Proceedings of 1st International Symposium on Plasma Process-Induced Damage最新文献

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Gate Material Dependence Of Process Charging Damage In Thin Gate Oxide 薄栅极氧化物中工艺充电损伤的栅极材料依赖性
Proceedings of 1st International Symposium on Plasma Process-Induced Damage Pub Date : 1996-05-13 DOI: 10.1109/PPID.1996.715228
A. Acovic, A. Ray, J. Sun, J. Herman, T. Furukawa, R. Geiger, K. Beyer, V. McGahay, S. Greco, W. Abadeer
{"title":"Gate Material Dependence Of Process Charging Damage In Thin Gate Oxide","authors":"A. Acovic, A. Ray, J. Sun, J. Herman, T. Furukawa, R. Geiger, K. Beyer, V. McGahay, S. Greco, W. Abadeer","doi":"10.1109/PPID.1996.715228","DOIUrl":"https://doi.org/10.1109/PPID.1996.715228","url":null,"abstract":"Effects of plasma induced charging on dielectric integrity in a CMOS technology with n- and p- type polysilicon gates have been studied in detail. We show that p-gates are much more sensitive to charging than n-gates. Charge to breakdown in capacitors with a large p-type polysilicon plate is also reduced by charging damage, in spite of their low antenna ratios. We attribute this sensitivity of p-type gates to the low QBD of p-type gate capacitors for electron injection from the gate. By optimizing the fabrication processes, the amount of charging damage has been reduced to a negligible value, and good quality gate oxide has been achieved. Care must be exercised when interpreting QBD and leakage data on capacitors, to eliminate the effects of process induced charging.","PeriodicalId":206175,"journal":{"name":"Proceedings of 1st International Symposium on Plasma Process-Induced Damage","volume":"197 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131882631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Characterisation of a Gasonics A1000 Microwave Photoresist Ashing System using the CHARM-2 Plasma Charging Monitor 用CHARM-2等离子体充电监测仪表征Gasonics A1000微波光刻胶灰化系统
Proceedings of 1st International Symposium on Plasma Process-Induced Damage Pub Date : 1996-05-13 DOI: 10.1109/PPID.1996.715212
A. Cowley
{"title":"Characterisation of a Gasonics A1000 Microwave Photoresist Ashing System using the CHARM-2 Plasma Charging Monitor","authors":"A. Cowley","doi":"10.1109/PPID.1996.715212","DOIUrl":"https://doi.org/10.1109/PPID.1996.715212","url":null,"abstract":"A GaSonics Aura 1000 Microwave photoresist ashing system was chosen for evaluation by National Semiconductor (UK) Ltd. (NSUK). The system was characterised with the CHARM-2 charge monitor to investigate the effects of asher system recipe parameters on plasma charging. The results showed that the Aura 1000 system produced a plasma charging free resist strip process at operating pressures >2.1 Torr. It was further discovered and confirmed that the Aura 1000 produced significant levels of UV photon bombardment if the process pressure fell below 2.1 Torr. The CHARM-2 charge monitor was also shown to be a quick and effective method of characterising the charging of silicon substrates exposed to a processing toot utilising a gas plasma","PeriodicalId":206175,"journal":{"name":"Proceedings of 1st International Symposium on Plasma Process-Induced Damage","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124063788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Plasma Etching Process Induced Closed-loop Metal Pattern Damage 等离子体蚀刻工艺引起的闭环金属图案损伤
Proceedings of 1st International Symposium on Plasma Process-Induced Damage Pub Date : 1996-05-13 DOI: 10.1109/PPID.1996.715242
P. Chu, Ming-Chih Yeh, Chih-Chicn Hung, T. Lin, Ying-Chen Chao
{"title":"Plasma Etching Process Induced Closed-loop Metal Pattern Damage","authors":"P. Chu, Ming-Chih Yeh, Chih-Chicn Hung, T. Lin, Ying-Chen Chao","doi":"10.1109/PPID.1996.715242","DOIUrl":"https://doi.org/10.1109/PPID.1996.715242","url":null,"abstract":"A new type of plasma process induced closed-loop metal interconnect damages were observed on the 0.5/spl mu/ SRAM production wafers after metal etching processing. The poor heat dissipation and the local plasma non-uniform within the closed-loop area had been identified to be the root causes. The degree of plasma process induced metal damage can be improved by reducing the wafer surface temperature and the magnetic field in the reactive plasma.","PeriodicalId":206175,"journal":{"name":"Proceedings of 1st International Symposium on Plasma Process-Induced Damage","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129526158","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Study of Plasma Induced Thin Oxide Damage During AlSiCu Etch AlSiCu蚀刻过程中等离子体诱导薄氧化物损伤的研究
Proceedings of 1st International Symposium on Plasma Process-Induced Damage Pub Date : 1996-05-13 DOI: 10.1109/PPID.1996.715217
Lianjun Liu, G.H.J. Phua
{"title":"Study of Plasma Induced Thin Oxide Damage During AlSiCu Etch","authors":"Lianjun Liu, G.H.J. Phua","doi":"10.1109/PPID.1996.715217","DOIUrl":"https://doi.org/10.1109/PPID.1996.715217","url":null,"abstract":"The impact of plasma charging on thin oxides was studied on a hexode-type reactive ion etching (RIE) system. Time-to-breakdown (Tbd) of oxide was used to characterise the plasma damage. Experimental work showed that hexode- type RIE batch system exhibits position dependent charging damage.The top pedestals gave higher plasma damage when compared to the center and bottom pedestals. This higher charging at the top pedestal can be reduced by a dome-shaped insulator cap installed on top of the hexode.","PeriodicalId":206175,"journal":{"name":"Proceedings of 1st International Symposium on Plasma Process-Induced Damage","volume":"128 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126274456","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Plasma Charging and Damage Evaluation of Reactive Ion Etching using Surface Photovoltage Technique and Corona Pulsed Deep Depletion Technique 表面光电压技术和电晕脉冲深耗尽技术的等离子体充电和反应离子刻蚀损伤评价
Proceedings of 1st International Symposium on Plasma Process-Induced Damage Pub Date : 1996-05-13 DOI: 10.1109/PPID.1996.715209
S. Nagalingami, M. Fung, S. Thind
{"title":"Plasma Charging and Damage Evaluation of Reactive Ion Etching using Surface Photovoltage Technique and Corona Pulsed Deep Depletion Technique","authors":"S. Nagalingami, M. Fung, S. Thind","doi":"10.1109/PPID.1996.715209","DOIUrl":"https://doi.org/10.1109/PPID.1996.715209","url":null,"abstract":"The Reactive Ion Etches (RIE) used in a 0.8 /spl mu/m BICMOS process flow were investigated for plasma damage. The Reactive Ion Etches are done in a parallel plate single wafer plasma etcher. We employed two novel techniques, the Surface Photovoltage Vs Bias (SPV-V) technique and the Corona-Pulsed Deep-Depletion technique [1,2], to monitor the plasma damage across the entire SiO/sub 2/-Si stack. i.e. the plasma damage in the oxide dielectric, at the oxide-silicon interface, and in the bulk silicon. The two techniques revealed that the RIE processes result in oxide surface charge, interface state generation and bulk silicon damage. A low temperature forming gas treatment at 400/spl deg/C for 30 mins anneals the oxide surface charge and the oxide-silicon interface damage, but it does not completely anneal the bulk Si damage as measured by the minority carrier lifetime degradation. The nature of the bulk damage and its annealing characteristics over a wider temperature range (400/spl deg/C to 900/spl deg/C) will be summarized. Optimization of the etch process parameters to minimize the bulk Si damage will be reviewed.","PeriodicalId":206175,"journal":{"name":"Proceedings of 1st International Symposium on Plasma Process-Induced Damage","volume":"105 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124070060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Localized Pattern-Dependent Damage to Metal During Etch 蚀刻过程中金属的局部模式相关损伤
Proceedings of 1st International Symposium on Plasma Process-Induced Damage Pub Date : 1996-05-13 DOI: 10.1109/PPID.1996.715216
C. Gabriel
{"title":"Localized Pattern-Dependent Damage to Metal During Etch","authors":"C. Gabriel","doi":"10.1109/PPID.1996.715216","DOIUrl":"https://doi.org/10.1109/PPID.1996.715216","url":null,"abstract":"During etching of metal, localized damage to the metal was observed which depended strongly on the resist pattern. The damage occurred in regions where, before etch, a small area of resist was surrounded by a continuous sheet of resist. In those regions there was metal blistering, undercut, or even total loss of the metal. Apparently, a local plasma discharge such as microarcing occurs which causes localized melting and flowing of the metal. This phenomenon was found to be dependent on the metal etch process-higher bias power and higher wafer temperatures (conditions needed to etch some aluminum alloys) caused the problem, while more gentle conditions avoided it.","PeriodicalId":206175,"journal":{"name":"Proceedings of 1st International Symposium on Plasma Process-Induced Damage","volume":"141 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124782471","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Charging Effects In Ion Implantation: Measurements and Models 离子注入中的电荷效应:测量和模型
Proceedings of 1st International Symposium on Plasma Process-Induced Damage Pub Date : 1996-05-13 DOI: 10.1109/PPID.1996.715238
M. Current, M. Vella, W. Lukaszek
{"title":"Charging Effects In Ion Implantation: Measurements and Models","authors":"M. Current, M. Vella, W. Lukaszek","doi":"10.1109/PPID.1996.715238","DOIUrl":"https://doi.org/10.1109/PPID.1996.715238","url":null,"abstract":"A unified view of wafer charging effects during ion implantation has been developed based on (1) measurements of plasma current-voltage (J-V) characteristics with wafer-based, EEPROM sensors and (2) a viable model which describes the main features of the the J-V characteristics of the ion beam plasma at the wafer surface. The beam-plasma model includes contributions from the energetic ion beam, background slow ions created by collisions, ions created by arc discharges and thermal electrons. The model describes the positive and negative chargin behavior of \"raw\" ion beams (with no charge control systems) and ion beams combined with charge control sources of electrons, dilute plasmas or dense plasma floods.","PeriodicalId":206175,"journal":{"name":"Proceedings of 1st International Symposium on Plasma Process-Induced Damage","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134367978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Effect of Low-Temperature Anneal during Multilevel Metallization Process on Plasma-Induced Oxide Damage 多层金属化过程中低温退火对等离子体诱导氧化损伤的影响
Proceedings of 1st International Symposium on Plasma Process-Induced Damage Pub Date : 1996-05-13 DOI: 10.1109/PPID.1996.715234
K. Noguchi, T. Horiuchi
{"title":"Effect of Low-Temperature Anneal during Multilevel Metallization Process on Plasma-Induced Oxide Damage","authors":"K. Noguchi, T. Horiuchi","doi":"10.1109/PPID.1996.715234","DOIUrl":"https://doi.org/10.1109/PPID.1996.715234","url":null,"abstract":"It has been shown that oxide damage monitoring methods that depend on device characteristics without forming gas anneal can lead to a misleading conclusion if the devices have multilevel metallization (MLM). This is because metal etching-induced oxide damage is affected by low-temperature anneals as low as 300/spl deg/ during the MLM process. To correctly evaluate reliability of MOSFETs with various antenna structures after the MLM process, latent oxide damage must be monitored after a full process using stress tests such as hot carrier stress test.","PeriodicalId":206175,"journal":{"name":"Proceedings of 1st International Symposium on Plasma Process-Induced Damage","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123593440","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Mechanism of Stress-Induced Leakage Due to Plasma Charging and Effect of Oxide Thickness 等离子体充电应力致泄漏机理及氧化层厚度的影响
Proceedings of 1st International Symposium on Plasma Process-Induced Damage Pub Date : 1996-05-13 DOI: 10.1109/PPID.1996.715224
W. Abadeer, G. Hueckel, A. Acovic, A. Ray
{"title":"Mechanism of Stress-Induced Leakage Due to Plasma Charging and Effect of Oxide Thickness","authors":"W. Abadeer, G. Hueckel, A. Acovic, A. Ray","doi":"10.1109/PPID.1996.715224","DOIUrl":"https://doi.org/10.1109/PPID.1996.715224","url":null,"abstract":"Plasma charging causes gate oxide degradation and breakdown. In this paper a mechanisin is presented for P+ poly gates where the plasma charging during processing causes a stress induced Ieakage behavior (SILC) under accelerated life testing. The mechanism appears under positive gate bias for P+ poly-gated devices, and does not show under any bias conditions for N + poly-gated devices. The degradation exhibited a strong dependence on oxide thickness and temperature. The mechanism is explained in terms of enhanced degradation for the P+ poly-gated devices during processing and subsequent trap assisted-tunneling under accelerated life test.","PeriodicalId":206175,"journal":{"name":"Proceedings of 1st International Symposium on Plasma Process-Induced Damage","volume":"8 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114036475","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Control of RIE-induced Surface Damage and Junction Leakage Current in Field Isolation Process 电场隔离过程中rie致表面损伤和结漏电流的控制
Proceedings of 1st International Symposium on Plasma Process-Induced Damage Pub Date : 1996-05-13 DOI: 10.1109/PPID.1996.715237
T. Yamaguchi, T. Sasaki, H. Nikoh
{"title":"Control of RIE-induced Surface Damage and Junction Leakage Current in Field Isolation Process","authors":"T. Yamaguchi, T. Sasaki, H. Nikoh","doi":"10.1109/PPID.1996.715237","DOIUrl":"https://doi.org/10.1109/PPID.1996.715237","url":null,"abstract":"Surface damage induced by reactive ion etching (RIE) of SiN/SiO/sub 2/ stack used in the field isolation process was investigated in terms of its depth distribution and its correlation with junction leakage current. High leakage current is observed when oxidation induced stacking faults (OSF) are generated near bird's beaks in active regions from the Carbon-rich surface damage induced by so called stop-on-Si RIE prior to the field oxidation process. Control of both OSF and the junction leakage current at lower levels is made possible if the C-rich surface damage is eliminated either by chemical dry etching (CDE) treatment of the surface or by use of RIE conditions with lower ion energies.","PeriodicalId":206175,"journal":{"name":"Proceedings of 1st International Symposium on Plasma Process-Induced Damage","volume":" 11","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114051062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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