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2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)最新文献

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Analysis of the Sampling Rate of Image Reconstruction Using Electromagnetic Waves Leaked From a Monitor 利用监视器泄漏的电磁波进行图像重建的采样率分析
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191660
D. Choi, Ho Seong Lee, J. Yook
{"title":"Analysis of the Sampling Rate of Image Reconstruction Using Electromagnetic Waves Leaked From a Monitor","authors":"D. Choi, Ho Seong Lee, J. Yook","doi":"10.1109/EMCSI38923.2020.9191660","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191660","url":null,"abstract":"Leakage electromagnetic waves usually leak from liquid crystal display(LCD) monitors, which are representative output devices of modern computers. In this paper, the image information of electromagnetic waves leaked from a FHD resolution monitor was analyzed using low sampling rate and frame averaging techniques.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126029935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Efficient Electromagnetic Analysis Based on Side-channel Measurement Focusing on Physical Structures 基于物理结构侧通道测量的高效电磁分析
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191622
Shinpei Wada, Youngwoo Kim, Daisuke Fujimoto, Y. Hayashi, N. Homma
{"title":"Efficient Electromagnetic Analysis Based on Side-channel Measurement Focusing on Physical Structures","authors":"Shinpei Wada, Youngwoo Kim, Daisuke Fujimoto, Y. Hayashi, N. Homma","doi":"10.1109/EMCSI38923.2020.9191622","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191622","url":null,"abstract":"In this paper, we study on improving efficiency of the electromagnetic analysis (EMA) based on side-channel measurement for revealing a secret key inside the cryptographic module. In this study, we focus on the specific physical structures of the printed circuit board (PCB) near the cryptographic module and conducted the EMA where the distribution of electric or magnetic field containing the secret key information is dominant. Based on the experimental results, we validated that the whole secret key information can be efficiently extracted by conducting the EMA using a single electric or magnetic probe on the location where a specific field is dominant due to the physical structure. By analyzing the physical structure of the PCB including the cryptographic module and considering the dominant field, the secret key information from the cryptographic module can be efficiently extracted.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124147118","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Table of Contents – Technical 目录-技术
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/emcsi38923.2020.9191654
{"title":"Table of Contents – Technical","authors":"","doi":"10.1109/emcsi38923.2020.9191654","DOIUrl":"https://doi.org/10.1109/emcsi38923.2020.9191654","url":null,"abstract":"","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"45 11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121959162","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
On the introduction of radiated emissions measurements below 30 MHz in CISPR 16 关于在CISPR 16中引入低于30兆赫的辐射发射测量
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191599
M. Wiles
{"title":"On the introduction of radiated emissions measurements below 30 MHz in CISPR 16","authors":"M. Wiles","doi":"10.1109/EMCSI38923.2020.9191599","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191599","url":null,"abstract":"Since 2010 CISPR product committees have become increasingly concerned about advances in technology, for example plasma televisions using some ISM (Industrial Scientific and Medical) frequency bands, that might impact the radio frequency spectrum control below 30 MHz. As a result, CISPR Subcommittee A (CISPR/A) has since been working on developing methods of radiated measurements to address this concern. This work is culminating in amendments to the basic standard CISPR 16 that are still in preparation and are currently forecast for publication through 2020 to 2021. CISPR product committees are currently tracking this work with the intention of referencing it as they adapt their own standards to this frequency range. This paper is designed to draw the attention of all users of EMC Anechoic Chambers to these important changes.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131321316","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Multi-physics Analysis of Polystyrene based RF Absorbers 聚苯乙烯基射频吸收剂的多物理场分析
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191498
Anoop Adhyapak, Zhong Chen
{"title":"Multi-physics Analysis of Polystyrene based RF Absorbers","authors":"Anoop Adhyapak, Zhong Chen","doi":"10.1109/EMCSI38923.2020.9191498","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191498","url":null,"abstract":"RF absorbers dissipate the incident electromagnetic fields into heat to the environment. Depending on the substrate of the absorber, different processes govern the heat transfer methodology like conduction, convection or radiation. In EMC applications, the absorbers can be subject to multiple applications with high incident fields. Hence, it is vital to investigate the thermal aspect of the absorbers experimentally or with multiphysics numerical tools. In this paper, polystyrene-based absorbers are inspected experimentally initially. The same test setup is modeled in Ansys HFSS and Ansys Icepak to simulate the EM and thermal behavior of the absorber. The simulation model is validated by comparing the simulation results to the experimental results. Based on the validation, further simulations are conducted to explore the temperature variations due to change in the measurement distances from the source to the absorber and the temperature variations over different frequencies. These simulations provide better insights into the temperature distribution inside the absorbers.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128204999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design of Metamaterial Impedance Matching Surfaces at Near Field for EMC Solutions 电磁兼容解决方案近场超材料阻抗匹配面设计
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191532
A. Khoshniat, R. Abhari
{"title":"Design of Metamaterial Impedance Matching Surfaces at Near Field for EMC Solutions","authors":"A. Khoshniat, R. Abhari","doi":"10.1109/EMCSI38923.2020.9191532","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191532","url":null,"abstract":"The wave impedance concept is employed in this paper to design an absorber of radiated emissions at a compliance failure frequency. Dimensions of the system box considered in this paper are electrically small at the failure frequency. This result in a complex wave impedance for the radiated emissions at the system box boundary which is in the near field region of the unintentional radiators on the system board. A metamaterial frequency selective absorber is developed to exhibit the target surface impedance for the wave impedance by finding an equivalent bulk material. It is shown that the most effective absorber in near field should conjugate match to the wave impedance at that location. To demonstrate the validity of this approach, the radiated electric fields leaked outside the system box with various material lining its top wall, from copper to the proposed metamaterial design are calculated using fullwave simulations. Obtained results prove that the proposed conjugate matching absorber provides 13.6 dB mitigation of radiated emissions which is 4.7 dB higher than that of a commercial absorber.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129516656","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Eavesdropping a (Ultra-)High-Definition Video Display from an 80 Meter Distance Under Realistic Circumstances 在真实情况下从80米距离窃听(超高清)视频显示
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191457
Pieterjan De Meulemeester, B. Scheers, G. Vandenbosch
{"title":"Eavesdropping a (Ultra-)High-Definition Video Display from an 80 Meter Distance Under Realistic Circumstances","authors":"Pieterjan De Meulemeester, B. Scheers, G. Vandenbosch","doi":"10.1109/EMCSI38923.2020.9191457","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191457","url":null,"abstract":"In this paper a method is presented which successfully reconstructs the video image of a video display unit (VDU) by exploiting its leakage emissions at a distance of 80 meters. The video image reconstruction is realized without any prior knowledge of the leaking VDU and by using commercial off-the-shelf material. The tested VDUs comprise of an UHD (ultra-high-definition) video display and a full HD (high-definition) video display, both employing an HDMI (high-definition multimedia interface) cable as a video data signaling interface linked to a notebook. The tested setups are located in an urban environment with sporadic radio emissions and occupied frequency bands. Subsequently, the methods and results are thoroughly discussed which give new insights into this video eavesdropping risk for improving video data security.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"77 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134189836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
An Induction Heating System Analysis Method based on Operating Conditions 基于工况的感应加热系统分析方法
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191572
Hyungmin Kang, Daehwan Lho, Hyunwook Park, T. Kong, Hyojin Choi, Joungho Kim
{"title":"An Induction Heating System Analysis Method based on Operating Conditions","authors":"Hyungmin Kang, Daehwan Lho, Hyunwook Park, T. Kong, Hyojin Choi, Joungho Kim","doi":"10.1109/EMCSI38923.2020.9191572","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191572","url":null,"abstract":"In this paper, we propose an induction heating system analysis method under operating conditions. In the induction heating system, the current of the coil generates an eddy current on the load surface, and heat is generated by the eddy current. At this time, a high level of current is applied depending on the operating conditions of the induction heating system. When the equivalent resistance and inductance of the coil and load are measured and applied to the time domain simulation in the stop condition, the output voltage and current show different results from the measured results. Therefore, we propose a simulation method that calculates the equivalent resistance and inductance in the operating conditions of the induction heating system, and verify the proposed method by measurements. When the proposed method is applied to the simulation, the errors of the output voltage and output current are reduced up to 90% compared to the conventional method when the time domain simulation results are compared with the measurements.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133227668","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis 商用USB IC软失效灵敏度测量方法及趋势分析
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191592
Runbing Hua, O. Hoseini, Zhekun Peng, H. Shumiya, Shota Konno, K. Araki, D. Pommerenke, Donghyun Kim
{"title":"Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis","authors":"Runbing Hua, O. Hoseini, Zhekun Peng, H. Shumiya, Shota Konno, K. Araki, D. Pommerenke, Donghyun Kim","doi":"10.1109/EMCSI38923.2020.9191592","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191592","url":null,"abstract":"An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133009877","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Differential Via Designs for Crosstalk Reduction in High-Speed PCBs 高速pcb中减少串扰的差分通孔设计
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191558
Junda Wang, Chaohui Xu, Shuai Zhong, S. Bai, Jongjoo Lee, Donghyun Kim
{"title":"Differential Via Designs for Crosstalk Reduction in High-Speed PCBs","authors":"Junda Wang, Chaohui Xu, Shuai Zhong, S. Bai, Jongjoo Lee, Donghyun Kim","doi":"10.1109/EMCSI38923.2020.9191558","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191558","url":null,"abstract":"With an increased data rate of high-speed PCBs, an increase in crosstalk degrades the signal integrity of the highspeed system. In most PCB designs, via-to-via coupling has the largest impact on crosstalk. Until now, multiple PCB design methods for crosstalk mitigation are proposed under the IC pin field area, such as increasing the distance between signal pairs, adding more ground vias in between the signal vias and placing signal pairs orthogonal to each other. However, such methods sacrifice the signal to ground (S:G) ratio and require a change in the IC package ball map. In this paper, two different via designs are proposed to reduce crosstalk without sacrificing the S:G ratio, while maintaining the package ball maps. In the first proposed design, crosstalk is mitigated through tilted drilling, where the vias are drilled with 45 degrees angle on the PCB. Differential via pairs located in different rows achieves orthogonality for crosstalk cancellation when viewed from the horizontal cross-section. In the second proposed design, additional intermediate vias are designed to achieve orthogonality between differential via pairs without changing the IC package ball map or the drilling direction. Using a 3D full-wave simulation tool, the two prosed designs are simulated. Simulation results demonstrate that both designs decrease in crosstalk with negligible change in insertion loss and return loss compared to the conventional via design up to 30 GHz range. The proposed methods can be directly applied to lower the crosstalk in the existing high-speed PCBs with minor adjustments in the PCB design while maintaining the same IC packages.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115022080","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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