纳米铜浆料在pt催化甲酸蒸气中低温烧结成铜键

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI:10.23919/ICEP.2019.8733407

F. Mu, Hui Ren, Lei Liu, Yinghui Wang, G. Zou, T. Suga

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引用次数: 2

摘要

研究了在pt催化的甲酸蒸气中烧结纳米cu膏体的低温全cu键合，证明其具有较大的表面氧化耐受性。通过pt催化甲酸蒸气处理，可以显著提高氧化Cu与Cu的结合强度。通过界面分析了解其作用机理。

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Nano-Cu paste sintering in Pt-catalyzed formic acid vapor for Cu bonding at a low temperature

A low temperature all-Cu bonding via the sintering of nano-Cu paste in Pt-catalyzed formic acid vapor was studied, which was demonstrated with a large tolerance of surface oxidation. The bonding strength of oxidized-Cu to Cu could be significantly improved via the treatment of Pt-catalyzed formic acid vapor. The interfacial analysis was carried out to understand the mechanisms.

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2019 International Conference on Electronics Packaging (ICEP)

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