介质介电常数对真实和模拟远场辐射抗扰度的影响

M. Koohestani, R. Perdriau, M. Ramdani
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引用次数: 0

摘要

本文介绍了介质介电常数对集成电路远场辐射抗扰度的影响,详细介绍了作者最近提出的一种技术。为此,在两种不同的远场条件下,考虑了具有等效贴片的IEC 10 cm 10 cm方形PCB,作为IC的粗略近似:(1)在TEM单元孔径上,(2)在辐射天线的远场区域。在(2)中,PCB在水平和垂直方向上被考虑。然后在贴片上加载两种不同相对介电常数的小块去金属化低损耗衬底,研究负载存在对辐射抗扰度的影响。采用波阻抗作为判据。结果表明,在两种情况下,负载的存在降低了波阻抗,而不考虑场景(2)中PCB相对于天线的方向。此外,在TEM单元中,负载介电常数值的变化没有导致E / H比分布的改善,类似于在实际远场区中PCB垂直于天线的情况。在PCB与天线平行的情况下,对于具有较高介电常数值的负载PCB,观察到波阻抗的进一步改善。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of Dielectric Permittivity on Radiated Immunity in Real and Emulated Far-Fields
This paper presents the impact of dielectric permittivity on radiated immunity of integrated circuits (ICs) in far-field, extending in detail a technique recently proposed by the authors. To this end, the IEC 10 cm 10 cm square PCB with an equivalent patch as a rough approximation of an IC was considered in two different far-field conditions: (1) on a TEM cell aperture, and (2) in a far-field zone of a radiating antenna. In (2), the PCB was considered in horizontal and vertical orientations. The patch was then loaded by small solid piece of demetalized low-loss substrate of two different relative permittivities to examine the load presence influence on the radiated immunity. The wave impedance was used as the criterion. Results show that, in both cases, the load presence lowers the wave impedance, disregarding the PCB orientation with respect to the antenna in scenario (2). Moreover, no improvements due to the variation of the load permittivity value were observed in the E / H ratio distribution in a TEM cell similar to those obtained with the PCB oriented perpendicularly to the antenna in a real far-field zone. In the case where the PCB is parallel to the antenna, further improvement in the wave impedance was observed for a loaded PCB with a higher permittivity value.
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