2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)最新文献

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Parameters of radiation-induced centers for simulation of irradiated power devices 辐照功率装置模拟辐射诱导中心参数
R. Siemieniec, J. Lutz, W. Sudkamp, R. Herzer
{"title":"Parameters of radiation-induced centers for simulation of irradiated power devices","authors":"R. Siemieniec, J. Lutz, W. Sudkamp, R. Herzer","doi":"10.1109/MIEL.2002.1003168","DOIUrl":"https://doi.org/10.1109/MIEL.2002.1003168","url":null,"abstract":"Irradiation techniques are widely used for carrier lifetime control, especially in power devices, because of their good reproducibility. Simulation of these devices is however lacking due to missing or incomplete recombination center data, despite the availability of suitable recombination models. In this work, we used center data estimated by DLTS and lifetime measurements for the simulation of electron radiated devices and compare the results with the measured device characteristics.","PeriodicalId":221518,"journal":{"name":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132639072","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Process-related reliability issues toward sub-100 nm device regime 亚100纳米器件制程相关的可靠性问题
C. Chang, T. Chao, H. Lin, C. Chien
{"title":"Process-related reliability issues toward sub-100 nm device regime","authors":"C. Chang, T. Chao, H. Lin, C. Chien","doi":"10.1109/MIEL.2002.1003159","DOIUrl":"https://doi.org/10.1109/MIEL.2002.1003159","url":null,"abstract":"Crucial process-related reliability issues, such as boron penetration, plasma charging damage, metal-gate processing, and emerging high-k dielectrics, as device scaling progresses towards sub-100 nm technology nodes are discussed in this paper.","PeriodicalId":221518,"journal":{"name":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128611559","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Multifunctional temperature sensor 多功能温度传感器
T. Nenov, Z. Nenova
{"title":"Multifunctional temperature sensor","authors":"T. Nenov, Z. Nenova","doi":"10.1109/MIEL.2002.1003188","DOIUrl":"https://doi.org/10.1109/MIEL.2002.1003188","url":null,"abstract":"The paper deals with V/sub 2/O/sub 5/-based ceramic temperature sensors. They are composed of two integrated sensors: a ceramic based thermistor and a critical temperature resistor formed by additional treatment in the ceramics structure. The main characteristics of the multifunctional temperature sensor are studied in the paper.","PeriodicalId":221518,"journal":{"name":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","volume":"35 9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131747272","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
SiC device technology for high voltage and RF power applications 用于高压和射频功率应用的SiC器件技术
Mikael Östling, Sang-Mo Koo, S. Lee, E. Danielsson, M. Domeij, C. Zetterling
{"title":"SiC device technology for high voltage and RF power applications","authors":"Mikael Östling, Sang-Mo Koo, S. Lee, E. Danielsson, M. Domeij, C. Zetterling","doi":"10.1109/MIEL.2002.1003145","DOIUrl":"https://doi.org/10.1109/MIEL.2002.1003145","url":null,"abstract":"Recently, silicon carbide (SiC) has drawn considerable attention as a suitable semiconductor material for high power, high frequency, high temperature and radiation resistant devices. The commercialized substrates and the experimental device prototypes in SiC show the promises while the continued improvements in fabrication techniques are required for economically viable productions to be widespread. This paper reviews the progress and current issues in SiC device process technology and the state-of-the art SiC devices for high voltage and RF power applications.","PeriodicalId":221518,"journal":{"name":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116083335","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
H/sup +/ irradiation for reverse recovery softness and reliability of power p-i-n diodes for snubberless applications H/sup +/辐照反向恢复柔软度和可靠性功率p-i-n二极管无缓冲应用
P. Cova, R. Menozzi, M. Portesine
{"title":"H/sup +/ irradiation for reverse recovery softness and reliability of power p-i-n diodes for snubberless applications","authors":"P. Cova, R. Menozzi, M. Portesine","doi":"10.1109/MIEL.2002.1003160","DOIUrl":"https://doi.org/10.1109/MIEL.2002.1003160","url":null,"abstract":"We describe a coupled experimental-numerical study of the effect of proton irradiation on the inductive turn-off of fast-recovery p-i-n diodes for snubberless applications. The goal is to avoid the large overvoltages and spurious oscillations that may arise at switch-off and jeopardize the diode's reliability. We evaluated different proton irradiation profiles in order to extract indications on the optimum trade-off among switching speed, recovery softness, overvoltage and spurious oscillation damping.","PeriodicalId":221518,"journal":{"name":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","volume":"2016 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121488903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Error minimization of sensor pulse signal delay-time measurements 传感器脉冲信号延迟时间测量误差最小化
B. Vojnovic
{"title":"Error minimization of sensor pulse signal delay-time measurements","authors":"B. Vojnovic","doi":"10.1109/MIEL.2002.1003190","DOIUrl":"https://doi.org/10.1109/MIEL.2002.1003190","url":null,"abstract":"Measurement of delay-time (arrival-time) of pulse signals from various sensors (optical detectors, radiation detectors, etc.) have important applications in many scientific and technical fields. The measurement chain contains the following parts: sensor (detector), electronic preamplifier of pulse signal from sensor, signal processing circuits, and timing discriminator. We analyze the influence of pulse amplitude and rise-time variations, noise effects and energy (charge) sensitivity of discriminator triggering on the over-all timing resolution for three types of discriminator. The ultimate goal in all measurements is to determine pulse arrival-time with minimum error, which depends on signal parameters as well as on discriminator circuit parameters.","PeriodicalId":221518,"journal":{"name":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117331824","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Estimation of parametric sensitivity for defects size distribution in VLSI defect/fault analysis VLSI缺陷/故障分析中缺陷尺寸分布的参数敏感性估计
M. Blyzniuk, I. Kazymyra
{"title":"Estimation of parametric sensitivity for defects size distribution in VLSI defect/fault analysis","authors":"M. Blyzniuk, I. Kazymyra","doi":"10.1109/MIEL.2002.1003317","DOIUrl":"https://doi.org/10.1109/MIEL.2002.1003317","url":null,"abstract":"The parametric sensitivity of defect size distribution in VLSI defect/fault analysis is evaluated. The use of special software tool FIESTA for the computational experiment aimed at estimation of the significance of parameters in expressions approximating the actual defect distribution is considered. The obtained experimental results and their usefulness have been analysed.","PeriodicalId":221518,"journal":{"name":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123297639","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Hot-carrier NMOST degradation at periodic drain signal 周期性漏极信号的热载流子极端退化
P. Habaš
{"title":"Hot-carrier NMOST degradation at periodic drain signal","authors":"P. Habaš","doi":"10.1109/MIEL.2002.1003361","DOIUrl":"https://doi.org/10.1109/MIEL.2002.1003361","url":null,"abstract":"Hot-carrier-induced NMOST degradation is considered for periodic drain-source signal. A general lifetime relationship is derived on the basis of quasi-static approximation and a lifetime model for DC condition. Two practical cases are discussed: sinusoidal drain signal from 0V to V/sub DD/ (circuit supply) and trapezoidal signal from 0V to V/sub DD/ (in special case, it reduces to triangular waveform). Compact, practically useful, formulas are proposed. The model for AC conditions is based on the same physical approximations that are traditionally used in the derivation of physically crude, but well applicable lifetime models in DC conditions. A strategy is proposed for building-in HC-reliability of NMOSFET subjected to a periodic large drain-signals in analog circuits.","PeriodicalId":221518,"journal":{"name":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127668752","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Formal specification and preliminary design of an asynchronous traffic light controller 一种异步交通灯控制器的正式说明和初步设计
Aleksandra Seši, Veljko Malbaša
{"title":"Formal specification and preliminary design of an asynchronous traffic light controller","authors":"Aleksandra Seši, Veljko Malbaša","doi":"10.1109/MIEL.2002.1003349","DOIUrl":"https://doi.org/10.1109/MIEL.2002.1003349","url":null,"abstract":"An exercise in formal specification and design of an asynchronous controller that leads to the CMOS implementation is presented. In this paper we focus on the formal specification of the controller by using communication sequential process, a tool based on Hoare's CSP. We also present the procedure, based on Martin's synthesis method, used to formally derive the preliminary design of the asynchronous traffic light controller. The formal specification and circuit implementation are formally verified with a verification tool package STTools, capable of model checking and simulating programs.","PeriodicalId":221518,"journal":{"name":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130014525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Multipurpose thermal sensor based on Seebeck effect 基于塞贝克效应的多用途热传感器
D. Randjelović, G. Kaltsas, Ž. Lazić, M. Popovic
{"title":"Multipurpose thermal sensor based on Seebeck effect","authors":"D. Randjelović, G. Kaltsas, Ž. Lazić, M. Popovic","doi":"10.1109/MIEL.2002.1003189","DOIUrl":"https://doi.org/10.1109/MIEL.2002.1003189","url":null,"abstract":"This paper reports a multipurpose thermal sensor based on the Seebeck effect. The sensor has thermocouples with a multilayer structure consisting of one thermocouple strip laying on the insulating membrane and the other one under the first thermoelement and the membrane. The vertical arrangement allows a greater number of thermocouples to be placed on a given chip area. Central and lateral thermistors are placed near hot and cold thermocouple junctions, respectively, and serve for determination of the temperature difference established on the chip. Experimental results confirm that the same structure could be used as a thermal converter and a gas flow meter.","PeriodicalId":221518,"journal":{"name":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","volume":"2016 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127444742","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
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