A. Trautmann, F. Heuck, C. Mueller, P. Ruther, O. Paul
{"title":"Replication of microneedle arrays using vacuum casting and hot embossing","authors":"A. Trautmann, F. Heuck, C. Mueller, P. Ruther, O. Paul","doi":"10.1109/SENSOR.2005.1497348","DOIUrl":null,"url":null,"abstract":"The replication of silicon (Si) microneedle arrays via a soft silicone rubber mold into various polymers, namely SU-8, epoxy, cycloolefine copolymer (COC), and polycarbonate (PC) is reported. Vacuum casting and hot embossing are used to fabricate polymer wafers with 98 microneedle array dies with an individual size of 6/spl times/6 mm/sup 2/ each containing 841 microneedles. The same soft rubber mold can be used for both replication methods. Needles with heights of 75 /spl mu/m and 150 /spl mu/m, tip radii and edge radii below 2 /spl mu/m and 1 /spl mu/m, respectively, are excellently reproduced. The application of the needles in allergy testing is demonstrated.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"52 1","pages":"1420-1423 Vol. 2"},"PeriodicalIF":0.0000,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SENSOR.2005.1497348","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 20
Abstract
The replication of silicon (Si) microneedle arrays via a soft silicone rubber mold into various polymers, namely SU-8, epoxy, cycloolefine copolymer (COC), and polycarbonate (PC) is reported. Vacuum casting and hot embossing are used to fabricate polymer wafers with 98 microneedle array dies with an individual size of 6/spl times/6 mm/sup 2/ each containing 841 microneedles. The same soft rubber mold can be used for both replication methods. Needles with heights of 75 /spl mu/m and 150 /spl mu/m, tip radii and edge radii below 2 /spl mu/m and 1 /spl mu/m, respectively, are excellently reproduced. The application of the needles in allergy testing is demonstrated.