The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.最新文献

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A morphology-independent wafer level rivet packaging with Lego-like assembly 一种不受形貌影响的晶圆级铆钉封装,具有类似乐高的组装
Eunsung Lee, Woon-Bae Kim, I. Song, C. Moon, M. Kang, H. Kim, K. Chun
{"title":"A morphology-independent wafer level rivet packaging with Lego-like assembly","authors":"Eunsung Lee, Woon-Bae Kim, I. Song, C. Moon, M. Kang, H. Kim, K. Chun","doi":"10.1109/SENSOR.2005.1497488","DOIUrl":"https://doi.org/10.1109/SENSOR.2005.1497488","url":null,"abstract":"The authors have successfully demonstrated an alternative method for high yield packaging process, offering a morphological insensitive and wafer level process. It enables not only the encapsulation to be hermetic but also the vias to be electrically-interconnected simultaneously. The mushroom structure of cap wafer makes the seal-line of solder void-free and the assembly process easier in wafer-alignment, giving room for the mismatched-volume between solder and trench. The mushroom structure is formed by SF/sub 6/-based isotropic Si etch and the solder of Sn is electroplated by thick photoresist lithography. The vias are successfully sealed with solders shaped like a dome at the top corner and electrically interconnected. A gross leak detection of pressurized dye-penetration shows that this scheme is morphologically insensitive compared with the \"face-to-face\" bonding method.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"21 1","pages":"1977-1980 Vol. 2"},"PeriodicalIF":0.0,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81274955","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
2-D and 3-D tactile pin display using SMA micro-coil actuator and magnetic latch 2-D和3-D触觉引脚显示采用SMA微线圈驱动器和磁锁
T. Matsunaga, W. Makishi, K. Totsu, M. Esashi, Y. Haga
{"title":"2-D and 3-D tactile pin display using SMA micro-coil actuator and magnetic latch","authors":"T. Matsunaga, W. Makishi, K. Totsu, M. Esashi, Y. Haga","doi":"10.1109/SENSOR.2005.1496422","DOIUrl":"https://doi.org/10.1109/SENSOR.2005.1496422","url":null,"abstract":"A 2D and 3D tactile pin display has been fabricated and developed. Character and graphic information are dynamically displayed by making the pin array move up and down. Shape memory alloy (SMA) micro-coil actuators contract and make the pins move up and down when the SMA actuator is heated by supplying electrical current. A magnetic material tube is attached to each pin and a permanent magnet fixes the position of the pins' up or down state. The mechanism solves problems of heat storage and electrical consumption of the SMA actuator because the current is supplied only when the pins move. A 2D tactile pin display which has a 100 (10/spl times/10) pin array has been developed and successfully operated. The tactile information is displayed sequentially every 0.3 sec and the pins are latched at 0.1 N by magnetic force. The pins are arranged at a pitch of 2.5 mm and move 2 mm up and down. A multi-step magnetic latch has been developed for a 3D expression. By using these mechanisms, several types of tactile information, e.g. 2D, 3D, dynamic motions, can be easily displayed.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"1 1","pages":"325-328 Vol. 1"},"PeriodicalIF":0.0,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81082404","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
Novel fabrication method of self positioned and focal length tuned microlens 一种新型自定位焦距调谐微透镜制造方法
Seihwan Jung, Kook-Nyung Lee, Y. Jang, Yong-Kweon Kim
{"title":"Novel fabrication method of self positioned and focal length tuned microlens","authors":"Seihwan Jung, Kook-Nyung Lee, Y. Jang, Yong-Kweon Kim","doi":"10.1109/SENSOR.2005.1496433","DOIUrl":"https://doi.org/10.1109/SENSOR.2005.1496433","url":null,"abstract":"We report a solid microlens with self-positioning and tuned focal length using hydrophobic effects and electrowetting. We propose a novel fabrication method aligning the centers of electrodes and hydrophobic pattern simultaneously using one photomask. The proposed fabrication method offers a solid microlens by using a UV curable polymer. The focal length of the liquid microlens can be tuned to the targeted value by applying voltage to the electrodes before UV exposure solidification. Experiments showed that the tuning range of focal length by using electrowetting is 0.43 mm. It covers the initial focal length deviation 0.21 mm of the microlens. Seven samples showed an initial distribution from 1.78 to 1.58 mm in focal length. Their focal lengths are controlled by applying voltages from 1.77 to 1.82 mm. Volume contraction and following focal length change were evaluated, and optical losses are measured to be 0.92 and 0.49 dB in red and green, respectively. The measured surface roughness is 4 nm, which is applicable to optical micro-systems.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"117 1","pages":"372-375 Vol. 1"},"PeriodicalIF":0.0,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86193346","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Microdevice components for a cellular microsurgery suite 用于细胞显微手术套件的微设备组件
W.C. Chang, C. Keller, E. Hawkes, D. Sretavan
{"title":"Microdevice components for a cellular microsurgery suite","authors":"W.C. Chang, C. Keller, E. Hawkes, D. Sretavan","doi":"10.1109/SENSOR.2005.1496395","DOIUrl":"https://doi.org/10.1109/SENSOR.2005.1496395","url":null,"abstract":"We describe microfabricated tools that will enable cellular microsurgery for direct repair of injured nerves leading to restoration of function. Our proposed neural repair strategy uses a suite of novel microfabricated tools to cut, manipulate, align and then reconnect individual axons (nerve cell processes) with micron-scale precision. Each of these functions has been individually demonstrated using prototype devices. Additionally, we have developed assembly techniques to integrate the required tools onto a single, 3D multifunctional MEMS platform, designed to facilitate the semi-autonomous execution of all of the required surgical functions in proper sequences.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"156 1","pages":"209-212 Vol. 1"},"PeriodicalIF":0.0,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77532305","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Multifunctional tool for expanding AFM-based applications 扩展基于afm的应用程序的多功能工具
S. Deladi, N. Tas, G. Krijnen, M. Elwenspoek
{"title":"Multifunctional tool for expanding AFM-based applications","authors":"S. Deladi, N. Tas, G. Krijnen, M. Elwenspoek","doi":"10.1109/SENSOR.2005.1496383","DOIUrl":"https://doi.org/10.1109/SENSOR.2005.1496383","url":null,"abstract":"A multifunctional tool which expands the application field of atomic force microscope-based surface modification is presented. The AFM-probe can be used for surface modification and in-situ characterization at the same time, due to a special configuration with two cantilevers. Various applications from different fields are presented, which were carried out with one and the same tool: in-situ characterization of wear generated with and without local lubrication (tribology), fountain-pen lithography in which material is deposited or removed (physical chemistry), and electrochemical metal deposition (electrochemistry).","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"6 1","pages":"159-162 Vol. 1"},"PeriodicalIF":0.0,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88922581","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Replication of microneedle arrays using vacuum casting and hot embossing 用真空铸造和热压印复制微针阵列
A. Trautmann, F. Heuck, C. Mueller, P. Ruther, O. Paul
{"title":"Replication of microneedle arrays using vacuum casting and hot embossing","authors":"A. Trautmann, F. Heuck, C. Mueller, P. Ruther, O. Paul","doi":"10.1109/SENSOR.2005.1497348","DOIUrl":"https://doi.org/10.1109/SENSOR.2005.1497348","url":null,"abstract":"The replication of silicon (Si) microneedle arrays via a soft silicone rubber mold into various polymers, namely SU-8, epoxy, cycloolefine copolymer (COC), and polycarbonate (PC) is reported. Vacuum casting and hot embossing are used to fabricate polymer wafers with 98 microneedle array dies with an individual size of 6/spl times/6 mm/sup 2/ each containing 841 microneedles. The same soft rubber mold can be used for both replication methods. Needles with heights of 75 /spl mu/m and 150 /spl mu/m, tip radii and edge radii below 2 /spl mu/m and 1 /spl mu/m, respectively, are excellently reproduced. The application of the needles in allergy testing is demonstrated.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"52 1","pages":"1420-1423 Vol. 2"},"PeriodicalIF":0.0,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87065082","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
Cylindrical pillars in silicon PCR chip enhance the performance of DNA amplification 硅质PCR芯片的圆柱形柱增强了DNA扩增的性能
S. H. Park, Moon Yun Jung, Tae Hwan Yoon, H. Pyo
{"title":"Cylindrical pillars in silicon PCR chip enhance the performance of DNA amplification","authors":"S. H. Park, Moon Yun Jung, Tae Hwan Yoon, H. Pyo","doi":"10.1109/SENSOR.2005.1497394","DOIUrl":"https://doi.org/10.1109/SENSOR.2005.1497394","url":null,"abstract":"This paper presents a new design of a silicon PCR chamber with cylindrical pillars on the bottom which showed good performance in heat transfer and DNA amplification efficiency comparable to thermocycler. We successfully amplified the full DNA sequence of N-acetyl transferase 2 (NAT2) gene, cancer related gene, from the genomic DNA. NAT2 transfers the acetyl moiety to toxic compounds coming into the cell. Acetylated toxic compounds may change their 3D structure and lose toxic activities. We observed temperature difference between top and bottom of PCR mixture even by more than 7/spl deg/C when general PCR micro chamber was heated and adjusted to be a constant temperature by electric power (data not shown). This may influence bad effects on the yield and reproducibility of DNA amplification in PCR lab-on-a-chip. Cylindrical pillars expanding surface area facing to PCR mixture are thought to be helpful to get higher efficiency of heat transfer. We also made a thin film type of heater through FPC manufacturing process. That requires low cost and is applicable for mass production. Pillar-formed PCR chamber and FPC film heater showed good performance of DNA amplification, comparable to thermocycler and higher than that of nonpillar PCR chamber.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"19 1","pages":"1604-1607 Vol. 2"},"PeriodicalIF":0.0,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87225880","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A membrane actuator based on piezo-polymer-composite technology [microvalve application example] 一种基于压电-聚合物复合技术的薄膜执行器[微阀应用实例]
E. Just, D. Pustan, P. Woias
{"title":"A membrane actuator based on piezo-polymer-composite technology [microvalve application example]","authors":"E. Just, D. Pustan, P. Woias","doi":"10.1109/SENSOR.2005.1496526","DOIUrl":"https://doi.org/10.1109/SENSOR.2005.1496526","url":null,"abstract":"This paper presents the design, fabrication and characterization of a novel piezo-polymer-composite membrane actuator. Based on this membrane actuator, a valve for liquids and gases is presented as an application example. In measurements with water, the functionality of the valve was demonstrated for a pressure up to 650 hPa with a maximum flow of 1.5 l/h and a leak rate of less than 4 ml/h in the closed state. Moreover, a novel low-cost fabrication technology was developed that combines laser micromachining and polymer insert casting.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"1 1","pages":"753-756 Vol. 1"},"PeriodicalIF":0.0,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90613093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Sensitivity improvement of diaphragm type ultrasonic sensors by complementary piezoelectric polarization 压电互补极化提高膜片型超声传感器灵敏度
K. Yamashita, M. Okuyama
{"title":"Sensitivity improvement of diaphragm type ultrasonic sensors by complementary piezoelectric polarization","authors":"K. Yamashita, M. Okuyama","doi":"10.1109/SENSOR.2005.1497521","DOIUrl":"https://doi.org/10.1109/SENSOR.2005.1497521","url":null,"abstract":"A simple electrode configuration of piezoelectric ultrasonic sensor has been proposed and the sensitivity has been improved. The new electrode configuration enables to use two parts of both the positive and negative piezoelectric polarizations and to improve the sensitivity compared to conventional sensors by summing up both the absolute outputs. Optimal electrode sizes have been found by theoretical calculation and the sensor with the optimal configuration has been fabricated. The sensitivity of the new sensor has been improved 50% compared with that of conventional sensors.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"25 1","pages":"2115-2118 Vol. 2"},"PeriodicalIF":0.0,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85679468","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
Micromachined Fourier transform spectrometer on silicon optical bench platform 硅光学台架微机械傅立叶变换光谱仪
Kyoungsik Yu, Daesung Lee, U. Krishnamoorthy, N. Park, O. Solgaard
{"title":"Micromachined Fourier transform spectrometer on silicon optical bench platform","authors":"Kyoungsik Yu, Daesung Lee, U. Krishnamoorthy, N. Park, O. Solgaard","doi":"10.1109/SENSOR.2005.1497306","DOIUrl":"https://doi.org/10.1109/SENSOR.2005.1497306","url":null,"abstract":"We present a miniaturized Fourier transform spectrometer implemented on a silicon optical bench platform. The optical and opto-mechanical components of a Michelson interferometer, such as a beam splitter, micromirrors, MEMS actuators, and fiber U-grooves, are simultaneously fabricated by micromachining of the device layer of a silicon-on-insulator wafer. Our bulk micromachining process combines the flexible definition capability of deep reactive ion etching with the good surface quality provided by anisotropic KOH wet-etching. A spectral resolution of 45 nm near 1550 nm wavelength is demonstrated.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"93 1","pages":"1250-1254 Vol. 2"},"PeriodicalIF":0.0,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85694734","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 98
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