用真空铸造和热压印复制微针阵列

The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. Pub Date : 2005-06-05 DOI:10.1109/SENSOR.2005.1497348

A. Trautmann, F. Heuck, C. Mueller, P. Ruther, O. Paul

{"title":"用真空铸造和热压印复制微针阵列","authors":"A. Trautmann, F. Heuck, C. Mueller, P. Ruther, O. Paul","doi":"10.1109/SENSOR.2005.1497348","DOIUrl":null,"url":null,"abstract":"The replication of silicon (Si) microneedle arrays via a soft silicone rubber mold into various polymers, namely SU-8, epoxy, cycloolefine copolymer (COC), and polycarbonate (PC) is reported. Vacuum casting and hot embossing are used to fabricate polymer wafers with 98 microneedle array dies with an individual size of 6/spl times/6 mm/sup 2/ each containing 841 microneedles. The same soft rubber mold can be used for both replication methods. Needles with heights of 75 /spl mu/m and 150 /spl mu/m, tip radii and edge radii below 2 /spl mu/m and 1 /spl mu/m, respectively, are excellently reproduced. The application of the needles in allergy testing is demonstrated.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"52 1","pages":"1420-1423 Vol. 2"},"PeriodicalIF":0.0000,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"Replication of microneedle arrays using vacuum casting and hot embossing\",\"authors\":\"A. Trautmann, F. Heuck, C. Mueller, P. Ruther, O. Paul\",\"doi\":\"10.1109/SENSOR.2005.1497348\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The replication of silicon (Si) microneedle arrays via a soft silicone rubber mold into various polymers, namely SU-8, epoxy, cycloolefine copolymer (COC), and polycarbonate (PC) is reported. Vacuum casting and hot embossing are used to fabricate polymer wafers with 98 microneedle array dies with an individual size of 6/spl times/6 mm/sup 2/ each containing 841 microneedles. The same soft rubber mold can be used for both replication methods. Needles with heights of 75 /spl mu/m and 150 /spl mu/m, tip radii and edge radii below 2 /spl mu/m and 1 /spl mu/m, respectively, are excellently reproduced. The application of the needles in allergy testing is demonstrated.\",\"PeriodicalId\":22359,\"journal\":{\"name\":\"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.\",\"volume\":\"52 1\",\"pages\":\"1420-1423 Vol. 2\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-06-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SENSOR.2005.1497348\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SENSOR.2005.1497348","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 20

摘要

报道了硅(Si)微针阵列通过软硅橡胶模具复制到各种聚合物中，即SU-8，环氧树脂，环烯烃共聚物(COC)和聚碳酸酯(PC)。采用真空铸造和热压印技术制备聚合物晶圆，采用98个微针阵列模具，单个尺寸为6/spl倍/6 mm/sup 2/ /，每个包含841个微针。相同的软橡胶模具可以用于两种复制方法。针叶高度为75和150的针叶，针尖半径和针尖边缘半径分别低于2和1。演示了针在过敏试验中的应用。

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Replication of microneedle arrays using vacuum casting and hot embossing

The replication of silicon (Si) microneedle arrays via a soft silicone rubber mold into various polymers, namely SU-8, epoxy, cycloolefine copolymer (COC), and polycarbonate (PC) is reported. Vacuum casting and hot embossing are used to fabricate polymer wafers with 98 microneedle array dies with an individual size of 6/spl times/6 mm/sup 2/ each containing 841 microneedles. The same soft rubber mold can be used for both replication methods. Needles with heights of 75 /spl mu/m and 150 /spl mu/m, tip radii and edge radii below 2 /spl mu/m and 1 /spl mu/m, respectively, are excellently reproduced. The application of the needles in allergy testing is demonstrated.

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来源期刊

The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.

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