2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)最新文献

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The Effect of the Parallel-Plate Mode on Striplines in Inhomogeneous Dielectric Media 非均匀介质中平行板模对带状线的影响
Jiayi He, Shaohui Yong, Z. Kiguradze, A. Chada, B. Mutnury, J. Drewniak
{"title":"The Effect of the Parallel-Plate Mode on Striplines in Inhomogeneous Dielectric Media","authors":"Jiayi He, Shaohui Yong, Z. Kiguradze, A. Chada, B. Mutnury, J. Drewniak","doi":"10.1109/EMCSI38923.2020.9191661","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191661","url":null,"abstract":"Striplines are widely used in high speed printed circuit boards (PCB). When the stripline is in inhomogeneous dielectric media, its principle operation mode is quasi-TEM. In this case, the parallel-plate mode between two ground planes can be excited as a parasitic mode. This paper investigates the effect of this parasitic mode on striplines through simulations. The simulated S-parameters of striplines when this parallel-plate mode is excited and suppressed are compared. The measured S-parameters of striplines with and without the ground stitching vias are also compared. The impact of the parasitic mode on time domain crosstalk and eye diagram is also shown.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133793911","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design and Evaluation of a Spark Gap Based EM-fault Injection Setup 基于火花间隙的电磁故障注入装置设计与评价
A. Beckers, M. Kinugawa, Y. Hayashi, J. Balasch, I. Verbauwhede
{"title":"Design and Evaluation of a Spark Gap Based EM-fault Injection Setup","authors":"A. Beckers, M. Kinugawa, Y. Hayashi, J. Balasch, I. Verbauwhede","doi":"10.1109/EMCSI38923.2020.9191455","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191455","url":null,"abstract":"The rapid and widespread deployment of electronic devices operating in the field is bringing security issues into the spotlight. Fault injection, for instance, is a class of attacks that allows adversaries to bypass security-related capabilities by tampering with the normal functioning of a device. In this paper we describe a setup capable of faulting integrated circuits by exposing them to a pulsed magnetic field. The magnetic field is generated by discharging a pulse forming network made from a transmission line over an injection probe. The discharge is triggered by a spark gap based switch. We describe the mechanisms behind the different circuit components and evaluate the performance of the setup in practice. To the best of our knowledge, this is the first time a spark gap switch is used to build an electromagnetic (EM) pulse fault injection setup.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132875178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A Study of Small Aperture Diffraction 小孔径衍射的研究
H. Li
{"title":"A Study of Small Aperture Diffraction","authors":"H. Li","doi":"10.1109/EMCSI38923.2020.9191604","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191604","url":null,"abstract":"Bethe's interpretation of a small metallic aperture as an electric dipole and a magnetic dipole provides a method which makes electromagnetic leakage through a small metallic aperture be easily understood and predicted. This paper reviewed Bethe's theory for small aperture leakage. Unreasonable assumptions in the theory derivation were pointed out. Limitations and recommendations on its application were listed and suggested.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"35 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116599377","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis Of CPU Loading Effect On ESD Susceptibility CPU负载对ESD敏感性的影响分析
O. Izadi, H. Shumiya, Shota Konno, K. Araki, D. Pommerenke, Donghyun Kim
{"title":"Analysis Of CPU Loading Effect On ESD Susceptibility","authors":"O. Izadi, H. Shumiya, Shota Konno, K. Araki, D. Pommerenke, Donghyun Kim","doi":"10.1109/EMCSI38923.2020.9191545","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191545","url":null,"abstract":"Two complementary approaches are presented to help to understand how CPU loading affects the sensitivity of an electronic device to ESD (electrostatic discharge) stress. Both approaches rely on synchronized noise injection while the software is running at the desired load. One of the approaches monitors the device's current consumption while the other monitors the device's electromagnetic field to synchronize noise injections. These approaches revealed that as the CPU loading increases, the device becomes more active and hence more susceptible to ESD stress. Moreover, it was observed that, in each loading condition, the device randomly became susceptible. These complementary approaches enable the capturing of high/low active intervals as well as the injection of noise voltage to the desired activity, thus, allowing for the analysis of the effect of CPU loading on ESD susceptibility.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122057292","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Machine Learning Framework for Power Delivery Network Modelling 电力输送网络建模的机器学习框架
Soumya Sourav, A. Roy, Yi Cao, Shree Pandey
{"title":"Machine Learning Framework for Power Delivery Network Modelling","authors":"Soumya Sourav, A. Roy, Yi Cao, Shree Pandey","doi":"10.1109/EMCSI38923.2020.9191530","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191530","url":null,"abstract":"Traditional approach to power delivery network (PDN) design requires significant amount of time and iterations. In this work, we propose a machine learning-based approach to PDN design which significantly speeds up new PDN option evaluation. The quality metrics we use are package and printed circuit board (PCB) inductances and resistances and die bump voltage droop. The proposed AI architecture combines neural networks and regressor trees to predict inductance and resistance, and employs recurrent-neural-networks to predict voltage droop as a function of time. The proposed approach reduces PDN option evaluation time from weeks to minutes with an average prediction accuracy of 94%.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129713418","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Expedient Prediction of Eye Opening of High-Speed Links with Input Design Space Dimensionality Reduction 基于输入设计空间降维的高速链路开眼预测
Hanzhi Ma, Erping Li, A. Cangellaris, Xu Chen
{"title":"Expedient Prediction of Eye Opening of High-Speed Links with Input Design Space Dimensionality Reduction","authors":"Hanzhi Ma, Erping Li, A. Cangellaris, Xu Chen","doi":"10.1109/EMCSI38923.2020.9191544","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191544","url":null,"abstract":"We propose a new method, named Support Vector Regression-based Active Subspace, for the reduction of the dimensionality of the high-dimensional input space of design parameters pertinent to the predictive assessment of the eye opening prediction of high-speed links with IBIS-AMI transmitter and receiver equalization. We compare the method with Support Vector Regression model and Principal Component Analysis-based dimensionality reduction algorithm. Numerical results show that proposed method exhibits the best accuracy in predicting eye height, eye width, and eye width at 10−12 BER in the presence of correlated design variability.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127558154","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Magnetic Field Conversion Factor for the Van Veen Loop 范维恩环的磁场转换系数
J. Mclean
{"title":"The Magnetic Field Conversion Factor for the Van Veen Loop","authors":"J. Mclean","doi":"10.1109/EMCSI38923.2020.9191635","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191635","url":null,"abstract":"The Loop Antenna System (LAS) provides accurate measurements of the magnetic dipole moment of a compact source of magnetic field interference. Using the appropriate conversion factor, the output of LAS can be used to predict the magnetic field at a specified distance and height in a particular environment, e.g. over conducting ground. The conversion factor given in the CISPR 16-1-4 standard allows the LAS to replace conventional 60-cm shielded loop measurements on an open area test site (OATS). Here, a detailed, transparent derivation of the conversion factor is presented with the intent being to facilitate rapid, accurate, analytical computation of numerical values for the conversion factor. It is shown that, despite retardation of the electromagnetic field, a rational function accurately represents the conversion factor for standard test distances and thus the well-known Bode techniques for plotting and interpreting such functions can be applied effectively. Finally, the ability of the loop to respond to sources within the loop preferentially over external plane wave excitation is discussed and this gain in signal-to-noise ratio (SNR) is derived in terms of the conversion factor.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"119 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122469794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Numerical Analysis Approach to Aid in Launch Vehicle Lightning Effects Protection Design 辅助运载火箭防雷设计的数值分析方法
J. Kitaygorsky
{"title":"Numerical Analysis Approach to Aid in Launch Vehicle Lightning Effects Protection Design","authors":"J. Kitaygorsky","doi":"10.1109/EMCSI38923.2020.9191528","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191528","url":null,"abstract":"Lightning is a critical safety issue for all aerospace vehicles. Commercial aircraft are protected from the effects of lightning strikes per the FAA regulation. Some launch vehicles rely on lightning launch criteria rules to avoid lightning. That launch vehicles can and do get struck by lightning has been recently demonstrated by the Soyuz rocket during a satellite launch on May 27, 2019, through which the rocket persevered and went on to complete its mission successfully (it is unclear what kind of lightning protection design was implemented). In this work we discuss how numerical analysis provides an in-depth understanding of the effects of a lightning strike on a launch vehicle by simulating lightning coupling processes and obtaining transient levels throughout the vehicle on bonds, harnesses, and at box interfaces. This understanding aids in the vehicle lightning protection design and reduces elements of an expensive test program. We accomplish this through a simulation example of a notional launch vehicle.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"350 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123329120","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines 一阶表面阻抗边界条件的局限性及其对PCB传输线二维仿真的影响
Yuandong Guo, Donghyun Kim, Jiayi He, Shaohui Yong, Yuanzhuo Liu, X. Ye, J. Fan
{"title":"Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines","authors":"Yuandong Guo, Donghyun Kim, Jiayi He, Shaohui Yong, Yuanzhuo Liu, X. Ye, J. Fan","doi":"10.1109/EMCSI38923.2020.9191467","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191467","url":null,"abstract":"Signal integrity (SI) issue is a critical concern as the data rate continues to increase and SI analysis is heavily dependent on simulations. Inaccurate simulation data may result in inadequate design decisions influencing high-speed digital design and optimization. The surface impedance boundary condition (SIBC) concept is generally utilized in commercial electromagnetic (EM) solvers, which is considered to be an efficient technique as the interior region of the conductor of interest does not need to be included in the numerical procedure. The first-order SIBC has been incorporated into many EM simulation tools widely used in industries. In this paper, the limitations of the first-order SIBC in 2D simulations for PCB transmission lines are analyzed and demonstarted for the first time. Different PCB transmission lines with various cross-sectional geometries are simulated in a commercial 2D EM solver with and without the implementation of the first-order SIBC to reveal the effect on the simulated transmission line behaviors. It is found that the accuracy of the simulations with the first-order SIBC decreases as the edge of the signal conductor in the cross-section becomes narrower. The possible solutions are proposed to overcome the issue.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115414971","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Approximate Direct Inverse For Embedded Domain Decomposition Method 近似直接逆嵌入域分解方法
Jiaqing Lu, Jin-Fa Lee
{"title":"Approximate Direct Inverse For Embedded Domain Decomposition Method","authors":"Jiaqing Lu, Jin-Fa Lee","doi":"10.1109/EMCSI38923.2020.9191497","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191497","url":null,"abstract":"The embedded domain decomposition method (DDM) is a powerful tool for analyzing complex electromagnetic applications. It can decompose a computational domain into non-conformal subdomains and provide great flexibility in modeling and optimizing add-on components. However, convergence issues are found for embedded DDM, particularly at low frequencies. To overcome the problem, we propose approximate direct inverse (ADI) based on the principle component analysis (PCA) of the system equations. The ADI is utilized as an effective preconditioner ensuring robust convergence of the embedded DDM system.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132004280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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