An Effective Approach to Mitigate IC Radiated Susceptibility in EM Far-Field Region

M. Koohestani, R. Perdriau, M. Ramdani
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Abstract

An effective approach to mitigate the radiated susceptibility of integrated circuits (ICs) to electromagnetic (EM) disturbances in far-field zone is described. It relies on dielectric loading which confines the reactive fields inside the dielectric load to improve the immunity of ICs independently of frequency without impairing IC performance. A transverse electromagnetic (TEM) cell was used to simulate and measure loaded and unloaded versions of an IC. An indirect measurement demonstrated that the susceptibility of a commercial microcontroller (ATMEL SAM3S4B) was significantly reduced (~48% less failure rate for a loaded compared to an unloaded IC) thanks to that technique. Moreover, it was shown that the immunities to both E− and H−fields were enhanced in presence of a non-ferromagnetic dielectric material being much less expensive than commonly used ferrites. The overall results demonstrate the effectiveness of the proposed technique as a potential candidate to mitigate the radiated susceptibility of electronic devices.
一种有效降低电磁远场IC辐射磁化率的方法
提出了一种有效降低集成电路对远场电磁干扰辐射敏感性的方法。它依靠介电负载限制介电负载内部的无功场来提高集成电路的抗扰度,而不影响集成电路的性能。横向电磁(TEM)单元用于模拟和测量加载和卸载版本的IC。间接测量表明,由于该技术,商用微控制器(ATMEL SAM3S4B)的磁化率显着降低(与未加载的IC相比,加载的故障率降低了48%)。此外,研究表明,在非铁磁性介质材料的存在下,对E -和H -场的免疫力都得到了增强,这种材料比常用的铁氧体便宜得多。总体结果表明,所提出的技术作为减轻电子器件辐射敏感性的潜在候选技术是有效的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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