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2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)最新文献

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Numerical study on MRI RF-induced heating for the trauma screw implanted in three human models 三种人体模型创伤螺钉植入MRI射频加热的数值研究
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191563
Meiqi Xia, Jianfeng Zheng, Ji Chen
{"title":"Numerical study on MRI RF-induced heating for the trauma screw implanted in three human models","authors":"Meiqi Xia, Jianfeng Zheng, Ji Chen","doi":"10.1109/EMCSI38923.2020.9191563","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191563","url":null,"abstract":"This study investigates the radio frequency (RF)-induced heating for a common medical implanted device, the trauma screw, in different human models under 1.5 T and 3 T magnetic resonance imaging (MRI) systems. Three different human models, Duke, Ella, and Fats from the virtual family project, are used in the simulations. The human models and the device are loaded in a generic 32 ports RF coil. The screws with suitable sizes are implanted in four regions (hip, knee, shoulder, and wrist) for each human model. From the simulation results, the RF-induced heating near the device shows significantly difference within the models. Consequently, the clinically relevant RF induced heating can be patient specific and needs to be investigated individually.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132352160","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A collaborative optimization for floorplanning and pin assignment of 3D ICs based on GA-SA algorithm 基于GA-SA算法的三维集成电路布局与引脚分配协同优化
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191559
Qingxiang Hu, Mu-Shui Zhang
{"title":"A collaborative optimization for floorplanning and pin assignment of 3D ICs based on GA-SA algorithm","authors":"Qingxiang Hu, Mu-Shui Zhang","doi":"10.1109/EMCSI38923.2020.9191559","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191559","url":null,"abstract":"In this paper, a collaborative optimization for floorplaning and pin assignment of 3D ICs using genetic and simulated annealing(GA-SA) algorithm is presented. Layout problem is usually solved by using multi-objective function optimization developed from stochastic optimization algorithm. The weight value of multi-objective function has great impact on the final layout results. A hybrid algorithm combined Genetic and Simulated Annealing(GA-SA) algorithm is developed to find the weight values in the co-optimization. By this method, area, interconnection length, maximum temperature of 3D floorplanning, and partial return-path inductance of signal pins and mutual inductance of power/ground pins of pin assignment are well considered in the optimization procedure.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114907147","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Design and characterization of differential Signal Integrity interconnects at Millimeter-Wave PCB 毫米波PCB差分信号完整性互连的设计与表征
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191540
Kaisheng Hu
{"title":"Design and characterization of differential Signal Integrity interconnects at Millimeter-Wave PCB","authors":"Kaisheng Hu","doi":"10.1109/EMCSI38923.2020.9191540","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191540","url":null,"abstract":"In this paper, a Signal Integrity test board is designed to evaluate differential calibration and de-embedding methods at millimeter-Wave frequency band: Differential Crosstalk TRL (Thru-Reflect-Line) and Differential 2x-Thru de-embedding. For DUT's result, S21 phase delay are same, but differential Crosstalk TRL shows non-causality issue together with higher error at S21 amplitude. Finally 2x- Thru is selected at several typical de-embedding scenarios: PCB parameters extraction (Dk, Df and Surface Roughness) up to 67 GHz; Ultralow loss PCB material evaluation (Panasonic Meg 7, TUC TU933+, Nelco MW4000 and Isola Tachyon-100G); Multichannel skew test (less than 1 ps) with one port de-embedding.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116886666","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Meander Line Optimization for High-Speed Differential Transmission Lines 高速差动传输线的曲线优化
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191522
Sangkyu Jin, Soyoung Kim
{"title":"Meander Line Optimization for High-Speed Differential Transmission Lines","authors":"Sangkyu Jin, Soyoung Kim","doi":"10.1109/EMCSI38923.2020.9191522","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191522","url":null,"abstract":"Meander structures are often used to compensate signal skew in differential transmission lines in the Printed Circuit Board (PCB)s. However, it causes impedance discontinuity, which results in signal reflection. In this paper, we propose a design guideline to reduce signal reflection caused by impedance discontinuity. The best design was a loosely coupled differential transmission line with one large meander curve to reduce impedance mismatches. The proposed design is validated with measurement results.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115713105","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Determination of the Overvoltages Transmitted between the Power Transformers Windings subjected to Lightning Impulse 雷电冲击作用下电力变压器绕组间传输过电压的测定
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191618
P. Nicolae, M. Nicolae, Cristina-Maria Nitu, I. Nicolae
{"title":"Determination of the Overvoltages Transmitted between the Power Transformers Windings subjected to Lightning Impulse","authors":"P. Nicolae, M. Nicolae, Cristina-Maria Nitu, I. Nicolae","doi":"10.1109/EMCSI38923.2020.9191618","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191618","url":null,"abstract":"The paper presents a calculation method for the voltages transmitted between the windings of the power transformer while it is being subjected to the lightning impulse; it describes the reasoning and the analytical relations for the predetermination of the transmitted voltage. The modeling of the phenomenon of transmitting the voltage between the power transformer windings was achieved by using the MATLAB program, in order to make the calculation more efficient and to illustrate the corresponding waveforms of the transmitted voltage determined by calculation. The developed method was applied on two high power transformers: (a) 54/73 MVA, TTUS-ONAN, 110/15 / 6.6 kV power transformer; (b) 50/67 MVA, TTUS-ONAN, 132 / 13.8 / 6.6 kV power transformer. In both cases, it generated concrete results, which were validated by laboratory tests. The comparison of the results obtained by modeling with those obtained in the laboratory tests validates the proposed method for determining the overvoltages transmitted between the transformer windings subjected to the lightning impulse.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129182309","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Proficiency Testing Scheme of Conducted disturbance at mains terminals in 150kHz∼30MHz using Multi-items 在150kHz ~ 30MHz范围内使用多项目的主终端传导扰动能力测试方案
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191459
Mi Jincai, Chen Hui, Liu Qunxing, Liu Xin, Chu Rui, Song jun
{"title":"Proficiency Testing Scheme of Conducted disturbance at mains terminals in 150kHz∼30MHz using Multi-items","authors":"Mi Jincai, Chen Hui, Liu Qunxing, Liu Xin, Chu Rui, Song jun","doi":"10.1109/EMCSI38923.2020.9191459","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191459","url":null,"abstract":"The paper introduces a Proficiency Testing scheme of conducted disturbance at mains terminals in 150kHz∼30MHz using Multi-items method, compared with a single item Proficiency Testing scheme, test time and costs is greatly reduced, reliability is largely increased. 150 items which could generate comb signal with stable frequency and stable voltage in the frequency range of 150 kHz to 30MHz were developed. And the item could simulate the power supply, grounding and setup of the actual test sample. Mailed it to 101 participants in parallel to evaluates performance and identifies problems of participants.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121303141","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Wideband Tapered Microstrip Transmission Line (MTL) Volume Coil for 1.5T MRI Scanner 用于1.5T MRI扫描仪的宽带锥形微带传输线(MTL)体积线圈
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191656
M. Rajendran, E. Motovilova, S. Huang
{"title":"Wideband Tapered Microstrip Transmission Line (MTL) Volume Coil for 1.5T MRI Scanner","authors":"M. Rajendran, E. Motovilova, S. Huang","doi":"10.1109/EMCSI38923.2020.9191656","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191656","url":null,"abstract":"Wide bandwidth is a key requirement for Radio Frequency (RF) coils in the emerging body-part-dedicated portable Magnetic Resonance Imaging (MRI) due to the static field inhomogeneity caused by a short magnet. As the size of the magnet, either a superconducting magnet or a permanent magnet array (PMA), is reduced, the B0 field homogeneity is reduced significantly. The lowered B0 field homogeneity leads to an increase in the working bandwidth. A wideband RF coil helps to guarantee the excitation and reception of signals within a targeted field of view (FoV). In this paper, we propose single-tapered and dual-tapered wideband Microstrip Transmission Line (MTL) volume coil for a 1.5T MRI system with a short magnet. The fractional Full Width at Half Maximum (FWHM) bandwidth for the proposed tapered and dual tapered coils are 11.25% and 10.62%, respectively, which are 28.57% and 21.4% higher than that of the traditional non-tapered MTL volume coil, yet having a comparable B1 field intensity.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127005410","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Analysis of Electromagnetic Emission of Pantograph-catenary Arc to VOR 受电弓接触网弧对VOR的电磁发射分析
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191552
Yingchun Xiao, F. Zhu, Nan Lu, Yingying Chen, Qianqian Jiang, Xiao Yang
{"title":"Analysis of Electromagnetic Emission of Pantograph-catenary Arc to VOR","authors":"Yingchun Xiao, F. Zhu, Nan Lu, Yingying Chen, Qianqian Jiang, Xiao Yang","doi":"10.1109/EMCSI38923.2020.9191552","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191552","url":null,"abstract":"In order to analyze the influence of pantograph-catenary arc electromagnetic emission on airport Very high omnidirectional range (VOR) with High-Speed train(HST) passing the articulated neutral section(ANS), based on a large amount of electromagnetic emission test data, this paper analyzes the difference in error of test data and improve the regression analysis method, the amplitude-frequency characteristic curve of the arc in the omnidirectional beacon frequency band is fitted, and the influence of arc electromagnetic emission on the omnidirectional beacon of the airport is analyzed. The results show that: 1) The electromagnetic emission of the arc has a certain random characteristic. The maximum field strength is in articulated neutral section point, larger than the ordinary site.2) In modern electrified railway, the difference in error of the test data of neutral section is more obvious, and the ordinary least squares estimation method is not applicable for fit the amplitude-frequency characteristic curve. 3) When the distance of the electrified railway articulated neutral section point and the aircraft are less than 6.982km, it may affect the airport omnidirectional beacon signal.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"122 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127007365","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Increasing the EMI-resilience of Triplication-based Error Correction Codes for PAM-4 Line Coding in Harsh Electromagnetic Environments 提高PAM-4线路编码三重纠错码在恶劣电磁环境下的抗emi能力
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191631
Jonas Van Waes, J. Vankeirsbilck, Jonas Lannoo, D. Vanoost, D. Pissoort, J. Boydens
{"title":"Increasing the EMI-resilience of Triplication-based Error Correction Codes for PAM-4 Line Coding in Harsh Electromagnetic Environments","authors":"Jonas Van Waes, J. Vankeirsbilck, Jonas Lannoo, D. Vanoost, D. Pissoort, J. Boydens","doi":"10.1109/EMCSI38923.2020.9191631","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191631","url":null,"abstract":"When transmitting data within a harsh electromagnetic environment, Error Correction Codes have been used for many years. However, not all systems are able to overcome the incurred overhead by those Error Correction Codes. As a solution to the overhead, engineers opted for a Pulse Amplitude Modulation (PAM) technique to encode two bits into a single symbol. This line-coding technique, called PAM-4, reduces the overhead that is imposed by the Error Correction Codes. A trade-off for the reduced overhead is a reduced noise margin between each individual symbol. It is the goal of this paper to assess if different techniques and measures can be applied towards both the Error Correction Codes and the line coding to provide resilience against harsh electromagnetic conditions. This paper focuses on the occurrence of False Negatives: corrupted data deemed valid. By using a combination of techniques, it is possible to significantly reduce the amount of False Negatives within the Error Correction Codes.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130874514","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Intra-pair Length Matching by Asymmetric Dual Bend to Reduce Mode Conversion 基于非对称双弯曲的对内长度匹配减少模式转换
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2020-07-01 DOI: 10.1109/EMCSI38923.2020.9191468
Jianquan Lou, Juhi Garg, A. Bhobe, J. Goergen, Yang Tang
{"title":"Intra-pair Length Matching by Asymmetric Dual Bend to Reduce Mode Conversion","authors":"Jianquan Lou, Juhi Garg, A. Bhobe, J. Goergen, Yang Tang","doi":"10.1109/EMCSI38923.2020.9191468","DOIUrl":"https://doi.org/10.1109/EMCSI38923.2020.9191468","url":null,"abstract":"Asymmetric dual bend (ADB) technique for intrapair length matching of differential routing is proposed in this paper, to reduce the differential mode to common mode conversion in system. This layout technique helps in achieving lower EMI without impacting SI performance and with insignificant effect on PCB cost. Three types of asymmetric dual bend designs are evaluated in this paper, by simulating the EMI and SI performance in two layout scenarios i.e. fixed length and fixed location routing. The results illustrate that the asymmetric dual bend scheme can provide 10+ dB improvement for Scd21 in stripline layout and nearly 5dB improvement for microstrip layout. Several PCB coupons were also made, and the results match quite well between simulation and measurement.","PeriodicalId":189322,"journal":{"name":"2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133720537","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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