Journal of Microelectromechanical Systems最新文献_第9页

Suspended Insulation Structure Design for Infrared Thermal Detector 红外热探测器悬吊式保温结构设计

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-12-09 DOI: 10.1109/JMEMS.2024.3505213

Song Li;Yufei Zhai;Yuxuan Dong;Jianqing Cai;Min Wang

{"title":"Suspended Insulation Structure Design for Infrared Thermal Detector","authors":"Song Li;Yufei Zhai;Yuxuan Dong;Jianqing Cai;Min Wang","doi":"10.1109/JMEMS.2024.3505213","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3505213","url":null,"abstract":"Infrared thermal detectors generate signal output utilizing thermal effect, with detection performance being dictated by the structure design of the detector. To ensure effective thermal insulation, detectors are typically designed with slender supporting beams to reduce thermal conductivity and enhance signal output. In this paper, a fluorescent infrared detector with different isolation beam designs is proposed to investigate the trade-off relationship among detector performance parameters. Two kinds of isolation beams are theoretically derived to minimize the thermal conductivity for specific detection unit, and the thermal detectors with suspending units are manufactured by MEMS technology. The thermal imaging results for a 623 K heat source indicate that the temperature rise for the two-beam structure (i.e. 46.7 K) exceeds that of the four-beam structure (i.e. 38.3 K). Additionally, the detectivity of <inline-formula> <tex-math>$4.05times 10^{mathbf {7}}$ </tex-math></inline-formula> cm<inline-formula> <tex-math>$cdot $ </tex-math></inline-formula>Hz<inline-formula> <tex-math>$^{mathbf {1/2}}$ </tex-math></inline-formula> /W is obtained by the two-beam structure, which is lower than that of the four-beam structure (i.e. <inline-formula> <tex-math>$5.80times 10^{mathbf {7}}$ </tex-math></inline-formula> cm<inline-formula> <tex-math>$cdot $ </tex-math></inline-formula>Hz<inline-formula> <tex-math>$^{mathbf {1/2}}$ </tex-math></inline-formula> /W). The temporal resolution and NETD are also calculated and compared. The findings demonstrate that in designing thermal detectors, deliberately sacrificing a portion of the detectivity within an acceptable range and reducing beam thermal conductivity can significantly enhance temperature rise and increase signal output. [2024-0131]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"92-99"},"PeriodicalIF":2.5,"publicationDate":"2024-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143107189","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Journal of Microelectromechanical Systems Publication Information 微机电系统出版信息学报

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-12-03 DOI: 10.1109/JMEMS.2024.3496135

引用次数: 0

TechRxiv: Share Your Preprint Research With the World! techxiv：与世界分享你的预印本研究！

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-12-03 DOI: 10.1109/JMEMS.2024.3496173

引用次数: 0

A Novel Inline Near-Zero Thermopile RF MEMS Power Sensor 一种新型直列近零热堆射频MEMS功率传感器

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-11-28 DOI: 10.1109/JMEMS.2024.3501477

Zhiqiang Zhang;Runqi Gu;Zijie Yuan;Yuhao Xie;Tao Jiang;Feilong Lei;Chengxi Sun;Jianqiu Huang

{"title":"A Novel Inline Near-Zero Thermopile RF MEMS Power Sensor","authors":"Zhiqiang Zhang;Runqi Gu;Zijie Yuan;Yuhao Xie;Tao Jiang;Feilong Lei;Chengxi Sun;Jianqiu Huang","doi":"10.1109/JMEMS.2024.3501477","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3501477","url":null,"abstract":"This paper presents a novel single-chip integrated inline thermoelectric MEMS sensor for measuring the forward and reverse RF power. The sensor operates on the principle of RF power-heat-electricity. It utilizes all-passive structures for near-zero power consumption, with a wide bandwidth (22-30 GHz), high power detection capability (600 mW) and small chip size (<inline-formula> <tex-math>$1640times 910~mu $ </tex-math></inline-formula>m2). A MEMS coupling structure with suspended beams is designed to be broadband and miniaturized, while two MEMS sensing structures with optimized thermopiles are designed for high sensitivity and high power detection. This MEMS sensor is fabricated using the GaAs monolithic microwave integrated circuit (MMIC) process. Experiments show a reflection loss of less than −10.40 dB, and an insertion loss of better than −1.55 dB. Linearity of 98.8% is obtained. At 26, 27 and 28 GHz, measured sensitivities are about 4.10, 4.57 and 4.61 <inline-formula> <tex-math>$mu $ </tex-math></inline-formula>V/mW for the forward detection, and 0.32, 0.83 and 1.10 <inline-formula> <tex-math>$mu $ </tex-math></inline-formula>V/mW for the reverse detection, respectively. The ratios of these sensitivities produce a maximum at the center frequency of interest. [2024-0095]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"59-64"},"PeriodicalIF":2.5,"publicationDate":"2024-11-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143107181","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Characterization of a Multi-Channel CMUT Gas Sensor 多通道CMUT气体传感器的特性研究

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-11-27 DOI: 10.1109/JMEMS.2024.3495539

Charles Boutonnet;Anurupa Shaw;Jean-Claude Bastien;François Blard;Adrien Vialletelle;Vincent Pinon;Christophe Le Blanc;Cyril Herrier;Thierry Livache;Bruno Fain

{"title":"Characterization of a Multi-Channel CMUT Gas Sensor","authors":"Charles Boutonnet;Anurupa Shaw;Jean-Claude Bastien;François Blard;Adrien Vialletelle;Vincent Pinon;Christophe Le Blanc;Cyril Herrier;Thierry Livache;Bruno Fain","doi":"10.1109/JMEMS.2024.3495539","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3495539","url":null,"abstract":"We report the design, the fabrication and the test of a multi-channel gas sensor based on Capacitive Micro-machined Ultrasonic Transducers (CMUT) functionalized with peptides as sensing material, dedicated to volatile organic compound (VOC) measurements in ambient air. The design, the fabrication and the electrical test of the CMUT device is reported, achieving a mass sensitivity per unit area of <inline-formula> <tex-math>$mathrm {5.9~Hz/(ag/{mu }m^{2})}$ </tex-math></inline-formula>. The corresponding electronics, ensuring self-sustained oscillations of the loops, is described. Experimental characterization of the loops using a Vector Network Analyser (VNA) and associated simulations using Eldo software highlight how the Barkhausen criteria are fulfilled. A gas flow setup is used to expose the sensors to different gases. The three channels of the device reveal different sensitivities to gas, ranging from <inline-formula> <tex-math>$mathrm {0.13~Hz/ppmv}$ </tex-math></inline-formula> to <inline-formula> <tex-math>$mathrm {0.41~Hz/ppmv}$ </tex-math></inline-formula> for nonane. This is attributed to different surface affinities towards nonane, confirming the potential of CMUT devices for electronic noses. [2024-0089]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"4-14"},"PeriodicalIF":2.5,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143106767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Laser-Induced Forward Transfer of SU-8 Microdisks as Carriers of Metallic Microdevices SU-8微盘作为金属微器件载体的激光诱导正向转移

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-11-08 DOI: 10.1109/JMEMS.2024.3487248

Zhiwei Yang;Giovanni Boero;Remo Widmer;Johann Michler;Renato Pero;Juergen Brugger

{"title":"Laser-Induced Forward Transfer of SU-8 Microdisks as Carriers of Metallic Microdevices","authors":"Zhiwei Yang;Giovanni Boero;Remo Widmer;Johann Michler;Renato Pero;Juergen Brugger","doi":"10.1109/JMEMS.2024.3487248","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3487248","url":null,"abstract":"Laser-induced forward transfer (LIFT) is a digital additive manufacturing technique that uses a pulsed laser to transfer various materials from a donor film to a receiver substrate placed in close proximity. In this work, we investigate the transfer of SU-8 microdisks on which metallic microdevices have been patterned. These components are directly fabricated on the donor substrate and their performance was evaluated after the transfer by LIFT. The influence of laser fluence, SU-8 thickness and donor-to-receiver gap on the SU-8 microdisk transfer was investigated. Successful and damage-free transfer of SU-8 microdisks can be achieved with optimized parameter combinations. The adhesion between the transferred SU-8 microdisks and different receivers was also assessed. These tests indicate that the adhesion without additional glue between SU-8 and the receiver is adequate for standard applications. The assembly of SU-8 microdisks to form multi-layer structures was also demonstrated. Large-scale transfer of a <inline-formula> <tex-math>$40times 40$ </tex-math></inline-formula> SU-8 microdisk array within 20 minutes was achieved to assess the transfer scalability of the LIFT process. As an application example, we transferred a temperature sensor onto a receiver with pre-patterned contact electrodes and characterized its performance. Our work opens a route to directly manufacturing wafer-scale microdevices on the donor substrate and enables the heterogeneous integration of such devices onto numerous functional surfaces with deterministic distribution and scale.[2024-0134]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"32-42"},"PeriodicalIF":2.5,"publicationDate":"2024-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10747758","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143106766","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

System Packaged Cu@CuxO Micro Supercapacitor With Large Capacity for Ultra-Compact Power Module Application 系统封装Cu@CuxO用于超紧凑型电源模块应用的大容量微型超级电容器

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-11-05 DOI: 10.1109/JMEMS.2024.3485876

Jianyou Dai;Jiyong Zhou;Zhanpeng Shi;Zhangshanhao Li;Minghao Xu;Siyao Jiang;Dongping Zheng;Lei Shan;Xiaohong Wang;Sixing Xu

{"title":"System Packaged Cu@CuxO Micro Supercapacitor With Large Capacity for Ultra-Compact Power Module Application","authors":"Jianyou Dai;Jiyong Zhou;Zhanpeng Shi;Zhangshanhao Li;Minghao Xu;Siyao Jiang;Dongping Zheng;Lei Shan;Xiaohong Wang;Sixing Xu","doi":"10.1109/JMEMS.2024.3485876","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3485876","url":null,"abstract":"The on-chip micro supercapacitor (MSC), renowned for its exceptional capacitance and power density, holds great potential in compactifying micro systems by replacing bulky dielectric capacitors. However, traditional electrochemical materials and fabrication methods of MSC are incompatible with standard IC processes, posing a significant obstacle to its widespread application. In this paper, we report a novel strategy for fabricating an IC-compatible MSC with ultrahigh capacitance density on wafer-level. Specifically, we design a mesoporous Cu@CuxO material for MSC electrode, in which Cu is a common IC interconnection material with low cost and high conductivity, while CuxO covers Cu to provide large electrochemical capacity. This material is prepared by using standard co-sputtering, selective etching and in-situ oxidation processes sequentially. Subsequently, it is employed to construct high aspect ratio interdigital electrode (nearly <inline-formula> <tex-math>$20~mu $ </tex-math></inline-formula>m thickness) using developed ultra-thick peeling off technology. As a result, the MSC exhibits a superior capacitance density of 35.58 mF/cm2, surpassing commercial dielectric capacitors by 2 orders of magnitude. Furthermore, we propose a unique MSC packaging method based on 3D printing, which includes specially designed microchannels for liquid electrolyte injection and microgrooves for IC chip integration. This packaging method facilitates the integration of MSC with a power management integrated chip (PMIC), forming a System-in-Packaged (SiP) power module. This module, with dimensions of only <inline-formula> <tex-math>$3.2times 2.7times 1$ </tex-math></inline-formula> mm3, successfully manages the output of a triboelectric nanogenerator, demonstrating its practical application and vast potential.[2024-0073]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"24-31"},"PeriodicalIF":2.5,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143106765","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Disposable Piezoresistive MEMS Airflow Sensor for Chronic Respiratory Disease Detection 用于慢性呼吸系统疾病检测的一次性压阻式MEMS气流传感器

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-31 DOI: 10.1109/JMEMS.2024.3484226

Beril Aygül;Sena Ulgaz;Berkay Yılmaz;Ömer Gökalp Akcan;Kuter Erdil;Yiğit Dağhan Gökdel

{"title":"Disposable Piezoresistive MEMS Airflow Sensor for Chronic Respiratory Disease Detection","authors":"Beril Aygül;Sena Ulgaz;Berkay Yılmaz;Ömer Gökalp Akcan;Kuter Erdil;Yiğit Dağhan Gökdel","doi":"10.1109/JMEMS.2024.3484226","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3484226","url":null,"abstract":"This paper details the design, fabrication, and characterization of a novel disposable MEMS airflow sensor, employing Bare Conductive electric paint deposited on Whatman 3MM chromatography paper through silk screen printing. The sensor achieves rapid fabrication within 30 minutes. It demonstrates a sensitivity of 1.8 kPa−1, a resolution of 27.6 kPa, and a limit of detection (LoD) of 48.94 kPa, with an operational pressure range from 27.6 to 137.9 kPa. An electronic readout circuit transduces electrical resistance variations into voltage signals, which are monitored via a digital multimeter and analyzed on a PC. The sensor’s disposable nature mitigates nosocomial infection risks and enhances hygiene, making it ideal for monitoring respiratory conditions such as asthma and COPD. With a material cost of under <inline-formula> <tex-math>${$}0.1$ </tex-math></inline-formula>, the sensor is highly suitable for scalable, cost-sensitive biomedical applications. Experimental validation confirms the reliability and precision of this proof-of-concept device in airflow measurement. [2024-0148]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"100-107"},"PeriodicalIF":2.5,"publicationDate":"2024-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143107139","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Fused Silica Micro Shell Resonators by a Wafer-Level Thermal Reflow Process 基于晶圆级热回流工艺的熔融二氧化硅微壳谐振器

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-22 DOI: 10.1109/JMEMS.2024.3478842

Zhaoxi Su;Bin Luo;Linqian Zhu;Zelin Xu;Haoyang Li;Jintang Shang

引用次数: 0

Lateral Glow Discharge Ion Source for the Integrated MEMS Quadrupole Mass Spectrometer 集成MEMS四极杆质谱仪的侧向辉光放电离子源

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-22 DOI: 10.1109/JMEMS.2024.3477620

Piotr Szyszka

引用次数: 0