Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis

Runbing Hua, O. Hoseini, Zhekun Peng, H. Shumiya, Shota Konno, K. Araki, D. Pommerenke, Donghyun Kim
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Abstract

An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 commercial USB devices in order to obtain an insight into the overall sensitivity trend of such systems and into the severity of different soft-failures. A new analysis method is proposed in this paper. The considered parameters in this study include: injected pulse widths, pulse rise time, current levels, USB standard of the DUTS, etc. Soft-failures started to occur at a current of around 1 A, and nearly all configurations would show errors above 6 A.
商用USB IC软失效灵敏度测量方法及趋势分析
在商用电子设备上,如USB接口上产生的静电放电(ESD)会引起集成电路的软失效,影响设备的正常工作。本文研究了14个商用USB设备的软故障行为,以了解此类系统的整体灵敏度趋势和不同软故障的严重程度。本文提出了一种新的分析方法。本研究考虑的参数包括:注入脉冲宽度、脉冲上升时间、电流水平、DUTS的USB标准等。软故障开始发生在电流为1 a左右,几乎所有的配置将显示错误超过6 a。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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