2019 International Conference on Electronics Packaging (ICEP)最新文献_第5页

Inspection / Metrology Evaluation of Fine Pitch Test Vehicles for Advanced Packages 先进封装小间距试验车的检验/计量评估

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI: 10.23919/ICEP.2019.8733543

Feng Xue, Joe Zou, Cindy Han, C. Reynolds, T. Wassick, Glenn Pomerantz, Jason L. Frankel, R. Bonam, C. Woychik, M. Tsuriya

{"title":"Inspection / Metrology Evaluation of Fine Pitch Test Vehicles for Advanced Packages","authors":"Feng Xue, Joe Zou, Cindy Han, C. Reynolds, T. Wassick, Glenn Pomerantz, Jason L. Frankel, R. Bonam, C. Woychik, M. Tsuriya","doi":"10.23919/ICEP.2019.8733543","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733543","url":null,"abstract":"The demand for integrated silicon packages is driving packaging advancements for increasingly fine circuit pattern designs. Due to the thinner copper and finer features required for advanced packaging, copper line defects can significantly impact yield and reliability. Industry Automated Optical Inspection (AOI) capabilities for packaging features are reaching detection limits.Phase One of the iNEMI metrology project surveyed industry capability and completed a gap analysis. This work established the basis for the current activities in Phase Two. A fine featured test vehicle was designed and fabricated using thin film processing technologies on both glass and silicon substrates to evaluate and assess the limits of today’s AOI metrology equipment. The test vehicle also provided a platform to develop future metrology capability required to close the technical gaps with respect to product requirements and process and material capabilities.The test vehicle samples were provided to various industrial AOI equipment suppliers to evaluate their capabilities in evaluating fine lines and spaces. The integrity of the fine wiring lines and spaces was compared between a control pattern and known defects utilizing wiring patterns from 10 μm lines and spaces to 1 μm lines and spaces. Various types of features including different orientations were evaluated: a) Line width violations; b) Spacing violations; c) Excess copper or missing copper; d) Shorts; e) Opens. This paper will review the details of the Phase Two test vehicle and the results from the AOI evaluations, and present a roadmap for the next phase of the study with test vehicles on organic substrates.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126449929","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere 甲酸气氛下预氧化Cu微粒的Cu-Cu键合方法

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI: 10.23919/ICEP.2019.8733490

Runhua Gao, Jiahui Li, Yu-An Shen, H. Nishikawa

{"title":"A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere","authors":"Runhua Gao, Jiahui Li, Yu-An Shen, H. Nishikawa","doi":"10.23919/ICEP.2019.8733490","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733490","url":null,"abstract":"Many power semiconductor devices now require high tolerance of current density and reliability at high temperature, therefore Cu-Cu bonding using an insert material has raised the level of concerns for its great thermal stability and conductivity. In this study, a low-pressure bonding process was developed to achieve a Cu-Cu bonding using preoxidized Cu microparticles under formic acid atmosphere. The Cu microparticles were preoxidized to generate oxide films and Cu oxide nanostructures, which were then reduced and bonded at 300 °C under formic acid atmosphere to achieve a Cu-Cu bonding. Shear strength of the Cu-Cu bondings were tested to optimize the parameters of bonding process. Fracture surfaces of the Cu-Cu bonding, as well as cross-sectional microstructures, were observed by scanning electrical microscope (SEM) and components were identified by X-ray diffraction (XRD) to investigate the bonding mechanism. The findings reveal that the oxide films and the nanostructures play key roles in this reduction bonding process, which is a promising method to obtain a Cu-Cu bonding satisfying the requirements of power device packaging.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130951927","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Construction and Verification of Novel Insulation Defect Location System with High Space Resolution for Next Generation Power Module 新一代电源模块高空间分辨率绝缘缺陷定位系统的构建与验证

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI: 10.23919/ICEP.2019.8733578

Junya Maki, T. Matsuzoe, M. Kozako, M. Hikita, Y. Nakamura, K. Taniguchi, Y. Ikeda, K. Okamoto

引用次数: 1

Effects of electroless copper plating on crystal continuity in via bottom 化学镀铜对孔底晶体连续性的影响

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI: 10.23919/ICEP.2019.8733433

Y. Kitahara, Joonhaeng Kang

引用次数: 1

Surface Analyses of Oxidized Cu-Fe-Zn-P Lead Frames 氧化Cu-Fe-Zn-P引线框架的表面分析

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI: 10.23919/ICEP.2019.8733471

Shi Chao, Jen-Hsiang Liu, Wei-Chen Huang, Jenn-Ming Song, Po-Yen Shen, Chi-Lin Huang, Lung-Tang Hung, Chin-Huang Chang

引用次数: 0

Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature 纳米铜浆料在pt催化甲酸蒸气中低温烧结成铜键

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI: 10.23919/ICEP.2019.8733407

F. Mu, Hui Ren, Lei Liu, Yinghui Wang, G. Zou, T. Suga

引用次数: 2

Au–Sn Soldering Using a Micro-heater to Restrain Excess Temperature Rise Inside the Package 使用微加热器抑制封装内部温度过高的金锡焊接

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI: 10.23919/ICEP.2019.8733519

H. Mizusaki, Toshiro Sato, M. Sonehara

{"title":"Au–Sn Soldering Using a Micro-heater to Restrain Excess Temperature Rise Inside the Package","authors":"H. Mizusaki, Toshiro Sato, M. Sonehara","doi":"10.23919/ICEP.2019.8733519","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733519","url":null,"abstract":"The high-melting point solder, approximately 300°C, is often used for assembling reflow-capable devices. When thermally sensitive devices such as PZT sensors with a Curie temperature of approximately 250 °C are encased in a package using solder, the temperature inside the package must be below 250 °C and precisely measured to avoid thermal damage. In this study, the authors proposed a novel in-situ temperature measurement method inside the package based on a chip-sized thermometer. A new soldering method using a micro-heater was developed to heat solder locally without overheating inside the package. In the conventional soldering method of heating the whole package, the temperature inside the package reached 260 °C; in the new soldering method, it was kept to 180 °C. Moreover, the temperature distribution inside the package was examined in detail by transient heat transfer analysis. The analysis results were in agreement with the experimental results using the two soldering methods. From the analysis results, it was found that the electrically conductive vias inside the package assisted in the transfer of heat to the solder and a Si lid played a role as the heat transfer path.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116793024","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Suppression of Backside Damage in Stealth Dicing 抑制隐形掷骰子时的背面伤害

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI: 10.23919/ICEP.2019.8733542

Natsuki Suzuki, T. Ohba

引用次数: 3

Heatsink design using spiral-fins considering additive manufacturing 考虑增材制造的螺旋翅片散热器设计

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI: 10.23919/ICEP.2019.8733558

Shingo Otake, Y. Tateishi, H. Gohara, R. Kato, Y. Ikeda, V. Parque, Muhammed Khairi Faiz, M. Yoshida, T. Miyashita

{"title":"Heatsink design using spiral-fins considering additive manufacturing","authors":"Shingo Otake, Y. Tateishi, H. Gohara, R. Kato, Y. Ikeda, V. Parque, Muhammed Khairi Faiz, M. Yoshida, T. Miyashita","doi":"10.23919/ICEP.2019.8733558","DOIUrl":"https://doi.org/10.23919/ICEP.2019.8733558","url":null,"abstract":"In recent years, there have been increasing the number of power modules which is required with high performance, miniaturization and weight saving. But these requires cause high heat generation density for power module, which gets junction operation temperature to rise. Cooling unit is thus greatly demanded for high heat dissipation. The simple shaped heatsinks (straight-fin type and pin fin type) were generally used. But they have the limit of cooling performance. In this report, we have developed new heatsink shape to cope with rapidly increasing of the cooling requirement. Cooling performance is shown to thermal resistance and pressure loss. We evaluated them by thermal fluid analysis. In this approach, the spiral-fin heatsink with spiral curved channels has excellent cooling performance. This shape is the unique point in this report. This is because the shape with three-dimensional regular curve has not been studied. The spiral-fin heatsink has many factors (fin thickness, fin pitch, the number of channels, etc.). These factors affect cooler performance. We changed these factors to determine the best shape of spiral-fin. As a result, the best shape is 14.9[%] lower than the straight-fin type in thermal resistance.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127318849","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

ICEP 2019 Partner Organizations ICEP 2019合作伙伴组织

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI: 10.23919/icep.2019.8733536

引用次数: 0