (~48% less failure rate for a loaded compared to an unloaded IC) thanks to that technique. Moreover, it was shown that the immunities to both E− and H−fields were enhanced in presence of a non-ferromagnetic dielectric material being much less expensive than commonly used ferrites. The overall results demonstrate the effectiveness of the proposed technique as a potential candidate to mitigate the radiated susceptibility of electronic devices.","PeriodicalId":225005,"journal":{"name":"2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127400916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Rigorous Method to extrapolate Radiated Susceptibility from Near-Field Scan Immunity 一种从近场扫描免疫推断辐射磁化率的严密方法
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE Pub Date : 2019-09-02 DOI: 10.1109/EMCEurope.2019.8872110
A. Boyer
{"title":"A Rigorous Method to extrapolate Radiated Susceptibility from Near-Field Scan Immunity","authors":"A. Boyer","doi":"10.1109/EMCEurope.2019.8872110","DOIUrl":"https://doi.org/10.1109/EMCEurope.2019.8872110","url":null,"abstract":"Near-field injection or near-field scan immunity is a promising method for the analysis of the susceptibility of electronic boards and circuits. The resulting immunity map provides a precise localization of the sensitive area to electromagnetic disturbances to a given near-field source. However, the extrapolation of the immunity to another radiating source, either in near or far-field, is not trivial. This paper aims at proposing a rigorous post-processing method of near-field scan immunity results to extrapolate radiated immunity in other disturbance conditions, e.g. far-field illumination. The method is described and validated through simulation case studies.","PeriodicalId":225005,"journal":{"name":"2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121589317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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